List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
361～405 item / All 5261 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Quantification of anions in high-concentration sodium hydroxide solution for semiconductor manufacturing using ion chromatography.
- Wafer
- Analytical Equipment and Devices
- Semiconductor inspection/test equipment
Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes
- Etching Equipment
- Wafer
- Other surface treatment equipment
Achieving ultra-high precision that is difficult with cutting processes. By reducing resistance through inner and outer surface plating, we solve the challenges of extending the lifespan of semiconduc...
- Semiconductor inspection/test equipment
Seventeen years since the publication of the '21st Century Edition Handbook on Film Fabrication Applications,' we are releasing a new edition that solidifies the fundamentals while enhancing new appli...
- Technical and Reference Books
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
We will protect our customers' investments in legacy radios and support functional verification!
- Tester
This is a test device that combines a wide range of digital tests and analog LMR tests!
- Tester
For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat grinding methods.
- Wafer processing/polishing equipment
The adoption of a unique blade tip positioner and an adjustable collet holder allows for quick and accurate visual drill setup!
- Wafer processing/polishing equipment
For those troubled by drill runout and cutting edge damage! Achieve improved processing accuracy and extended tool life with flat surface grinding methods.
- Wafer processing/polishing equipment
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodat...
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
◉ Short time: Easily conduct graphene synthesis experiments in just 30 minutes per batch. ◉ High-precision temperature and pressure control. ◉ Sophisticated software.
- CVD Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
There is a track record of delivering molding equipment. Supporting the cleaning process for semiconductor molds.
- Conveyor
- Plastic Mould
- Molding Equipment
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Instead of simply comparing drill grinding machines, determine "how far you want to rebuild tools in-house!"
- Wafer processing/polishing equipment
Providing various deposition materials, including Au alloys, according to their applications. A deposition material sales service that balances production efficiency and cost management through stable...
- Evaporation Equipment
- Other metal materials
Leave the precise resin cutting and processing of automotive interior parts to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Precision machining that meets the needs for lightweight structural materials in the aerospace field.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the palm-sized machining of lens substrates for optical devices to us.
- Other semiconductor manufacturing equipment
- Processing Contract
CNC machining in a palm-sized format to meet the needs of special containers.
- Other semiconductor manufacturing equipment
- Processing Contract
Palm-sized machining for medical device implants.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision cutting of fixtures for semiconductor manufacturing to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precise machining of robot exterior covers to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining of speaker cones for audio equipment to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining of custom parts for sports equipment to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Leave the precision machining for palm-sized models to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Please leave the palm-sized machining of hygienic components for food processing to us.
- Other semiconductor manufacturing equipment
- Processing Contract
Room temperature and high temperature test handler suitable for TO220 type.
- Tester
- power supply
- relay
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The Importance of Primer - The Invisible Undercoat Determines Longevity - Part 7
- Other semiconductor manufacturing equipment
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
Compact multi-film device that incorporates sputtering, deposition, EB, and annealing thin film modules in a 60L volume chamber, suitable for various applications.
- Sputtering Equipment
- Evaporation Equipment
- CVD Equipment
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
We have incorporated all the latest vacuum deposition technology into a compact benchtop-sized device that can effectively utilize limited lab space.
- Evaporation Equipment
VOXIA compact X-ray CT imaging device
Compact design with a space-saving layout that can be installed anywhere. Despite its compact body, it generates high-resolution data through advanced calculation software. * X-ray tube voltage: 20-90kV, or 40-maximum 130kV * Focus diameter: 7μm (5μm@4W) * Detector pixel: 89μm, approximately 3.2 million pixels! * Sample size: Φ120mm ◉ Vcap (Control Software): A custom-made imaging stage tailored to the subject and purpose. A series of tasks from shooting to image output can be performed with just a click. High-speed continuous shooting in as fast as 20 seconds, with processing from shooting start to image reconstruction taking about 30 seconds. ◉ VCT (Reconstruction Software): Customizable automatic measurement and analysis software specialized for the specified subject. High-speed reconstruction of shooting data with 992 x 992 pixel images and 600 projections in just 3.8 seconds! ◉ MolcerPlus (3D Display Analysis): Custom software that enables measurement conditions that were difficult with conventional software. Software for displaying, processing, and measuring the imaged object. ● High safety, ● Compatible with a wide variety of samples, ● Intuitive HMI, easy operation.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm
There is a track record of adopting load ports. We propose brush seals as a solution for gaps in semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
- Molding Equipment
Just install the GEM module between the device and the host!
- Communications
- Other semiconductor manufacturing equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract
Packaging and packing machines, as well as vacuum pumps! We offer a full range of equipment from the main units to components in various fields.
- Other measurement, recording and measuring instruments
- Sputtering Equipment
- Used goods purchase
TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)
- Other semiconductor manufacturing equipment
Invitation to Exhibit at the Microwave Exhibition 2025
Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe
Disco SPR-101 Robot System Modification
- Other semiconductor manufacturing equipment
We provide repair and improvement services with extensive experience in peripheral equipment for semiconductor manufacturing devices.
- Other semiconductor manufacturing equipment
Explanation of specialized terms in grinding and polishing.
- Wafer processing/polishing equipment
- Grindstone
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor
High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm