List of Electronic Components and Modules products
- classification：Electronic Components and Modules
6751～6795 item / All 61221 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...
- Other consumables
- Processing Contract
faytech, ultra-thin casing, optical bonding compatible, supports power, video, and touch signals with a single USB Type-C, capacitive touch.
- LCD display
Introducing high-performance, high-efficiency products that meet strict industry standards!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Significantly improved design flexibility in applications with space constraints!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Multiple types of circuit board stacking designs are possible, providing flexibility in design!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Maspower S100-1A 100W Constant Voltage AC Adapter
- power supply
Maximize high-speed transmission processing performance and clean routing away from the connector installation area!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The flexible cable link provides relaxed tolerances and architectural flexibility!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Cost reduction through hermaphroditic design! Shortened lead time and simplified product matrix.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Providing a high-density and slim solution for interconnecting with SI performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Achieving streamlined integration and rapid implementation through a male-female dual-body design!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Equipped with 101 pairs of high-density modular interfaces per square inch!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Maspower_S120-1B_120W_Constant Voltage AC Adapter
- power supply
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of aircraft.
- Ultrasonic Oscillator
We will ensure the safety of the fuel tank of the space rocket.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of weapons.
- Ultrasonic Oscillator
Wheel inspection using ultrasonic flaw detection devices that support the safe operation of railways.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of piping.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that ensure plant safety.
- Ultrasonic Oscillator
Method for regular inspection of ultrasonic flaw detection devices to improve the quality of automotive parts.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic testing devices to ensure the safety of hull welding.
- Ultrasonic Oscillator
Comparing the differences in conductivity, cost, and weight!
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of bridges.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that support the safe operation of turbines.
- Ultrasonic Oscillator
Quick response for copper busbar processing for electrical equipment.
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Introducing the regular inspection methods for ultrasonic testing devices in the aerospace field.
- Ultrasonic Oscillator
Zero wear with air levitation and linear motor. Maximum speed 2 m/s, sensor resolution 1 nm.
- Other machine elements
- Cartesian Robot
- encoder
High-rigidity rotary stage with an opening, achieving less than 1µm of eccentricity and flatness with high speed and high precision.
- Actuator
- Other industrial robots
- encoder
The FS7030 is a portable type that features an automatic stripping function, making it convenient for on-site processing tasks.
- Other optical parts
Due to the wide variety of types such as battery-operated and rechargeable, it is possible to choose machines that suit the working environment.
- Secondary Cells/Batteries
High-performance and compact portable pump "Pompti"! Even more convenient when mounted on a tank truck!
- Secondary Cells/Batteries
- Other pumps
- others
Ideal for applications that require compliance with IAQ standards such as RESET!
- Sensors
Exhibited at Smart Sensing 2026.
Sensirion exhibited at the "Automotive Technology Exhibition 2026," held at Tokyo Big Sight from June 10 (Wednesday) to June 12 (Friday), 2026. At this exhibition, we showcased sensor solutions for automotive applications, in addition to environmental sensing and flow sensing. We also presented various measurement demonstrations and new products for the first time at the exhibition, allowing many visitors to see the performance and technological capabilities of our products. We would like to express our heartfelt gratitude to all the attendees. 【Main Demonstration Exhibits】 SCD5x New CO2 Sensor SGD4x Refrigerant Detection Sensor SEN6x Indoor Air Quality Combo Sensor Module SLF3x Liquid Flow Sensor Integrated Combo Module for HVAC (SAEN6) Refrigerant (Propane) Leak Detection Sensor Module (SACD4) Window Fog Detection Sensor Module (SAAF4)
Solder-based thermal materials that achieve high precision.
- Circuit board design and manufacturing
- power supply
- Solder
Designed and manufactured for the wavelength range from ultraviolet to near-infrared! Used in applications such as laser processing machines.
- mirror
This is a mirror used for dispersion compensation in optical systems such as femtosecond lasers.
- mirror
![[Case Study] Proposal for IR Sensor...](https://image.mono.ipros.com/public/product/image/650/2000722490/IPROS34284808350514250130.png?w=280&h=280){kind=small}
Add color variations to IR sensor windows to match the space design! Here are examples of achieving a luxurious restroom space!
- Sensors
![[Case Study] Improving the Loss Rat...](https://image.mono.ipros.com/public/product/image/79f/2000722530/IPROS34972412142306715289.png?w=280&h=280){kind=small}
Further cost cuts for mass production! We will strive to solve problems with a broad perspective!
- Other optical parts
It can be used for various home appliances, starting with the infrared window of mobile phones.
- filter
![[Case Study] Proposal for a prism t...](https://image.mono.ipros.com/public/product/image/a1e/2000722501/IPROS47839255223519359026.png?w=280&h=280){kind=small}
Achieve nanometer-level precision in optical components! Realize high reflectivity unaffected by surface conditions!
- prism
![[Case Study] Improving reflectivity...](https://image.mono.ipros.com/public/product/image/fcb/2000722507/IPROS98655312629869664063.png?w=280&h=280){kind=small}
Aiming for advancements in medicine, let's improve the detection capabilities of biological observations! Here we present a case that achieved high reflectivity while suppressing the widening of pulse...
- mirror