List of Other semiconductor manufacturing equipment products
- classification:Other semiconductor manufacturing equipment
91~135 item / All 2002 items
High-performance and simple strip machine.
- Other processing machines
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for aseptic filling processes. High internal visibility allows for easy confirmation of fluid conditions. The use of PFA achieves high chemical resistance and low leachability. TH50
- Piping Materials
- hose
- Other semiconductor manufacturing equipment
Metal seal for canisters. Good news for substances that cannot use resin or elastomer seal materials! By adopting metal seals, helium leak tightness has been achieved.
- Sealing
- Chemicals
- Other semiconductor manufacturing equipment
Countermeasures for machining center chips | L-shaped and curved wiper brushes
- Machining Center
- Other machine tools
- Other semiconductor manufacturing equipment
Proposal for Continuous Supply Ultra-Pure Water Production System: Achieving Stable Operation 24 Hours a Day
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Wafer
A multipurpose hybrid hose that combines the high durability of the rubber hose with the cleanliness and chemical resistance of the PFA in the fluid contact area.
- Food Processing Equipment
- Other Cosmetics Factory Equipment and Parts
- Other semiconductor manufacturing equipment
1μm filtration! Improved lens processing transparency and cost reduction.
- Filtration Equipment
- Water treatment filters and consumables
- Other semiconductor manufacturing equipment
Offered in various bundle configurations to support a price-competitive market.
- Other semiconductor manufacturing equipment
Compatible with 2 to 12-inch wafers. Customizable for each item.
- Other cleaning machines
- Other semiconductor manufacturing equipment
- Other semiconductors
[Leakage Prevention] Not a single drop of leakage will be overlooked without touching. Move to liquid leakage monitoring without tape.
- Business Intelligence and Data Analysis
- Other measurement, recording and measuring instruments
- Other semiconductor manufacturing equipment
Even uniquely shaped items like those in the photo can be produced from just one piece. Ideal for cleaning narrow spaces inside equipment.
- Brush
- Other semiconductor manufacturing equipment
- Parts feeder
Excellent bonding using AMX patented micro-punch technology.
- Other semiconductor manufacturing equipment
With our core technology, we respond to our customers' themes! Haimeka will walk alongside our customers!
- Contract manufacturing
- Other semiconductor manufacturing equipment
- Circuit board design and manufacturing
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
- Other semiconductor manufacturing equipment
Notice of Exhibited Products and Events for Nepcon Japan 2024
We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.
We propose a custom-made dispenser that fulfills your ideals.
- Other semiconductor manufacturing equipment
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
It is an environmentally friendly cleaning device that does not use chemical solutions.
- Other semiconductor manufacturing equipment
Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.
- Other semiconductor manufacturing equipment
Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.
- Other semiconductor manufacturing equipment
- others
- Other Connectors
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Insulation coating for chip inductors
- Inductor Coil
- Other semiconductor manufacturing equipment
If you are troubled by corrosion from acids and alkalis, use Shine Kogei's Blue Armor!
- Surface treatment contract service
- Other plant design, development and maintenance
- Other semiconductor manufacturing equipment
Excellent resistance to corrosion and wear, seamless ceramic joints eliminate metal contamination.
- Pipe Fittings
- Fine Ceramics
- Other semiconductor manufacturing equipment
Universal 4-Site Programmer "FlashCORE III-M4" Sales Launch Campaign
- Other semiconductor manufacturing equipment
For resolving corrosion troubles, definitely use Shine Kogei's Blue Armor Coating!
- Surface treatment contract service
- Other semiconductor manufacturing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
φ450 (18 inches) jig, equivalent specific gravity and Young's modulus to Si wafers! Low price!
- Fine Ceramics
- Other semiconductor manufacturing equipment
We provide high-precision SiC ceramic products with a maximum size of 800 x 40t. We will introduce the benefits of adoption through proven results, such as improved device performance and resolution o...
- Fine Ceramics
- Other machine elements
- Other semiconductor manufacturing equipment
The performance of the device is improved by lightweight, high-rigidity metal-ceramic composite materials.
- Mounter
- Other semiconductor manufacturing equipment
- Other industrial robots
Inline cleaning of particles on the stage - wafer-type stage cleaner
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
- Other cleaning tools
One Shaft, Two Jobs: Core Clamping and Blade Positioning—Streamlining Setup and Enabling Easy Automation.
- Bag making machine/slitter
- Other mounting machines
- Other semiconductor manufacturing equipment
Super cleanroom compatible high-precision 6-axis robot
- Other semiconductor manufacturing equipment