List of Other semiconductor manufacturing equipment products
- classification:Other semiconductor manufacturing equipment
1396~1440 item / All 1945 items
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- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
It is a device for drying wafers that have been stripped and cleaned.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device for cleaning wafers that are epoxy bonded to a glass plate.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Other industrial robots
It is a semi-automatic device for visual inspection of 8-inch silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a fixture for visual inspection of the front and back surfaces of the quartz mask.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device for visual inspection and thickness measurement of 8-inch silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device that performs macro inspection of wafers and micro inspection using a microscope.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device for surface inspection of wafers after polishing.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Two-dimensional code reading device
- Other semiconductor manufacturing equipment
- Other semiconductor manufacturing equipment
This is a device for visually inspecting the edges of φ300 mm silicon wafers (chip and chipping inspection).
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Pass/Fail Judgment Device
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Manual device equipped with a safety cover and remote control mechanism.
- Other semiconductor manufacturing equipment
- Other processing machines
This is a device for heating φ300mm bonded wafers using an IR lamp.
- Other semiconductor manufacturing equipment
Bulk cassette to cassette transfer
- Other semiconductor manufacturing equipment
A device capable of performing three types of operations.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device for drying 300mm wafers that have been cleaned after double-sided polishing.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device for simple cleaning (brush + water) of φ300 mm silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Loading and unloading of φ150 mm and φ125 mm silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device for storing φ300 mm wafers, which have completed processing, one by one into a Teflon cassette for submersion.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device that loads wafers one by one.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device used for handling to perform P/N determination and visual inspection of silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device for inverting and transferring silicon wafers.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Classified by resistivity and thickness categories.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device that detects the edge of a wafer and measures its diameter through image processing.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Thickness measurement of various types of wafers below φ4"
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Thoroughly manage the situation and take action based on the guidelines to "raise" it.
- Other semiconductor manufacturing equipment
This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
The very popular TME series
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Large-diameter silicon wafer measuring instrument
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
Measurement of Si wafer thickness, front and back surface P/N determination.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
We will challenge the world with our reliable technical skills and strong global network as our weapons.
- Vacuum Equipment
- Other semiconductor manufacturing equipment
- Processing Contract
We meet all needs for used semiconductor manufacturing equipment! Our motto is a network of information and expertise.
- Other semiconductor manufacturing equipment
No clean room needed! A flip chip bonder that makes factory miniaturization possible.
- Assembly Machine
- Other semiconductor manufacturing equipment