AeroFix for Wafer Protection in Semiconductor Manufacturing
Achieving stable adhesion without deflection for wafer protection.
In the semiconductor manufacturing industry, the wafer protection process requires precise fixation to prevent fine scratches and contamination. Particularly when handling thin and delicate wafers, there have been cases where the warping caused by the material being drawn into the air release holes of conventional vacuum chuck products has led to quality issues. Our high-precision porous ceramic vacuum chuck, "Aerofix," was developed to address such challenges. It enables partial adsorption without warping, stabilizing and protecting the wafer. 【Usage Scenarios】 - Transporting and fixing wafers - Processes requiring precise positioning 【Benefits of Implementation】 - Reduces the occurrence of suction marks on wafers - Ensures stable adsorption of delicate materials
- Company:ナノテム
- Price:Other