List of Bonding Equipment products
- classification：Bonding Equipment
121～135 item / All 149 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
- Bonding Equipment
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as we...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
Pen-shaped atmospheric pressure plasma device! Surface modification ¥348,000-
A low-temperature, non-charge-damage atmospheric pressure plasma device that excels in surface modification, cleaning, hydrophilic treatment, and adhesion enhancement! Perfect for fine processing and spot treatment! This pen-type atmospheric pressure plasma device operates at low temperatures without charge damage!! It enables environmentally friendly surface treatment through dry cleaning without solvents♪ Utilizing the high reactivity of plasma, it addresses issues such as enhancing adhesion and bonding to various materials like resin, metal, glass, and fiber, improving hydrophilicity, and removing organic substances! While high-priced plasma devices have been mainstream, the pen-type atmospheric pressure plasma device achieves excellent cost performance by focusing on essential functions. Additionally, by using only nitrogen gas for plasma generation without He or Ar, running costs are significantly reduced! Please check the treatment effects with a free demonstration first. *For treatment videos, search on YOUTUBE for "pen-type atmospheric pressure plasma device."
This is the world's first product to generate atmospheric pressure plasma on a surface.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
Three times the brightness. Achieving both compactness and high luminosity!
- Visual Inspection Equipment
- Bonding Equipment
- Lighting for image processing
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
- Other heaters
- Heating device
- Bonding Equipment
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
- Other heaters
- Heating device
- Bonding Equipment
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
- Bonding Equipment
- Contract manufacturing
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
- Bonding Equipment
- Other semiconductor manufacturing equipment
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
- Bonding Equipment
- Other semiconductor manufacturing equipment