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Bonding Equipment - メーカー・企業7社の業務用製品ランキング | イプロスものづくり

更新日： 集計期間:Sep 09, 2026～Oct 06, 2026
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Bonding Equipmentのメーカー・企業ランキング

更新日： 集計期間:Sep 09, 2026～Oct 06, 2026
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  1. null/null
  2. Micro Point Pro ltd 本社 Tokyo//Electronic Components and Semiconductors
  3. Shinwa Co., Ltd. Mechatronics System Center Aichi//Industrial Machinery
  4. 4 兼松ＰＷＳ Kanagawa//Industrial Machinery
  5. 5 アイテス Shiga//Electronic Components and Semiconductors
企業ランキングへ

Bonding Equipmentの製品ランキング

更新日： 集計期間:Sep 09, 2026～Oct 06, 2026
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process. Shinwa Co., Ltd. Mechatronics System Center
  2. ASMPT Corporation Back-end Equipment 兼松ＰＷＳ
  3. Regarding the bonding interface of Cu wire bonding. アイテス
  4. 4 Useful for semiconductor backend processes! Design pickup tools in any format. オルテコーポレーション 本社
  5. 5 [Customer Case] Nidek's Research and Development of Artificial Vision

Bonding Equipmentの製品一覧

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ASMPT Corporation Back-end Equipment

ASMPT Corporation Back-end Equipment

ASMPT is a backend equipment manufacturer based in Singapore.

Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Bonding Equipment

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Cu Ribbon Laser Bonding Device 'CURL-1510'

Cu Ribbon Laser Bonding Device 'CURL-1510'

Since it joins while forming, it is possible to mix different joining shapes with just one machine!

The CURL-1510 is a laser bonding device that ensures electrical capacitance by using Cu ribbons. Since Cu has advantageous electrical capacitance, it allows for changes in the manufacturing process from the design stage of power modules. Additionally, because it uses laser bonding, the pressure applied to the module can be kept low. 【Features】 - It can bond different joint shapes with a single machine while forming. - It can bond even shapes with steps, and the Cu ribbon itself has excellent resistance to tipping. - It ensures accuracy by correcting the position of the bonding points through image recognition. - The use of laser bonding keeps the pressure applied to the module low. *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Bonding Equipment

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Tabletop Manual Wire Bonder "IBOND5000"

Tabletop Manual Wire Bonder "IBOND5000"

Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

The "IBOND5000" is an advanced tabletop manual wire bonding (die bonding) device used in process development, production, and research. It features an adjustable work holder height to enhance flexibility. It offers high yield and excellent reproducibility for all bonding applications, including optoelectronic modules, hybrid/MCM, microwave products, and chip-on-board. 【Product Lineup】 - Dual wire bonding device (easily switchable between wedge/ball settings) - Ball wire bonding device - Wedge wire bonding device 【Features】 - Adjustable work holder height for improved flexibility - Compatible with copper wire bonding - Ergonomically designed for ease of use - 24/7 online technical support

  • Bonding Equipment
  • Bonding Equipment

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Tabletop Manual Wire Bonder (Ball/Wedge Compatible)

Tabletop Manual Wire Bonder (Ball/Wedge Compatible)

Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

This product is an advanced tabletop dual (ball/wedge) wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It is suitable for R&D and small-scale production, equipped with a user-friendly touch panel. Bonding can be performed simply by clicking the mouse at the bonding position. Since it uses only the minimum necessary parameters, adjusting the bonding parameters is easy. 【Features】 ■ Supports copper wire bonding ■ Easy switching between wedge/ball settings ■ Adjustable work holder height for improved flexibility ■ Year-round online technical support *You can download the product documentation (PDF) from the link below.

  • Bonding Equipment
  • Bonding Equipment

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Tabletop Wedge Wire Bonding Device "iBond5000"

Tabletop Wedge Wire Bonding Device "iBond5000"

Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

This product is an advanced tabletop wedge wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It allows for Y-direction table movement settings via parameters, making bonding of pitch wires and parallel wires easy. Parameter import and export using USB is possible. 【Features】 ■ Supports copper wire bonding ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height for improved flexibility ■ Ergonomically designed for ease of use *You can download the product documentation (PDF) from the link below.

  • Bonding Equipment
  • Bonding Equipment

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HeavyWire Wedge Breakthrough

HeavyWire Wedge Breakthrough

Increase in bond numbers, shortening of cleaning cycles, improvement in productivity!

This document is an explanatory material about heavy wire wedges. It includes features of chip design aimed at reducing buildup, as well as key development activities. With MPP's unique chip design, buildup and wear are minimized, enhancing performance and durability. [Contents] - Challenge: Improvement of MTBA - Features of chip design to reduce buildup - Features of chip design to decrease buildup - Key development activities - Value proposition *For more details, please download the PDF or feel free to contact us.

  • Other machine elements
  • Bonding Equipment

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Useful for semiconductor backend processes! Design pickup tools in any format.

Useful for semiconductor backend processes! Design pickup tools in any format.

We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.

Currently providing a complete set of tools for semiconductor backend processes. We offer unique designs tailored to applications such as collets, needles, and bonding devices. There are numerous cases where we have assisted companies in producing high-quality products without damaging the semiconductors. We have received satisfaction feedback from 98% of the companies using our products.

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Bonding Equipment

ブックマークに追加いたしました

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Tabletop Ball Wire Bonding Device 'iBond5000'

Tabletop Ball Wire Bonding Device 'iBond5000'

Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

This product is an advanced tabletop ball wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It comes standard with ESD coating and is suitable for R&D and small-scale production. By using only the minimum necessary parameters, it allows for easy adjustment of bonding parameters. 【Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height enhances flexibility ■ Compatible with copper wire bonding * You can download the product documentation (PDF) from below. * If you have any questions about the product or require support after installation, please feel free to contact the person in charge below.

  • Bonding Equipment
  • Bonding Equipment

ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

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