Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
106～120 item / All 199 items
No solar panels are needed, and you can easily set the characteristics from your PC.
This device is a solar simulator that can connect up to 32 solar cell simulation power modules with an output of 300W each, allowing for the simulation of high output. Individual settings can be made for each module, such as IV curves, from a PC, enabling the simulation of cell failures and shading.
![Control device assembly and wiring [from circuit board mounting to unit assembly]](https://image.mono.ipros.com/public/product/image/af4/2001093276/IPROS47530744300262014990.png?w=280&h=280)
Skilled staff are on hand! We would like to introduce our "Control Device Assembly and Wiring."
At Shinshu Koden Co., Ltd., we perform "control device assembly and wiring." Our skilled staff assembles and wires circuit board assemblies and control devices into enclosures, completing various control devices and units. Please feel free to consult us when you need our services. 【Services Offered by Shinshu Koden Co., Ltd.】 ■ Circuit design ■ Printed circuit board pattern design ■ Chip mounting, assembly, and wiring ■ Enclosure assembly and wiring ■ Various inspections *For more details, please refer to the related links or feel free to contact us.
Possesses lead-free compatible dynamic IR rework systems, among others.
We would like to introduce our company's "main equipment" that performs general electronic device repairs as well as BGA repair and rework. The "HR600" is equipped with a super high-efficiency hybrid heater, which is an evolution of the IR heater, and features an automatic component placement function through image processing, enabling fully automated rework operations. The modular type IR rework system "IR650A" supports safe rework operations in a lead-free environment and can handle a wide range of applications from large lead-free boards with high thermal capacity to delicate mobile phone boards and small PC boards, allowing for safe rework operations with simple operating procedures. Additionally, we possess lead-free compatible rework systems like the "IR550A," which guarantees uniform heating that was difficult with traditional hot air methods, and the X-ray observation device "FX-300tRX" with CT functionality. 【Main Equipment】 ■ HR600 Fully Automated Rework System ■ IR650A Rework System ■ IR550A Rework System ■ Hybrid Rework System ■ X-ray Observation Device FX-300tRX with CT Functionality *For more details, please refer to the PDF document or feel free to contact us.
![[Data] ACF Crimping and Repair](https://image.mono.ipros.com/public/product/image/2c8/2000422283/IPROS11919272604378683044.jpg?w=280&h=280)
Detailed examples of FPC replacements implemented in LCDs and information about the equipment owned.
This document introduces the repair of LCDs and FPCs using the ACF crimping equipment conducted by Viola Corporation. It includes an introduction to our tabletop ACF attachment device "LD-02" and the FPC alignment thermal crimping device "BD-03," as well as approximately 150,000 repair case examples. [Contents] ■ Introduction of equipment ■ Repair cases *For more details, please refer to the PDF document or feel free to contact us.
![[Case Study] Copper Core Ball Installation Work](https://image.mono.ipros.com/public/product/image/820/2000439551/IPROS17215221793739976766.jpg?w=280&h=280)
By using a copper core ball, deformation of the ball is minimized, enabling 3D implementation and narrow pitch implementation.
Compared to solder balls: ◎ Excellent strength, allowing for clearance in semiconductor packages ◎ Suppresses deformation of the balls, secures space, and enables the realization of a highly reliable component structure ◎ Allows for narrow pitch mounting similar to Cu pillars ◎ Enables high heat dissipation and measures against electromigration
If it's about BGA rework, leave it to us! We will introduce the work process.
Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.
Introducing rework and reballing equipment for safe rework operations in a lead-free environment!
We would like to introduce the rework and reballing equipment we use. The "IR650A Rework System" is a modular type IR rework system designed for safe rework operations in a lead-free environment. Additionally, we have the lead-free compatible "IR550A Plus Rework System" using dynamic IR technology and a "Hybrid Rework System." 【Features (IR650A Rework System)】 ■ Modular type IR rework system ■ Supports safe rework operations in a lead-free environment ■ Compatible with a wide range of delicate mobile phone circuit boards to small PC circuit boards ■ Allows rework operations with simple operating controls *For more details, please refer to the PDF materials or feel free to contact us.
![[Presentation of Materials!] Viola Corporation Introduction to Rework and Reballing](https://image.mono.ipros.com/public/product/image/cce/2000445097/IPROS53605199118066401842.png?w=280&h=280)
Introduction to BGA Rework and Reballing! We are sharing our expertise with over 30,000 rework cases of BGA with a pitch of 0.4 to 0.8mm!
In this document, we introduce the functions of rework and reballing equipment, including BGA rework and reballing. Our company offers BGA replacement, BGA repair, BGA rework, BGA reballing, circuit board modification, circuit board repair, soldering services, and X-ray inspection services with CT functionality. Details of our "BGA Rework and Reballing" include over 30,000 rework achievements for BGA with a pitch of 0.4 to 0.8mm, as well as over 20,000 reballing achievements for BGA with ball diameters ranging from Φ0.2 to 0.8mm. We can also accommodate copper core balls. We can handle requests starting from one piece, and we are capable of working on circuit boards with underfill applied, as well as replacement work for QFN and connectors. Prices are clearly stated, so please feel free to contact us. [Contents] ■ What is rework? ■ What is reballing? ■ The technical capabilities of Viola that meet diverse needs ■ Introduction to some functions of Viola's rework and reballing equipment *For more details, please refer to the PDF document or feel free to contact us.
[Parts Repair/Repair/Reimplementation] Stable and safe rework operations! Rework system compatible with lead-free solder.
The "RD-500S III" is a rework device that employs an efficient 700W high-power hot air heater with upper and lower heaters, allowing for uniform heating of the device and solder joints from above and below. As a result, it achieves an extremely safe removal and installation heating profile. 【Features】 ■ Trouble-free flash memory controller ■ Three heating systems ideal for lead-free applications ■ Far infrared area heating system to prevent board warping ■ Two-mode cooling function tailored to applications ■ Two-point auto profile for device temperature control 【Applications】 - Tablets - Computer motherboards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, and more. For more details, please contact us or download the catalog.
Printed circuit board assembly (chip mounting)
Our company offers a wide range of surface mount technology for printed circuit boards, from discrete components such as ICs, resistors, and capacitors to chip components. In particular, chip components are mounted using chip mounters, while other components are accurately assembled by skilled artisans by hand. We can also accommodate component assembly only. Please feel free to consult with us at any time.
Face's "technical capabilities" and "responsiveness" realize proposals from the customer's perspective. We solve your problems with our technical skills and experience that make the impossible possible.
- Questions will be handled by the person in charge, who will contact you immediately with answers. - Estimates will be provided promptly. - Technical responses can be given. - Many engineers are in the technical department, allowing direct communication with customers. - We will support you with a two-person system consisting of a sales representative and a sales assistant. - If you have any questions, a sales staff member will come to assist you right away. - We have delivery services, so we can handle the pickup of supplied items and regular deliveries. Feel free to contact us regarding design, PCB assembly, wiring, and electrical testing. *For details, please view the actual work video materials from the [PDF Download] below or contact us through [Inquiries]. For phone inquiries, please call: 042-759-4868.
The biggest advantage is that it is "made in Japan." Everything is easy to handle in Japanese, and prompt after-sales service is available.
This is a system that manages the GS1 codes and human-readable characters printed on the individual packaging of pharmaceuticals, enabling the transmission and reception of printing data and inspection data, as well as recording and retaining printing results and inspection results through integration with printing machines and inspection machines. 【Features】 1. Made in Japan (easy to handle in Japanese, quick after-sales service) 2. No annual license fee (reducing running costs) 3. Validation documents are consistently provided from system assessment to IQ/OQ. 4. Complies with the latest track & trace regulations in various countries, with quick responses to revisions. 5. Can be installed on both new and existing lines. 6. Future additions of items and destination countries are possible. 7. Future addition of the aggregation system HIES-7000AG is possible. 8. Centralized management of production line history data through connections with PLCs and various devices. 9. Integration with TraceLink's track & trace cloud, TraceLink Life Sciences Cloud. Engineers who are well-versed in pharmaceutical packaging processes will propose optimal designs that encompass the entire packaging line. For more details, please contact us via phone or email.
We offer a proposal type with high cost benefits and a prototype type focused on minimizing expenses!
We accept PCB manufacturing. For prototypes, small quantities, or projects with plans for small-scale repeats, we maximize cost benefits and mass production effects according to the situation, providing solid support. We can handle special PCBs that others have declined, including medical power supply circuit boards, automotive power circuit boards, thick copper boards for power wireless transmission devices, high-output LED boards, and metal core boards suitable for semiconductor heat dissipation. 【Features】 ■ Maximizing cost benefits with implementation know-how ■ Manufacturing plans anticipating mass production ■ Suitable plans for cases with no repeat plans but with revision plans ■ Handling of special PCBs that are difficult and cannot be manufactured by other companies *For more details, please refer to the PDF materials or feel free to contact us.
Cost-focused proposals without compromising product quality! An ideal layout boasts reliable quality.
We offer A/W design and PCB design services. Our designs not only meet specifications but also always consider the manufacturing processes beyond the circuit diagrams. Our implementation experts strive to solve problems from both design and manufacturing perspectives, providing solid support for our customers' development. Designs that prioritize functionality, such as the rationality of component placement and wiring, ensuring current capacity, wiring length, and width, represent our "A/W design" at Shinsai. 【Features】 ■ PCB design that eliminates unnecessary elements by leveraging implementation experience and knowledge ■ Pursuit of rationality in component placement ■ Cost-focused proposals without compromising product quality *For more details, please refer to the PDF document or feel free to contact us.
Be aware of the production plan! You can also leave the development of hardware and software to us.
We offer development and circuit design services. We design and prepare testing equipment tailored to the completed model of the circuit board you request. We gather the required functional specifications and compile them into design specifications. We provide design support for testing stages that meet a variety of requests, including comprehensive inspections in a prepared environment, from both hardware and software perspectives. Please feel free to contact us with your inquiries. 【Features】 ■ Solving customer issues with a focus on the field ■ Savings in time and cost are directly reflected in the speed and price of development ■ Always considering the manufacturing processes beyond the circuit diagram * For more details, please refer to the PDF materials or feel free to contact us.
