List of Other semiconductors products
- classification：Other semiconductors
901～945 item / All 2605 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
April 21 Venue Seminar: C3 Thinking Method and AI Utilization
■Title: "Thinking Skills in the Age of Generative AI: C3 Thinking Method" --- What is the "human thinking ability" required in the age of generative AI? This seminar explains the "C3 Thinking Method," which systematizes creative thinking that expands ideas using AI, critical thinking that discerns AI results, and expressive skills that effectively communicate. ■Date and Time: April 21, 2026 (Tuesday) 10:30 AM - 4:30 PM ■Venue: Chiyoda Platform Square (tentative) 3-21 Kanda Nishikicho, Chiyoda-ku, Tokyo 101-0054 ■Target Audience for the Seminar - Planning, technical, and research professionals who want to utilize generative AI in their work - Individuals looking to enhance their thinking and presentation skills - Those who want to appropriately evaluate and utilize AI outputs ■Knowledge Gained from the Seminar - An overview of the thinking skills necessary in the age of generative AI - Specific methods and applications of creative thinking - Verification methods for AI results through critical thinking - Structuring and expression techniques for effective communication - Practical application skills of the C3 Thinking Method
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
![[Problem Solving Case] Stacking Pin...](https://image.mono.ipros.com/public/product/image/532/2001503934/IPROS57835443135270624340.png?w=280&h=280){kind=small}
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
![[Problem Solving Case] Metal Substr...](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280){kind=small}
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
![[Problem Solving Example] Connectio...](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280){kind=small}
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d94/2001503941/IPROS18645158648223924469.png?w=280&h=280){kind=small}
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
![[Problem Solving Case] Terminals fo...](https://image.mono.ipros.com/public/product/image/3fb/2001503943/IPROS40703930758582890534.png?w=280&h=280){kind=small}
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d65/2001503949/IPROS52565932286896864440.png?w=280&h=280){kind=small}
A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!
- Other semiconductors
![[Problem Solving Case] Conversion A...](https://image.mono.ipros.com/public/product/image/918/2001503950/IPROS92696088421676517031.png?w=280&h=280){kind=small}
Solved with a conversion adapter! Here are some products that contributed to solving customer problems.
- Other semiconductors
![[Problem Solving Example] Only the ...](https://image.mono.ipros.com/public/product/image/ab2/2001503955/IPROS88625087893079940690.png?w=280&h=280){kind=small}
By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!
- Other semiconductors
![[Problem Solving Case] PCB Level Co...](https://image.mono.ipros.com/public/product/image/823/2001503957/IPROS93003875297794627196.png?w=280&h=280){kind=small}
Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!
- Other semiconductors
![[Problem-Solving Case] Reflow Heat ...](https://image.mono.ipros.com/public/product/image/6d7/2001503927/IPROS29173269770606501274.png?w=280&h=280){kind=small}
A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!
- Other semiconductors
![[Problem Solving Case] Board-to-Boa...](https://image.mono.ipros.com/public/product/image/8c4/2001503938/IPROS40604732200448737640.png?w=280&h=280){kind=small}
A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.
- Other semiconductors
![[Case Study] Heat Dissipation of Me...](https://image.mono.ipros.com/public/product/image/b52/2001503946/IPROS00694419965055911874.png?w=280&h=280){kind=small}
Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.
- Other semiconductors
![[Problem Solving Case] Daughterboar...](https://image.mono.ipros.com/public/product/image/27e/2001503953/IPROS95910517399822186989.png?w=280&h=280){kind=small}
A pin header with a spring action on one side to hold the daughterboard!
- Other semiconductors
![[Problem Solving Case] Base Shape N...](https://image.mono.ipros.com/public/product/image/de9/2001503931/IPROS28320549847222015401.png?w=280&h=280){kind=small}
A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!
- Other semiconductors
![[Problem Solving Case] Breakaway Pi...](https://image.mono.ipros.com/public/product/image/05d/2001503959/IPROS87733959945932962429.png?w=280&h=280){kind=small}
An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.
- Other semiconductors
![[Problem Solving Case] Stress Reduc...](https://image.mono.ipros.com/public/product/image/36a/2001503961/IPROS10309697965413181013.png?w=280&h=280){kind=small}
A case where stress was reduced and challenges were solved with a wave pin header!
- Other semiconductors
W389mm x H121mm Hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
W259mm x H121mm hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
W129mm x H121mm hollow type heat sink + axial fan enables efficient heat dissipation.
- Other semiconductors
Transistors in TO-218, TO-220, TO-247, TO-248, and SIP-Multiwatt packages can be clipped.
- Other semiconductors
Extruded heat sink with solder pins that can secure the transistor with clips.
- Other semiconductors
Solder pin attached extrusion heat sink (transistor screw mounting)
- Other semiconductors
Extruded heat sink with M3 screw hole for transistor fixation and solder pin (for TO-220, SOT32 package)
- Other semiconductors
Extruded heat sink with M3 screw holes for fixing TO220 package transistors and M3 screw holes for mounting on the board.
- Other semiconductors
Supports high precision and high-frequency signals! It has received high trust from users.
- Other electronic parts
- Other semiconductors
Controls conductivity in the range of 10E4 to 11Ω. A tray that excels in low dust generation and static prevention. Material suggestions suitable for the usage environment are also possible.
- Other semiconductors
Introducing the exhibition content for the event held from September 25 (Wednesday) to September 26 (Thursday), 2024!
- Other semiconductors
Heat sink with axial fan for AC230V axial fan
- Other semiconductors
Small aluminum heat sink measuring W15.3 x H8 x L15.3mm.
- Other semiconductors
Small aluminum heat sink measuring W19 x H4.8 x L5mm.
- Other semiconductors
Pursuing safety and reliability, we provide high-quality electronic components that meet our customers' needs!
- Other semiconductors
- Other electronic parts