List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
361～405 item / All 1014 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Customizable high-speed finishing machine compatible with fully automated processes.
- Other machine tools
- Wafer processing/polishing equipment
We will exhibit at Monozukuri World Tokyo 2025.
At the Monozukuri World Tokyo 2025, we will introduce the functions and performance of the following products through monitor videos and sample displays. - Holroyd's "HG500 Helical Profile Grinding Machine" from the UK - TEK4's "High-Speed EDM Drill Machine, Multi-Hole EDM Machine, Laser Drill Processing" from the UK - Junker's "High-Speed, High-Precision, Flexible Grinding Machine" from Germany - ARBURG's "Resin Pellet 3D Printer" from Germany - innovatiQ's "Resin 3D Printer" from Germany - Sturm's "Brake Disc Coating System" from Germany - OTEC's "High-Precision Polishing Device" from Germany - MACHROTEC's "Carbon Fiber Reinforced Plastic Body (CFRP) Grinding Wheel" from Austria - VICIVISION's "Optical Shaft Shape Measuring Machine" from Italy Event Dates: July 9 (Wednesday) to July 11 (Friday), 2025 Venue: Makuhari Messe Booth Number: Hall 7: 42-56 Opening Hours: 10:00 AM to 5:00 PM We look forward to your visit!
With the wet zero-gap system, barrel polishing is possible without deformation even for extremely small and thin workpieces, such as those with a thickness of 0.1mm!
- Other machine tools
- Wafer processing/polishing equipment
Introducing a non-dust-collecting sander with a pad size of φ125mm for pre-painting surface preparation work!
- Wafer processing/polishing equipment
The cross-section of electronic components is simple and finishes beautifully!!
- Wafer processing/polishing equipment
- Other abrasives
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Interlock covers are also available! We have achieved further efficiency in polishing operations.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.
- Wafer processing/polishing equipment
- Other processing machines
High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.
- Wafer processing/polishing equipment
- Other processing machines
We offer a wide range of products, including vacuum chuck holders and adhesive holders!
- Wafer processing/polishing equipment
- Other processing machines
- Other machine elements
High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.
- Wafer processing/polishing equipment
We will introduce a wide variety of grinding wheels, from fixed abrasive wheels to free abrasive wheels and polishing cloths.
- CMP Equipment
- Wafer processing/polishing equipment
- Other processing machines
More economical than manually spraying diamond liquid onto the grinding wheel! Introducing the automatic spraying device.
- Wafer processing/polishing equipment
- Other processing machines
- Other physicochemical equipment
There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!
- Wafer processing/polishing equipment
- Other processing machines
Samples for cross-sectional observation can be created precisely and easily! There is no need to touch or hold the samples directly by hand.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.
With wrapping processing technology, high-precision finishing is possible. It has low polishing drive power and features an energy-saving design that also considers the environment. [Exhibited at the ...
- Processing Contract
- Wafer processing/polishing equipment
- Other machine tools
Starting from January 23, it will be featured in a precision machining special!
If you are experiencing issues such as "the grinding machine cannot achieve flatness" or "the surface roughness cannot be cleared," please contact us directly. 【Features of Lapping Processing】 ○ Wet processing minimizes thermal distortion to the workpiece, resulting in less machining distortion. ○ Since the workpiece is processed without being chucked, it is less likely to introduce machining stress, leading to minimal changes in precision over time after processing. ○ Flatness that could not be achieved through turning, machining, or grinding can be attained with lapping processing. ○ By performing lapping on the reference surface before precision finishing processes (grinding, machining), high-performance finishing can be achieved.
We will introduce a case study of a customer who is facing the issue of grinding processing delivery times taking over a month!
- Wafer processing/polishing equipment
[Grinding Processing Case Studies] Grinding of carbide cutters from other companies and overseas is also possible.
We would like to introduce a case study that addresses the concerns of customers who are experiencing delivery times of over a month for grinding processing. ■Concern In previous transactions, when requesting grinding processing, the delivery time took over a month, and in urgent situations, it was not possible to meet deadlines, necessitating the maintenance of a larger inventory. Even then, when it was still not possible to meet deadlines, the only option was to stop the production line, which was problematic. ■Proposal Shortening the delivery time for grinding processing. ■Result Three days after sending the urgent grinding processing request, we were able to receive the items back, allowing us to quickly restore the halted production line. The inventory also improved to the minimum necessary quantity, making management easier. ■Case Summary - Issue: Delivery times were over a month, and when deadlines were missed, it was necessary to stop the production line. - Key points of the proposed service: Quick response tailored to the customer's needs.
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It is possible to uniformly grind large quantities of workpieces up to 1000mm wide! It excels in R chamfering processing.
- Other processing machines
- Wafer processing/polishing equipment
Automating polishing operations with robots. By combining a 3D camera and automatic path generation software, let the robot handle the polishing tasks!
- Wafer processing/polishing equipment
Exhibition at Cobot Expo Japan hosted by Universal Robots.
We plan to mainly exhibit a presentation of Nordbo products at the online exhibition "Cobot Expo Japan Autumn" hosted by Universal Robots.
Buff polishing of the inner surface of pipes is also possible! With our unique polishing machine and years of experience, we can appropriately respond to niche needs.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
Uniformly polish a large number of fine parts at once! Adopted in various fields such as precision components and kitchen equipment.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
A 12-inch compatible wafer expander using a motor drive system. Support for up to 8 inches is also available.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
An air cylinder is used for driving the extension stage. The simple design achieves maintenance-free operation.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
Introduction of the vacuum film application device! It solves the problem of damage caused by rollers.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Semi-automatic tabletop type wafer mounter for up to 8 inches.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Manual wafer mount for pre-cut tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Auto-lamination without bubbles under preset pasting conditions.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
A device that can accommodate both pre-cut tape and normal tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
A wide variety of diamond files, whetstones, and ceramic sharpening tools are featured!
- Hand polishing and filing
- Wafer processing/polishing equipment
- Other abrasives
Starting with research and development, a wide range of equipment selection is possible according to the purpose, up to semi-production applications.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
It is possible to perform uniform UV irradiation over the entire area of the wafer by rotating the work while irradiating.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Ultraviolet irradiation equipment
Double ring structure with inner ring and outer ring to maintain an expanded state.
- Wafer processing/polishing equipment
- Other machine elements
- Other semiconductor manufacturing equipment
Long lifespan with LED light source! Emits ultraviolet (UV) light at a wavelength of 365nm.
- Ultraviolet irradiation equipment
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
SEMICON TAIWAN 2012 (September 5 - September 7) Participation Confirmed
The fully automatic model of the UV curing device (UVC-300A) featuring next-generation technology that achieves energy savings and long lifespan will make its debut at an overseas exhibition, thanks to the cooperation of our distributors! In order to respond to the achievements and feedback received domestically, we must also reach out to international markets, which is why we will be exhibiting at "Semicon Taiwan 2012" to be held in September 2012. During the exhibition period, we will operate the device, so if you bring samples, we can conduct tests on the spot! Please come and see the capabilities of our LED light source UV irradiation technology at the venue!
It demonstrates sufficient curing performance (cured state, curing speed) compared to high-pressure mercury lamps and metal halide light sources.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Ultraviolet irradiation equipment
SEMICON TAIWAN 2012 (September 5 - September 7) Participation Confirmed
The fully automatic model of the UV curing device (UVC-300A) featuring next-generation technology that achieves energy savings and long lifespan will make its debut at an overseas exhibition, thanks to the cooperation of our distributors! In order to respond to the achievements and feedback received domestically, we must also reach out to international markets, which is why we will be exhibiting at "Semicon Taiwan 2012" to be held in September 2012. During the exhibition period, we will operate the device, so if you bring samples, we can conduct tests on the spot! Please come and see the capabilities of our LED light source UV irradiation technology at the venue!
A cleaning device designed for the precision cleaning of wafer cassettes, carriers, boxes, and other items used in the manufacturing process of high-end, high-value-added products.
- Other cleaning machines
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
A comprehensive lineup of particle sizes that can handle everything from "rough polishing" to "finishing" with blast processing! Automatic polishing is also possible. *Demo machine available.
- Wafer processing/polishing equipment
High-quality film polishing material ideal for mirror polishing, with a proven track record in precision polishing of automotive parts and optical fibers, produced safely and securely in Japan! Automa...
- Wafer processing/polishing equipment
Achieve energy savings and cost reduction with automatic polishing for long metal items and complex shapes, as well as polishing and fine burr removal to improve work efficiency! Demo machines availab...
- Wafer processing/polishing equipment
Achieve all materials from rough polishing to finishing polishing! Automatic polishing machines can also be customized to suit your needs!
- Wafer processing/polishing equipment
From grinding to painting! Primarily focusing on sheet metal, we accommodate various processes such as feather cloth, painting, and plating.
- Wafer processing/polishing equipment
A simple and effective hand tool to enhance the flexibility of FANUC collaborative robots CRX!
- Other industrial robots
- Wafer processing/polishing equipment
- Sensors
We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.
- Processing Contract
- Wafer processing/polishing equipment
Introducing a single-axis dicing saw with a maximum size of 9 inches by 12 inches and two configurations!
- Plastic processing machines (cutting and rolling)
- Other processing machines
- Wafer processing/polishing equipment