List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
181~225 item / All 1012 items
Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...
- Shelf life enhancer
Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.
We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.
Can be processed into various shapes, with a wide range of application possibilities! We will polymerize the polymer according to your requirements.
- Public Testing/Laboratory
- Contract manufacturing
For polishing various substrates and for fine burr removal in punched areas.
- Other machine tools
- Wafer processing/polishing equipment
- Special Processing Machinery
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...
- Wafer processing/polishing equipment
You can achieve the desired surface accuracy with a simple operation to replace the polishing film!
- Wafer processing/polishing equipment
No need for an inversion device to clean the LCD substrate on both sides simultaneously!
- Wafer processing/polishing equipment
- Circuit board processing machine
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
- Other processing machines
- Wafer processing/polishing equipment
A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!
- Other processing machines
- Wafer processing/polishing equipment
Achieve precision that is unstable by hand, and definitely improve yield! Easily portable tabletop model.
- Other processing machines
- Wafer processing/polishing equipment
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
- Other processing machines
- Wafer processing/polishing equipment
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
The brush mechanism allows for the removal of burrs and chips generated during cutting.
- Other processing machines
- Wafer processing/polishing equipment
We propose our polishing equipment to address the concerns of automotive parts manufacturers.
- Wafer processing/polishing equipment
- Other abrasives
Inner diameter grinding device renewal
We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!
Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...
- Wafer processing/polishing equipment
- Other abrasives
Solving the concerns of electronic device manufacturers! We propose our polishing equipment.
- Other surface treatment equipment
- Wafer processing/polishing equipment
- Other abrasives
Solving various companies' problems! Introducing it clearly with comparisons to other training programs!
- Wafer processing/polishing equipment
- Other abrasives
- Other surface treatment equipment
Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.
- Other machine tools
- Wafer processing/polishing equipment
Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.
- Wafer processing/polishing equipment
- Flat/Shaped/Vertical Cutting Machine
- Processing Contract
Solving issues of labor shortages and technology transfer! An explanation of the purpose and features of Sanshin's equipment.
- Wafer processing/polishing equipment
A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Maximizing the features of the wrapping tape makes the intended polishing easy.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.
- Wafer processing/polishing equipment
We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]
- Wafer processing/polishing equipment
- Engine parts
- lathe
Unlike hand grinding, this grinding unit is not affected by the operator's level of experience!
- Wafer processing/polishing equipment
Can be processed under suitable conditions! Even beginners can operate it easily.
- Other processing machines
- Wafer processing/polishing equipment
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
- Other processing machines
- Wafer processing/polishing equipment
Needle valves, for automotive small parts! Introducing the burr removal and outer diameter tape wrapping device!
- Other processing machines
- Wafer processing/polishing equipment
We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!
- Wafer processing/polishing equipment
- Other abrasives
We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a co...
- Wafer processing/polishing equipment
- Other abrasives
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
Free gift: 'Handbook of Basic Knowledge on Wrapping & Polishing'!
- Wafer processing/polishing equipment
We will exhibit at the Fukuoka Monozukuri Fair 2016 (October 26-28, 2016).
Nippon Engis will be exhibiting at the "Monozukuri Fair 2016" held at Marine Messe Fukuoka from Wednesday, October 26 to Friday, October 28. If you would like an invitation, please contact us. <Exhibited Products> Small Lapping Machine Abrasives Lapping Process Samples We understand that you are busy, but we sincerely look forward to your visit.
Leave the automation of metal polishing, grinding, and deburring to FUJIYA TECH.
- Wafer processing/polishing equipment
- Other FA equipment
Leave the automation of metal grinding, polishing, and deburring processes to FUJIYA TECH.
- Wafer processing/polishing equipment
- Other FA equipment
A dedicated belt grinder designed for incorporation into robots and devices. It has the highest output in the lineup, suitable for heavy grinding of castings and welded parts.
- Other industrial robots
- Wafer processing/polishing equipment
A dedicated belt grinder designed for incorporation into robots and devices. Suitable for fine deburring, chamfering, and finishing.
- Other industrial robots
- Wafer processing/polishing equipment
Leave everything to us! Our top priority is to protect your supply chain and respond with the utmost priority on delivery times.
- Wafer processing/polishing equipment
- Surface treatment contract service
- Other contract services
By rotating the holder and the disk in the same direction at the same speed, grinding can be done without losing the parallelism of the workpiece!
- Wafer processing/polishing equipment
Total engineering partner in the semiconductor industry with over 2,000 achievements in the semiconductor field.
- Resist Device
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
SEMICON Japan 2025 Exhibition
We will be exhibiting at SEMICON Japan 2025, which will be held at Tokyo Big Sight from December 17 (Wednesday) to 19 (Friday). When you visit, please stop by our booth at East Hall 6, E6301.
Save cleaning time! The durable die-cast body provides robustness and stability.
- Wafer processing/polishing equipment
Introducing an automatic polishing machine with a total weight of 77kg, available with an optional splash kit and lid!
- Wafer processing/polishing equipment
Minimal shape change and high gloss! Achieve polishing of metals for jewelry, dental, and industrial applications with a tabletop-sized special electrolytic polishing machine!
- Wafer processing/polishing equipment
It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.
- Wafer processing/polishing equipment