List of Other semiconductors products

  • classification:Other semiconductors

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We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...

  • Contract manufacturing

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Do you have any concerns about contract manufacturing of various chemical products?

We would like to introduce the contract manufacturing services provided by Riten Chemical Co., Ltd. We are a chemical manufacturer based in Kyoto with 70 years of experience. Since our establishment, we have been developing, manufacturing, and selling various surfactants used in the textile and paper industries. Based on the technology and development capabilities we have cultivated over the years, we accept contract manufacturing of various chemical products, so please feel free to contact us. 【Contract Manufacturing Achievements】 ■ Construction waterproofing agents ■ Plant growth promoters ■ Construction waterproofing materials ■ Greening-related agents ■ Chemicals for the electronics industry ■ Wastewater treatment agents ■ Industrial preservatives ■ Special surfactants... We provide more detailed information through related products and catalogs.

Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!

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  • Glass

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A clip that can securely make contact with a TO-220 package transistor and a heat sink.

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  • Other semiconductors

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98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)

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  • Other semiconductors

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This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.

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  • Other semiconductors

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200mm diameter, 40mm height round LED heat sink

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  • Other semiconductors

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Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.

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  • Other semiconductors

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Axial flow heat sink with axial flow fan for AC230V

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  • Other semiconductors

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Heat sink for DIP IC (14, 16 contacts)

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  • Other semiconductors

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High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins

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  • Other semiconductors

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With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.

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  • Other semiconductors

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With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.

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  • Other semiconductors

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A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.

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  • Other semiconductors

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One-stop solution from design to manufacturing of power semiconductors!

  • Other semiconductors

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Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.

  • Other semiconductors

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You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!

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  • Memory
  • Other semiconductors

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We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!

  • Other semiconductors

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Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.

  • Other semiconductors

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Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!

  • 12a.PNG
  • 12b.PNG
  • Other semiconductors

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Achieves low RDS(on) to maximize the effective use of package space.

  • Other semiconductors

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Introducing our unique package and DioMOS technology fusion module!

  • Other semiconductors

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The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!

  • 3-2.PNG
  • Other semiconductors

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Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.

  • Other semiconductors

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Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.

  • Other semiconductors

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A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

  • Other semiconductors
  • Database
  • EAI/ETL/WEB application server

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20260421 生成AI時代の思考力:C3思考法 ~創造的・批判的思考法からプレゼン技法まで~ (2).png

April 21 Venue Seminar: C3 Thinking Method and AI Utilization

■Title: "Thinking Skills in the Age of Generative AI: C3 Thinking Method" --- What is the "human thinking ability" required in the age of generative AI? This seminar explains the "C3 Thinking Method," which systematizes creative thinking that expands ideas using AI, critical thinking that discerns AI results, and expressive skills that effectively communicate. ■Date and Time: April 21, 2026 (Tuesday) 10:30 AM - 4:30 PM ■Venue: Chiyoda Platform Square (tentative) 3-21 Kanda Nishikicho, Chiyoda-ku, Tokyo 101-0054 ■Target Audience for the Seminar - Planning, technical, and research professionals who want to utilize generative AI in their work - Individuals looking to enhance their thinking and presentation skills - Those who want to appropriately evaluate and utilize AI outputs ■Knowledge Gained from the Seminar - An overview of the thinking skills necessary in the age of generative AI - Specific methods and applications of creative thinking - Verification methods for AI results through critical thinking - Structuring and expression techniques for effective communication - Practical application skills of the C3 Thinking Method

A new style heat sink with lower thermal resistance than the popular FK244 series.

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  • Other semiconductors

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By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.

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  • Other semiconductors

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Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!

  • Composite Materials
  • Other semiconductors
  • Generators and transmission motors

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We will exhibit at the 2nd Power Device & Module EXPO!

We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!

Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.

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  • Other semiconductors

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Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.

  • Other semiconductors
  • Wafer processing/polishing equipment

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An example of connecting different pitches through a pitch conversion adapter linked by a pattern!

  • Other semiconductors

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An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!

  • Other semiconductors

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A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.

  • Other semiconductors

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A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!

  • Other semiconductors

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Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.

  • Other semiconductors

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A case where installation man-hours were reduced with a pin header consolidated into a single base!

  • Other semiconductors

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An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.

  • Other semiconductors

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A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!

  • Other semiconductors

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Solved with a conversion adapter! Here are some products that contributed to solving customer problems.

  • Other semiconductors

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By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!

  • Other semiconductors

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Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!

  • Other semiconductors

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A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!

  • Other semiconductors

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A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.

  • Other semiconductors

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Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.

  • Other semiconductors

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A pin header with a spring action on one side to hold the daughterboard!

  • Other semiconductors

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A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!

  • Other semiconductors

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An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.

  • Other semiconductors

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