List of Other semiconductors products
- classification：Other semiconductors
496～540 item / All 2684 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
![[For Power Modules] Axial Flow Fan ...](https://image.mono.ipros.com/public/product/image/2049780/IPROS11447802576667341115.jpg?w=280&h=280){kind=small}
Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.
- Other semiconductors
![[For Power Module] Axial Fan Heat S...](https://image.mono.ipros.com/public/product/image/2049780/IPROS5639149101619974518.jpg?w=280&h=280){kind=small}
Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.
- Other semiconductors
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors
1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.
- Other metal materials
- Other semiconductors
Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.
- Other semiconductors
- stainless
In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.
- Other semiconductors
- aluminum
Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.
- Other semiconductors
- Other metal materials
You can arrange and secure four transistors to the heat sink.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors
Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.
- Other semiconductors
You can arrange and secure two transistors to the heat sink.
- Other semiconductors
You can arrange and secure three transistors to the heat sink.
- Other semiconductors
Supporting the quality of power semiconductors from the downstream process.
- Other semiconductors
A socket that can be used under the same conditions as implementation without soldering IC devices, "Solderless."
- Other semiconductors
- socket
Wiring correction connector and package conversion service
- Other semiconductors
Join us for 12 exclusive webinars focused on key market segments! Top semiconductor experts will gather to unveil insights for the upcoming year.
- Seminar
- Other semiconductors