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Bonding Equipment - メーカー・企業9社の製品一覧とランキング

更新日： 集計期間:Sep 17, 2025～Oct 14, 2025
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Bonding Equipmentのメーカー・企業ランキング

更新日： 集計期間:Sep 17, 2025～Oct 14, 2025
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  1. ファインテック日本 Tokyo//Industrial Electrical Equipment
  2. Shinwa Co., Ltd. Mechatronics System Center Aichi//Industrial Machinery
  3. Micro Point Pro ltd 本社 Tokyo//Electronic Components and Semiconductors
  4. 4 アイテス Shiga//Electronic Components and Semiconductors
  5. 5 オルテコーポレーション 本社 Kyoto//Electronic Components and Semiconductors
企業ランキングへ

Bonding Equipmentの製品ランキング

更新日： 集計期間:Sep 17, 2025～Oct 14, 2025
※当サイトの各ページの閲覧回数を元に算出したランキングです。

  1. Instantly peel off adhesive with light! Clean and fast temporary bonding and debonding process. Shinwa Co., Ltd. Mechatronics System Center
  2. Regarding the bonding interface of Cu wire bonding. アイテス
  3. Tabletop Manual Wire Bonder "IBOND5000" Micro Point Pro ltd 本社
  4. Technical Data: Laser-Assisted Die Bonding ファインテック日本
  5. 5 Useful for semiconductor backend processes! Design pickup tools in any format. オルテコーポレーション 本社

Bonding Equipmentの製品一覧

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[Blog] Now, let's start the demonstration!

[Blog] Now, let's start the demonstration!

Remote acceptance testing for the purchased equipment! Offering various virtual experiences.

Due to COVID-19, we have become accustomed to seeing ourselves on screen. Of course, there is no problem with holding online meetings. However, to be honest, I don't really like seeing myself, and I think many people can relate to this feeling. Nevertheless, our sales team, application engineers, and product managers have become less shy about the camera. In this blog, we introduce "Can you see me? Let's start the demonstration!" *For more details, you can view the content in the PDF document. Please feel free to contact us for more information.

  • Other services

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Technical Data: Multi-Emitter Module Assembly

Technical Data: Multi-Emitter Module Assembly

Detailed information on the assembly and bonding of multi-emitter modules.

In applications such as cutting, welding, and marking, fiber laser solutions are increasingly replacing traditional methods. In recent years, the manufacturing costs of semiconductor laser chips have been continuously reduced, but the current single largest cost factor is in assembly and packaging, primarily due to the manual processes involved in second-level packaging where the CoS is attached to the heat sink. To address this issue, Finetech has developed, evaluated, and provided an automated solution for packaging CoS to heat sinks using new bonding technologies. This technical paper will explain this. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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Technical Data: Laser-Assisted Die Bonding

Technical Data: Laser-Assisted Die Bonding

Detailed information on laser-assisted die bonding.

Fine Tech's laser-assisted die bonding technology is suitable for chip-to-substrate (C2S) and chip-to-wafer (C2W) applications that require precise control of process speed, accuracy, and localized heating. In particular, rapid temperature cycling minimizes the risk of surface oxidation and enables the shortening of process cycles in production environments where temporal optimization is required. In continuous bonding processes at the substrate or wafer level, each chip is heated only once. Additionally, unlike area heating, localized laser heating does not require extensive equipment to prevent thermal expansion. Laser-assisted die bonding with such features is an effective technology newly added to Fine Tech's assembly and packaging technology. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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Technical Data: Heat Press Bonding

Technical Data: Heat Press Bonding

Detailed information on hot pressing bonding.

Thermal compression bonding is a quick and easy method for reliably joining flip chips. Many bonding processes, such as eutectic soldering implemented with load in laser bar soldering, are fundamentally classified in this category. This technical paper focuses on specific thermal compression processes used in combination with gold stud bumps or indium bumps. Flip chip bonding using this bonding method has many advantages and excellent bonding characteristics. Nevertheless, as this document indicates, it is still a niche technology and not widely adopted. Here, we provide a general overview of the process and its parameters. We also address common challenges when adopting this technology and introduce ways to solve them using the FINEPLACER die bonding equipment. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other semiconductor manufacturing equipment

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Semi-Automatic Wire Bonder 'MODEL 56xx Series'

Semi-Automatic Wire Bonder 'MODEL 56xx Series'

Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.

The "MODEL56xx series" is a versatile bonder that can automatically perform wire bonding and pull/share tests, despite being a tabletop model. It is suitable for users who find bonding difficult with manual machines and do not require the production volume of fully automatic machines. Various optional features, such as automatic recognition and monitoring of wire deformation during bonding, can be easily added. 【Features】 ■ Diverse functions (6 in 1 Unit all-in-one) ■ User-friendly software ■ High flexibility ■ Wide work area ■ Various optional features *For more details, please refer to the PDF materials or feel free to contact us.

  • Bonding Equipment

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Cu Ribbon Laser Bonding Device 'CURL-1510'

Cu Ribbon Laser Bonding Device 'CURL-1510'

Since it joins while forming, it is possible to mix different joining shapes with just one machine!

The CURL-1510 is a laser bonding device that ensures electrical capacitance by using Cu ribbons. Since Cu has advantageous electrical capacitance, it allows for changes in the manufacturing process from the design stage of power modules. Additionally, because it uses laser bonding, the pressure applied to the module can be kept low. 【Features】 - It can bond different joint shapes with a single machine while forming. - It can bond even shapes with steps, and the Cu ribbon itself has excellent resistance to tipping. - It ensures accuracy by correcting the position of the bonding points through image recognition. - The use of laser bonding keeps the pressure applied to the module low. *For more details, please download the PDF or feel free to contact us.

  • Other processing machines

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Tabletop Manual Wire Bonder "IBOND5000"

Tabletop Manual Wire Bonder "IBOND5000"

Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

The "IBOND5000" is an advanced tabletop manual wire bonding (die bonding) device used in process development, production, and research. It features an adjustable work holder height to enhance flexibility. It offers high yield and excellent reproducibility for all bonding applications, including optoelectronic modules, hybrid/MCM, microwave products, and chip-on-board. 【Product Lineup】 - Dual wire bonding device (easily switchable between wedge/ball settings) - Ball wire bonding device - Wedge wire bonding device 【Features】 - Adjustable work holder height for improved flexibility - Compatible with copper wire bonding - Ergonomically designed for ease of use - 24/7 online technical support

  • Bonding Equipment

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Tabletop Manual Wire Bonder (Ball/Wedge Compatible)

Tabletop Manual Wire Bonder (Ball/Wedge Compatible)

Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

This product is an advanced tabletop dual (ball/wedge) wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It is suitable for R&D and small-scale production, equipped with a user-friendly touch panel. Bonding can be performed simply by clicking the mouse at the bonding position. Since it uses only the minimum necessary parameters, adjusting the bonding parameters is easy. 【Features】 ■ Supports copper wire bonding ■ Easy switching between wedge/ball settings ■ Adjustable work holder height for improved flexibility ■ Year-round online technical support *You can download the product documentation (PDF) from the link below.

  • Bonding Equipment

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Tabletop Wedge Wire Bonding Device "iBond5000"

Tabletop Wedge Wire Bonding Device "iBond5000"

Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

This product is an advanced tabletop wedge wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It allows for Y-direction table movement settings via parameters, making bonding of pitch wires and parallel wires easy. Parameter import and export using USB is possible. 【Features】 ■ Supports copper wire bonding ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height for improved flexibility ■ Ergonomically designed for ease of use *You can download the product documentation (PDF) from the link below.

  • Bonding Equipment

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HeavyWire Wedge Breakthrough

HeavyWire Wedge Breakthrough

Increase in bond numbers, shortening of cleaning cycles, improvement in productivity!

This document is an explanatory material about heavy wire wedges. It includes features of chip design aimed at reducing buildup, as well as key development activities. With MPP's unique chip design, buildup and wear are minimized, enhancing performance and durability. [Contents] - Challenge: Improvement of MTBA - Features of chip design to reduce buildup - Features of chip design to decrease buildup - Key development activities - Value proposition *For more details, please download the PDF or feel free to contact us.

  • Other machine elements

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Useful for semiconductor backend processes! Design pickup tools in any format.

Useful for semiconductor backend processes! Design pickup tools in any format.

We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.

Currently providing a complete set of tools for semiconductor backend processes. We offer unique designs tailored to applications such as collets, needles, and bonding devices. There are numerous cases where we have assisted companies in producing high-quality products without damaging the semiconductors. We have received satisfaction feedback from 98% of the companies using our products.

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  • Bonding Equipment
  • Other semiconductor manufacturing equipment

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[Research Material] Global Market for Semiconductor Packaging Test Equipment

[Research Material] Global Market for Semiconductor Packaging Test Equipment

Global Market for Semiconductor Packaging Test Equipment: Chip Bonding Equipment, Inspection & Cutting Equipment, Packaging Equipment, Wire Bonding Equipment, Electrical Me...

This research report (Global Semiconductor Packaging Testing Equipment Market) investigates and analyzes the current state of the global semiconductor packaging testing equipment market and its outlook for the next five years. It includes information on the overview of the global semiconductor packaging testing equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include chip bonding equipment, inspection and cutting equipment, packaging equipment, wire bonding equipment, electroplating equipment, and others, while the segments by application focus on integrated device manufacturing and semiconductor assembly. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor packaging testing equipment. The report also includes the market share of major companies in the semiconductor packaging testing equipment sector, product and business overviews, and sales performance.

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Tabletop Ball Wire Bonding Device 'iBond5000'

Tabletop Ball Wire Bonding Device 'iBond5000'

Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

This product is an advanced tabletop ball wire bonding (die bonding) device used for process development, manufacturing, research, and manufacturing support. It comes standard with ESD coating and is suitable for R&D and small-scale production. By using only the minimum necessary parameters, it allows for easy adjustment of bonding parameters. 【Features】 ■ Provides high yield and excellent reproducibility for bonding applications ■ Adjustable work holder height enhances flexibility ■ Compatible with copper wire bonding * You can download the product documentation (PDF) from below. * If you have any questions about the product or require support after installation, please feel free to contact the person in charge below.

  • Bonding Equipment

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[Research Material] Global Market for Die Bonding Equipment

[Research Material] Global Market for Die Bonding Equipment

Global Market for Die Bonding Equipment: Fully Automatic, Semi-Automatic, Manual, Integrated Device Manufacturers (IDM), Outsourced Semiconductor Assembly and Test ...

This research report (Global Die Bonding Equipment Market) investigates and analyzes the current state and outlook for the global die bonding equipment market over the next five years. It includes information on the overview of the global die bonding equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include fully automatic, semi-automatic, and manual, while the segments by application focus on integrated device manufacturers (IDM) and outsourced semiconductor assembly and test (OSAT). The regional segments calculate the market size of die bonding equipment by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in die bonding equipment, product and business overviews, and sales performance.

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