List of Bonding Equipment products

It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

The M17 series is capable of providing flexible and highly reliable solutions for various bonding challenges.

• Bonding Equipment

Flexible bonding function! With Y and Z motor drive, it offers easy operability.

• Bonding Equipment

Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.

• Bonding Equipment

From research and development to production! We demonstrate high quality and high versatility.

• Bonding Equipment

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

• Bonding Equipment
• Other semiconductor manufacturing equipment

MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.

• Bonding Equipment
• Other consumables
• Other semiconductors

A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.

• Bonding Equipment
• Mounter
• Other assembly machines

A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!

• Bonding Equipment

We offer a diverse lineup including bonding press machines and laminating machines!

• Other processing machines
• Printing Machinery
• Bonding Equipment

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

• Bonding Equipment

Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.

• Other processing machines
• Bonding Equipment

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

• Wafer processing/polishing equipment
• Bonding Equipment

This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.

• Other semiconductors
• Bonding Equipment
• PCB terminal blocks

Achieving stable dispensing of two-component adhesive!

• Other processing machines
• glue
• Bonding Equipment