List of Wafer products
- classification:Wafer
61~90 item / All 309 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We have a track record of supplying major semiconductor manufacturers in Japan, South Korea, and China. We provide our products with high-level foreign matter management.
- Wafer
- Other semiconductors
- Non-ferrous metals
【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
- Wafer processing/polishing equipment
- Wafer
Introduction of "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors"! We can accommodate everything from small lots to customized orders.
- Wafer
- Wafer processing/polishing equipment
- Processing Contract
We accept several prototype processes without any issues, and we are well-known for our very flexible response, from mask design to cross-sectional dimension measurement.
- Wafer
- Wafer processing/polishing equipment
- Processing Contract
Achieving excellent piezoelectric properties! We offer specifications tailored to your applications.
- Wafer processing/polishing equipment
- Wafer
We have numerous achievements in In-based compound semiconductors. We can also provide high-purity products of 6N5 (99.99995%). Please consider us as a source to reduce dependence on China.
- Other semiconductors
- Wafer
- diode
It is made in Thailand with large-scale hydropower. Please consider it as a source to reduce reliance on China.
- Other metal materials
- Wafer
- alloy
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
- Engine parts
- Wafer
- lens
Various hydraulic pistons, spherical grinding of pin heads.
- Wafer
- Hydraulic Equipment
Flat finishing, flattening, and removal of protrusions for various flat surfaces.
- Engine parts
- Wafer
- lens
Simultaneous measurement of inorganic and organic components in minute specific areas.
- Contract measurement
- Wafer
- Memory
High-precision 3D surface measurement to meet the demands of complex surface measurements.
- Other measurement, recording and measuring instruments
- Wafer
- Semiconductor inspection/test equipment
Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes
Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.
- Wafer
- Lithium-ion battery
- Optical Measuring Instruments
Notice of Participation in JIMTOF 2024
Our company will be exhibiting at "JIMTOF 2024," which will be held at Tokyo Big Sight from November 5 (Tuesday) to November 10 (Sunday) for six days. (Booth number: E7107, East Hall 7) The theme of this exhibition is "Inspection/Measurement Equipment for the Era of e-Mobility," and we will showcase the latest technologies categorized into two zones: the latest applications for the machine tool industry and inspection/measurement in EVs. Scheduled products for display: - Single cable machine network system for grinding machines - Machine, tool, and process monitoring systems - Non-contact tool measurement device with CCD camera - NVH gear analysis device - Electric motor function testing system - Single cable machine network system for grinding machines - Tool and process monitoring systems for machine tools - High-precision on-machine measurement devices - Flexible non-contact measuring instruments - Die-cast mold surface temperature monitoring system, among others We sincerely look forward to seeing you at our booth.
Numerous achievements in optical fibers and polysilicon. We conduct consistent production from metallic silicon powder.
- others
- LAN/Optical cable
- Wafer
In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components...
- Wafer
- Oxidation/Diffusion Device
[Factory Security] No software installation required
- Wafer
- controller
- Other inspection equipment and devices
It is possible to confirm the stress distribution in the sample cross-section.
- Contract Analysis
- Wafer
It is possible to evaluate trace metals in ppm orders.
- Contract Analysis
- Ceramics
- Wafer
AFM: Atomic Force Microscopy Method
- Contract Analysis
- Wafer
There is a track record of growing nitride semiconductor crystals on various semiconductor substrates. Customization is also possible according to your requests.
- CVD Equipment
- LED Module
- Wafer
Aluminum filler with high thermal conductivity and heat dissipation properties.
- Wafer
Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
- Wafer
- Dedicated IC
- Other semiconductors
Realizing non-contact thickness measurement of various materials that transmit white light.
- Other measurement, recording and measuring instruments
- Sensors
- Wafer
Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes