Wafer processing/polishing equipmentの製品一覧
- 分類：Wafer processing/polishing equipment
181～225 件を表示 ／ 全 1031 件
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Air bearing cylinder with zero friction resistance.
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!
- Hand polishing and filing
- Grindstone
- Wafer processing/polishing equipment
Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!
- drill
- Wafer processing/polishing equipment
Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.
- drill
- Wafer processing/polishing equipment
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
- drill
- Wafer processing/polishing equipment
October 26 (Monday) to 31 (Saturday), 2026: Announcement of participation in 'JIMTOF2026, the 33rd Japan International Machine Tool Fair'
Tanaka Import Group Co., Ltd. will be exhibiting at the 'JIMTOF2026 33rd Japan International Machine Tool Fair' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of manufacturing, where machine tools and their peripheral equipment gather in one place, and it is one of the largest international technology shows in the world, featuring advanced technologies and products from around the globe. We plan to display a variety of products, including drill grinding machines and tube skimmers. When you visit, please be sure to stop by our booth.
Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!
- Other surface treatment equipment
- Wafer processing/polishing equipment
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
- Wafer processing/polishing equipment
- Tap
Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Good hole processing is possible! You can regrind the brooch and reduce purchase costs.
- Wafer processing/polishing equipment
Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
The grinding stone is CBN #150! A precision end mill grinder capable of sharpening the tip and side edges.
- drill
- Wafer processing/polishing equipment
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
![[Polishing Technology] Ultra-Precis...](https://image.mono.ipros.com/public/product/image/54f/2000603990/IPROS83849052596060099439.png?w=280&h=280){kind=small}
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
TRU HONE: Extends the lifespan of blades by 50%! Perfectly sharpens the edge of blades in a short time.
- Wafer processing/polishing equipment
Achieve high quality, low cost, and mass production with our centerless grinding machine, boasting high production numbers and precision!
- Wafer processing/polishing equipment
- Processing Contract
- others
We will provide the 'electrolytic polishing device,' 'dedicated electrode jig,' and 'electrolytic polishing solution' as a package.
- Other surface treatment equipment
- Wafer processing/polishing equipment
We equip our company with processing machines tailored to our know-how! This allows us to provide highly reliable products to our customers.
- Wafer processing/polishing equipment
For laboratories: Achieves orientation processing equivalent to higher-end models at a low price. Compact and lightweight, making it easy to carry.
- Organic EL
- LCD display
- Wafer processing/polishing equipment
Attention researchers and students: The assembly-type simple rubbing machine 'Rubbing Kit' has arrived!
A fully manual type rubbing device, the "Rubbing Kit," has been born, allowing users to learn assembly procedures and structure. Since users will assemble it themselves, they can learn the basics of rubbing as well as the structure and assembly of the device. By adding various options, it can also be used for actual rubbing processes. 【Features】 ■ A simple assembly device for manual rubbing ■ Learn the basics and structure of rubbing ■ Fully manual type ■ A budget version of the rubbing jig ■ Usable for actual rubbing processes *For more details, please contact us or download the catalog.
We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.
- CVD Equipment
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Equipped with a function to adjust the swing angle! It can maintain an even spray balance!
- Wafer processing/polishing equipment
- Other surface treatment equipment
Comparison of Grinding Methods
- Wafer processing/polishing equipment
Types and Characteristics of Grinding
- Wafer processing/polishing equipment
Improved wear resistance and corrosion resistance enhance equipment lifespan! It prevents the generation of particles during the production process.
- Wafer processing/polishing equipment
- Hand polishing and filing
- Other abrasives
![[Demo video available] Imitation po...](https://image.mono.ipros.com/public/product/image/155/2001501180/IPROS07783704546326619705.jpeg?w=280&h=280){kind=small}
No specialized robot teaching program is needed! Just give simple instructions, and polishing can be done.
- Wafer processing/polishing equipment
The illumination distribution of the exposure light source is within ±5%! A lineup of desktop and standalone models is available.
- Wafer processing/polishing equipment
Automation of super finishing processes and uniformity of roughness. We propose polishing equipment for outer diameter, inner diameter, end face, etc., tailored to your applications and shapes.
- Wafer processing/polishing equipment
Highly versatile! Guarantees a shining edge, perfect finish, and short processing time.
- Wafer processing/polishing equipment
A highly versatile fully electric solution for flat and shaped edges!
- Wafer processing/polishing equipment
Guaranteed high-quality finish and consistent performance! Stone grinding machine with excellent output.
- Wafer processing/polishing equipment
- Stone Processing Machinery
Vivid in the vertical direction! Precisely vertically polished straight edges of marble and granite.
- Wafer processing/polishing equipment
Unique solutions for precision, efficiency, and reliability in stone polishing.
- Wafer processing/polishing equipment
- Stone Processing Machinery
【Demo unit available for loan!】Wafer High-Pressure Jet Scrubber HPC-8654-H
- Wafer processing/polishing equipment
- Wafer
[Free Distribution] Comprehensive Catalog of Automatic Etching Devices and Automatic Development Devices for Circuit Boards
- Wafer processing/polishing equipment
Flange for dicing saw "Blade Holder"
- Wafer processing/polishing equipment
- Diamond cutter
- cutter
We propose rationalization equipment for steel and processing factories, such as ultra-hard circular saw cutting machines!
- Other processing machines
- Wafer processing/polishing equipment
- others
Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.
- Wafer processing/polishing equipment
Confirmation of chiplet package structure by mechanical polishing.
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*