List of Bonding Equipment products
- classification：Bonding Equipment
46～90 item / All 173 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
- Bonding Equipment
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
- Bonding Equipment
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
- Bonding Equipment
- Other mounting machines
- Other contract services
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
- Bonding Equipment
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
- Bonding Equipment
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
- Bonding Equipment
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
- Bonding Equipment
ASMPT is a backend equipment manufacturer based in Singapore.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
- Bonding Equipment
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
- Bonding Equipment
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
- Bonding Equipment
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
- Bonding Equipment
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
- Bonding Equipment
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
- Bonding Equipment
Anode bonding support device
- Semiconductor inspection/test equipment
- Bonding Equipment
Multi-Wafer Handling Die Bonder (Auto)
- Bonding Equipment
Eagle AERO is a high-throughput wire bonding device.
- Bonding Equipment
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
- Bonding Equipment
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
- Bonding Equipment
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
- Bonding Equipment
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
- Bonding Equipment
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
- Bonding Equipment
Achieving stable tension force using a unique ceramic nozzle.
- Bonding Equipment
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
- Bonding Equipment
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
- Bonding Equipment
- Other semiconductor manufacturing equipment
It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...
- Other semiconductor manufacturing equipment
- Bonding Equipment
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
- Other semiconductor manufacturing equipment
- Bonding Equipment
We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Flexibly respond to the manufacturer's discontinuation of bonding products.
- Bonding Equipment
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine