List of Bonding Equipment products
- classification：Bonding Equipment
46～90 item / All 149 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
- Bonding Equipment
Anode bonding support device
- Semiconductor inspection/test equipment
- Bonding Equipment
Multi-Wafer Handling Die Bonder (Auto)
- Bonding Equipment
Eagle AERO is a high-throughput wire bonding device.
- Bonding Equipment
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
- Bonding Equipment
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
- Bonding Equipment
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
- Bonding Equipment
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
- Bonding Equipment
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
- Bonding Equipment
Achieving stable tension force using a unique ceramic nozzle.
- Bonding Equipment
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
- Bonding Equipment
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
- Bonding Equipment
- Other semiconductor manufacturing equipment
It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...
- Other semiconductor manufacturing equipment
- Bonding Equipment
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
- Other semiconductor manufacturing equipment
- Bonding Equipment
We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Flexibly respond to the manufacturer's discontinuation of bonding products.
- Bonding Equipment
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
- Bonding Equipment
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
- Bonding Equipment
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
- Reflow Equipment
- Evaporation Equipment
- Bonding Equipment
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
- Bonding Equipment
Responding to the challenges of assembly!
- Bonding Equipment
- Other services
Easy operation! Results such as wire trajectories are displayed visually!
- Bonding Equipment
Supporting the ever-evolving semiconductor applications!
- Other semiconductor manufacturing equipment
- Bonding Equipment
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
- Bonding Equipment
You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!
- dispenser
- Bonding Equipment
A device that performs a series of processes from slit coating to vacuum lamination.
- Other assembly machines
- Bonding Equipment
Supports high-precision stacked packages such as NAND flash.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Other semiconductors
- Bonding Equipment
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
- Bonding Equipment
Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.
- Other processing machines
- Bonding Equipment
A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.
- dispenser
- Bonding Equipment
It is a mass production device for optical bonding using OCR.
- Bonding Equipment