List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
136~180 item / All 1012 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Flange for dicing saw "Blade Holder"
- Wafer processing/polishing equipment
- Diamond cutter
- cutter
We propose rationalization equipment for steel and processing factories, such as ultra-hard circular saw cutting machines!
- Other processing machines
- Wafer processing/polishing equipment
- others
Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.
- Wafer processing/polishing equipment
Observation of tracking camera cross-section by mechanical grinding.
I would like to introduce "Cross-sectional observation of tracking camera using mechanical polishing." Regarding the structure of the tracking camera components, when viewed from above, the lens can be identified. Although it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is similar to that of an RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode.
Introduction of "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors"! We can accommodate everything from small lots to customized orders.
- Wafer
- Wafer processing/polishing equipment
- Processing Contract
We accept several prototype processes without any issues, and we are well-known for our very flexible response, from mask design to cross-sectional dimension measurement.
- Wafer
- Wafer processing/polishing equipment
- Processing Contract
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
- Wafer processing/polishing equipment
Nishida Machine Works' steel ball grinding machine that realizes a production environment tailored to conditions and objectives.
- Wafer processing/polishing equipment
By undertaking all processes, the confidentiality of production technology is guaranteed!
- Wafer processing/polishing equipment
- Welding Machine
- Other processing machines
Resin products optimized for chemical solutions and corrosive environments. Contributing to the longevity of chemical plant equipment.
- Wafer processing/polishing equipment
We also accommodate grinding and polishing finishes! We have both large and small honing machines available.
- Processing Contract
- Wafer processing/polishing equipment
We have a non-electrolytic nickel plating bath, as well as blackening treatment baths and film thickness measuring instruments.
- Wafer processing/polishing equipment
- Coating thickness gauge
- Special Processing Machinery
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
- Wafer processing/polishing equipment
- Wafer
It falls smoothly even with a slight slope! Measures against clogging, bridging, residue, and foreign matter contamination.
- Wafer processing/polishing equipment
- Other surface treatment equipment
- Surface treatment contract service
For polishing various substrates and for fine burr removal in punched areas.
- Other machine tools
- Wafer processing/polishing equipment
- Special Processing Machinery
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...
- Wafer processing/polishing equipment
You can achieve the desired surface accuracy with a simple operation to replace the polishing film!
- Wafer processing/polishing equipment
No need for an inversion device to clean the LCD substrate on both sides simultaneously!
- Wafer processing/polishing equipment
- Circuit board processing machine
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
- Other processing machines
- Wafer processing/polishing equipment
A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!
- Other processing machines
- Wafer processing/polishing equipment
Achieve precision that is unstable by hand, and definitely improve yield! Easily portable tabletop model.
- Other processing machines
- Wafer processing/polishing equipment
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
- Other processing machines
- Wafer processing/polishing equipment
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
The brush mechanism allows for the removal of burrs and chips generated during cutting.
- Other processing machines
- Wafer processing/polishing equipment
We propose our polishing equipment to address the concerns of automotive parts manufacturers.
- Wafer processing/polishing equipment
- Other abrasives
Inner diameter grinding device renewal
We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!
Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...
- Wafer processing/polishing equipment
- Other abrasives
Solving the concerns of electronic device manufacturers! We propose our polishing equipment.
- Other surface treatment equipment
- Wafer processing/polishing equipment
- Other abrasives
Solving various companies' problems! Introducing it clearly with comparisons to other training programs!
- Wafer processing/polishing equipment
- Other abrasives
- Other surface treatment equipment
Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.
- Other machine tools
- Wafer processing/polishing equipment
Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.
- Wafer processing/polishing equipment
- Flat/Shaped/Vertical Cutting Machine
- Processing Contract
Solving issues of labor shortages and technology transfer! An explanation of the purpose and features of Sanshin's equipment.
- Wafer processing/polishing equipment
A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Maximizing the features of the wrapping tape makes the intended polishing easy.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]
- Wafer processing/polishing equipment
- Engine parts
- lathe
Unlike hand grinding, this grinding unit is not affected by the operator's level of experience!
- Wafer processing/polishing equipment
Can be processed under suitable conditions! Even beginners can operate it easily.
- Other processing machines
- Wafer processing/polishing equipment
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
- Other processing machines
- Wafer processing/polishing equipment
Needle valves, for automotive small parts! Introducing the burr removal and outer diameter tape wrapping device!
- Other processing machines
- Wafer processing/polishing equipment
We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!
- Wafer processing/polishing equipment
- Other abrasives
We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a co...
- Wafer processing/polishing equipment
- Other abrasives
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
Free gift: 'Handbook of Basic Knowledge on Wrapping & Polishing'!
- Wafer processing/polishing equipment
We will exhibit at the Fukuoka Monozukuri Fair 2016 (October 26-28, 2016).
Nippon Engis will be exhibiting at the "Monozukuri Fair 2016" held at Marine Messe Fukuoka from Wednesday, October 26 to Friday, October 28. If you would like an invitation, please contact us. <Exhibited Products> Small Lapping Machine Abrasives Lapping Process Samples We understand that you are busy, but we sincerely look forward to your visit.