List of Bonding Equipment products
- classification：Bonding Equipment
46～90 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...
- Other semiconductor manufacturing equipment
- Bonding Equipment
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
- Other semiconductor manufacturing equipment
- Bonding Equipment
We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Flexibly respond to the manufacturer's discontinuation of bonding products.
- Bonding Equipment
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
- Bonding Equipment
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
- Bonding Equipment
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
- Reflow Equipment
- Evaporation Equipment
- Bonding Equipment
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
- Bonding Equipment
Responding to the challenges of assembly!
- Bonding Equipment
- Other services
Easy operation! Results such as wire trajectories are displayed visually!
- Bonding Equipment
Supporting the ever-evolving semiconductor applications!
- Other semiconductor manufacturing equipment
- Bonding Equipment
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
- Bonding Equipment
You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!
- dispenser
- Bonding Equipment
A device that performs a series of processes from slit coating to vacuum lamination.
- Other assembly machines
- Bonding Equipment
Supports high-precision stacked packages such as NAND flash.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Other semiconductors
- Bonding Equipment
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
- Bonding Equipment
Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
- Other processing machines
- Bonding Equipment
A controllable current transducer and frequency that continuously monitors wire deformation.
- Bonding Equipment
Adoption of a central control system! Automatic calibration updates.
- Bonding Equipment
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
- Bonding Equipment
Expansion of productivity! The large work area allows for batch processing of multiple devices.
- Bonding Equipment
Wide work area! Built-in non-destructive testing pull test function for wires and ribbons.
- Bonding Equipment
![[Use Case] High-precision assembly ...](https://image.mono.ipros.com/public/product/image/5d6/2000271184/IPROS39638211286867507203.png?w=280&h=280){kind=small}
Achieved an optical resolution of 0.7µm!
- Bonding Equipment
![[Use Case] Implementation and Packa...](https://image.mono.ipros.com/public/product/image/139/2000315616/IPROS34810265186253461388.png?w=280&h=280){kind=small}
From prototype development to mass production! Ensuring high yield with manufacturing technology.
- Bonding Equipment
- others
![[Use Case] High-Precision Die Bonde...](https://image.mono.ipros.com/public/product/image/5e6/2000270614/IPROS22137770162123637982.png?w=280&h=280){kind=small}
Multiple processes with a single device! Bonding position accuracy of 0.5µm!
- Bonding Equipment
![[Application Example] 3D Mounting w...](https://image.mono.ipros.com/public/product/image/fd1/2000239449/IPROS98690127332254769852.png?w=280&h=280){kind=small}
Submicron positional accuracy! High bonding load up to 1000N!
- Bonding Equipment
![[Application Example] Implementatio...](https://image.mono.ipros.com/public/product/image/6f4/2000239395/IPROS03001692673784456856.png?w=280&h=280){kind=small}
Bonding position accuracy of 0.5µm!
- Bonding Equipment
A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.
- dispenser
- Bonding Equipment
It is a mass production device for optical bonding using OCR.
- Bonding Equipment
It is a mass production device for optical bonding using OCR.
- Bonding Equipment
Precision parts processing / stainless steel processing / SUS processed products
- CMP Equipment
- Photomask
- Bonding Equipment
We accept mass production operations tailored to customer requests and specifications, such as high-quality products!
- Other contract services
- Bonding Equipment
- Soldering Equipment
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
- Other contract services
- Bonding Equipment
- Soldering Equipment
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
For fine lines and thick lines! Easy operability based on ergonomic mobile user panels.
- Bonding Equipment
Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.
- Bonding Equipment
The M17 series is capable of providing flexible and highly reliable solutions for various bonding challenges.
- Bonding Equipment
Flexible bonding function! With Y and Z motor drive, it offers easy operability.
- Bonding Equipment
Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.
- Bonding Equipment