List of Semiconductor inspection/test equipment products

  • classification:Semiconductor inspection/test equipment

451~495 item / All 673 items

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Electromagnetic scanner type (patented) allows for damage-free and non-destructive measurements at a low cost. It has functions equivalent to expensive AFM.

  • Semiconductor inspection/test equipment

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It is a high-voltage power supply for TFE electron guns!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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TFE electron gun, high-voltage power supply device "FE503XP" for electron beam lithography!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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This is the high-voltage power supply unit 'IB303XS' for FIB ion guns, which also helps shorten the development period!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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This is the "IB303XP," a high-voltage power supply for FIB ion guns that also helps shorten the development period!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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This is the drive power supply 'XE303XP' exclusively for soft X-ray tubes using a thermal FE emitter!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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It is a high-precision high-voltage power supply device for TFE electron guns!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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It is the high-voltage power supply unit "FE103XP" for CD-SEM and review SEM!

  • Semiconductor inspection/test equipment
  • Electron beam lithography equipment
  • Other processing machines

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Up to 3 earthquake monitoring devices can be connected.

  • Other machine tools
  • Semiconductor inspection/test equipment
  • Metal bearings

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Achieving a flatness accuracy of 0.001mm or less (for φ12 inches).

  • Semiconductor inspection/test equipment
  • Wafer processing/polishing equipment
  • Processing Jig

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The second installment of the TDC introduction video has been completed!

The introduction video part 2 of TDC has been completed. This time, it features an introduction to management by our president, Akabane. It's a short movie of about one minute, so please take a look. You can watch the video from the "Related Information" section below. Title: TDC Management Now, we are exhibiting at "Nanotech 2018," which is being held at Tokyo Big Sight starting today. We are showcasing not only mirror samples of various materials but also finely crafted precision parts and inner diameter mirror products created through lap polishing. Additionally, we have mirror plates of size 400 and large rolls of about one meter, so please take this opportunity to check them out. Since today is Valentine's Day, we will be providing coffee and chocolate for three days. Feel free to stop by. <Exhibitors> 2/14 (Wed): President, Fujino, Arisa 2/15 (Thu): President, Fujino, Maeda 2/16 (Fri): President, Fujino, Arisa, Maeda ★ Technical meetings are also possible ★ All of our staff are looking forward to your visit.

SiC semiconductor evaluation device using photoluminescence (PL) imaging method

  • Semiconductor inspection/test equipment

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This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This machine is a device for measuring the thickness of φ8” silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This machine is a device that performs macro and micro inspections of φ8-inch wafers in the semiconductor manufacturing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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We provide high-quality layout design! High-performance package-specific automatic wiring tool.

  • Semiconductor inspection/test equipment

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It is a device for drying wafers that have been stripped and cleaned.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a semi-automatic device for visual inspection of 8-inch silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a fixture for visual inspection of the front and back surfaces of the quartz mask.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for visual inspection and thickness measurement of 8-inch silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device that performs macro inspection of wafers and micro inspection using a microscope.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for surface inspection of wafers after polishing.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for visually inspecting the edges of φ300 mm silicon wafers (chip and chipping inspection).

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Pass/Fail Judgment Device

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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A device capable of performing three types of operations.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for drying 300mm wafers that have been cleaned after double-sided polishing.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for simple cleaning (brush + water) of φ300 mm silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Loading and unloading of φ150 mm and φ125 mm silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for storing φ300 mm wafers, which have completed processing, one by one into a Teflon cassette for submersion.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device that loads wafers one by one.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used for handling to perform P/N determination and visual inspection of silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device for inverting and transferring silicon wafers.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Classified by resistivity and thickness categories.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device that detects the edge of a wafer and measures its diameter through image processing.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement of various types of wafers below φ4"

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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