List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
601～615 item / All 1031 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
![[Processing Example] Half Cut](https://image.mono.ipros.com/public/product/image/4e8/2000592245/IPROS45800580001709181188.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
![[Processing Example] Groove Cutting](https://image.mono.ipros.com/public/product/image/367/2000592246/IPROS06668770372251505854.png?w=280&h=280){kind=small}
Dicing that can cut various materials with high precision!
- Fine Ceramics
- Wafer processing/polishing equipment
- Contract manufacturing
We can accommodate metal materials such as copper, high-tensile steel, aluminum copper, and magnesium! We will respond to your requests with various shapes, including uneven shapes.
- Other machine tools
- Wafer processing/polishing equipment
Adopts a compact tabletop design! It can be done in a clean environment without dust scattering.
- Wafer processing/polishing equipment
Compatible with everything from fine abrasives to coarse ones! The main body is made of rigid PVC, so it won't rust.
- Wafer processing/polishing equipment
A non-woven fabric-based polishing pad that responds well to various applications.
- Other abrasives
- Wafer processing/polishing equipment
- Hand polishing and filing
[Technical Information] Groove Processing of CMP Polishing Pads 2
Last time, we explained how the groove processing on the surface of polishing pads affects the diffusion of slurry. Here, we will introduce examples that visually verify the diffusion effect of slurry due to grooves. We prepared six different types of groove processing as samples on the polishing pad "IC1000," which has become the de facto standard for semiconductor use. - Circular Groove - Perforated Groove - Radial Groove - Spiral Groove - XY Groove - Arc Groove When a blue-colored liquid is dripped under the same conditions, it becomes clear that the diffusion of the liquid varies depending on the groove processing. It can be confirmed that the circular grooves and spiral grooves have high slurry retention, while the radial grooves and arc grooves excel in slurry discharge. Thus, even with the same polishing pad, the diffusion of slurry differs due to groove processing, which affects the action of slurry intervening with the workpieces such as wafers. Therefore, the selection of groove processing is very important. Our company can assist you in selecting groove processing while considering your process conditions and targets, so please feel free to consult with us.
Before cutting is the key factor. We focus on specification confirmation, proposal of construction methods, process and jig design, tool selection, program creation, and machining simulation.
- Wafer processing/polishing equipment
- Stepper
- Semiconductor inspection/test equipment
We can perform excavations up to a maximum diameter of 1000 mm and a depth of 600 mm. We are committed to providing products that prioritize not only precision but also aesthetics.
- Stepper
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
Achieve high processing quality, very short setup times, and excellent productivity!
- Other processing machines
- Other machine tools
- Wafer processing/polishing equipment
We will process SiC and GaN substrates using the CARE method!
- Wafer processing/polishing equipment
- Processing Contract
A consistent system up to the polishing finish! At Gotou Welding, we produce prototypes starting from just one piece.
- Processing Contract
- Contract manufacturing
- Wafer processing/polishing equipment
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
- Wafer processing/polishing equipment
- Other abrasives
- Circuit board processing machine
This is a device designed for the bonding process of wafers and adhesive plates (ceramic plates).
- Wafer processing/polishing equipment
- Other abrasives
- Circuit board processing machine
We specialize in flat grinding processes, focusing on surface grinding and rotary grinding.
- Processing Contract
- Wafer processing/polishing equipment
- aluminum
The grinding wheel rotates under proven grinding conditions! It is polished with high precision and sharpness, allowing for fine printing.
- Wafer processing/polishing equipment