List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

1531~1575 item / All 4625 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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Achieves low RDS(on) to maximize the effective use of package space.

  • Other semiconductors

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Introducing our unique package and DioMOS technology fusion module!

  • Other semiconductors

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The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!

  • 3-2.PNG
  • Other semiconductors

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Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.

  • Other semiconductors

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Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.

  • Other semiconductors

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A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

  • Other semiconductors
  • Database
  • EAI/ETL/WEB application server

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20260520 ニューラルネットワーク分子動力学法の基礎と応用:AI活用型材料設計.png

5/20 Webinar "Fundamentals and Applications of Neural Network Molecular Dynamics: AI-Driven Material Design"

■ Title: "Fundamentals and Applications of Neural Network Molecular Dynamics: AI-Driven Material Design" ―― Solving issues of "computational difficulties" and "uncertainty in applicability." This seminar will systematically explain the fundamentals, strengths, limitations, and countermeasures of NNMD, along with specific implementation strategies for material development. ■ Date and Time: May 20, 2026 (Wednesday) 10:30 AM – 4:30 PM ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Successful case studies of NN molecular dynamics simulations - Differences and advantages over conventional MD - Basic theories and computational procedures - Countermeasures for computational issues - Applicable areas and limitations - Directions and strategies for corporate implementation 【Target Audience for the Seminar】 - Those who want to introduce NN molecular dynamics - Those who want to understand the differences and features compared to conventional MD - Those who want to strengthen their ability to handle computational troubles - Those who want to grasp the applicable range and limitations - Those who want to consider utilization strategies in their companies *Those interested in related fields are also welcome.

A new style heat sink with lower thermal resistance than the popular FK244 series.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.

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  • fischer-elektronik-フィッシャー-smd-smt-ヒートシンク.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!

  • Composite Materials
  • Other semiconductors
  • Generators and transmission motors

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Zebro.jpg

We will exhibit at the 2nd Power Device & Module EXPO!

We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!

Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.

  • Other semiconductors
  • Wafer processing/polishing equipment

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An example of connecting different pitches through a pitch conversion adapter linked by a pattern!

  • Other semiconductors

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An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!

  • Other semiconductors

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A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.

  • Other semiconductors

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A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!

  • Other semiconductors

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Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.

  • Other semiconductors

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A case where installation man-hours were reduced with a pin header consolidated into a single base!

  • Other semiconductors

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An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.

  • Other semiconductors

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A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!

  • Other semiconductors

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Solved with a conversion adapter! Here are some products that contributed to solving customer problems.

  • Other semiconductors

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By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!

  • Other semiconductors

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Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!

  • Other semiconductors

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A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!

  • Other semiconductors

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A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.

  • Other semiconductors

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Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.

  • Other semiconductors

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A pin header with a spring action on one side to hold the daughterboard!

  • Other semiconductors

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A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!

  • Other semiconductors

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An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.

  • Other semiconductors

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A case where stress was reduced and challenges were solved with a wave pin header!

  • Other semiconductors

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W389mm x H121mm Hollow-type heat sink with axial fan enables efficient heat dissipation.

  • la_hb3.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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W259mm x H121mm hollow-type heat sink with axial fan enables efficient heat dissipation.

  • la_hb2.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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We provide silicon wafers that meet your requirements with short delivery times and low prices! Same-day shipping available.

  • Wafer

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W129mm x H121mm hollow type heat sink + axial fan enables efficient heat dissipation.

  • la_hb1.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Transistors in TO-218, TO-220, TO-247, TO-248, and SIP-Multiwatt packages can be clipped.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Extruded heat sink with solder pins that can secure the transistor with clips.

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  • sk43730stc.jpg
  • sk43735stc.jpg
  • sk43750stc.jpg
  • sk437_stc.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Solder pin attached extrusion heat sink (transistor screw mounting)

  • sk43725sts.jpg
  • sk43730sts.jpg
  • sk43735sts.jpg
  • sk43750sts.jpg
  • sk437_sts.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Extruded heat sink with M3 screw hole for transistor fixation and solder pin (for TO-220, SOT32 package)

  • sk454_m3_l.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Aluminum is a top performer in recycling! Additionally, its lightweight nature contributes to reduced transportation costs and less burden on workers!

  • Wafer

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A reader chip boasting industry-leading reception sensitivity and reading speed, supporting next-generation RAIN tags.

  • E710-In-Use-600x400.jpg
  • リーダIC.jpg
  • IC tag
  • Dedicated IC

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Extruded heat sink with M3 screw holes for fixing TO220 package transistors and M3 screw holes for mounting on the board.

  • sk95_sot.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Supports high precision and high-frequency signals! It has received high trust from users.

  • Other electronic parts
  • Other semiconductors

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Small temperature mobility switching characteristics, low forward voltage, high-speed switching time.

  • diode

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Controls conductivity in the range of 10E4 to 11Ω. A tray that excels in low dust generation and static prevention. Material suggestions suitable for the usage environment are also possible.

  • Other semiconductors

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Second source products for standard operational amplifiers (also available as alternatives for other standard products).

  • JSCJ.jpg
  • Transistor

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APC-driven circuit built-in laser diode module

  • diode

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