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UV/O3 cleaner; UV ozone cleaner
UV-1 is a research and development cleaning device designed to efficiently perform complete dry processing of various semiconductor processes, such as photoresist ashing, silicon wafer cleaning, and chrome mask cleaning, through the interaction of high-concentration ozone and ultraviolet irradiation.
UV/O3 cleaner; UV ozone cleaner
The UV-300 is a cleaning device developed to efficiently perform complete dry processing of various semiconductor processes, such as photoresist ashing, silicon wafer cleaning, and chrome mask cleaning, through the interaction of high-concentration ozone and ultraviolet irradiation.
UV/O3 Cleaner - UV Ozone Cleaner
The UV-300H is a cleaning device developed to efficiently perform complete dry processing of various semiconductor processes such as photoresist ashing, silicon wafer cleaning, and chrome mask cleaning through the interaction of high-concentration ozone and ultraviolet irradiation. This device enables faster processing compared to conventional UV/O3 treatment.
This is a batch-type plasma cleaner that is ideal for surface cleaning of plastic packages, LCD substrates, hybrid ICs, and more.
The reaction chamber can be equipped with multiple tiers of electrode shelves, allowing for the processing of a large number of substrates in various shapes, from small components to square substrates for FPD. Additionally, it is a plasma cleaner that can select from three processing modes (RIE mode, plasma mode, downstream mode), enabling optimal processing according to the type of substrate.
Cleaning equipment, UV/O3 cleaning equipment, dry cleaning equipment, cleaner (cleaning device), stripper (stripping device)
● No vacuum system is required due to atmospheric pressure operation ● Compact design ● Easy to operate and maintain ● Low cost
Dry etching equipment, reactive ion etching equipment, compact etcher, ashing equipment, cleaner (cleaning equipment)
● Only one-touch operation is required, with no special procedures needed. ● It has a small installation space and does not require a specific location. ● It can accommodate samples up to φ4 inches. ● Being a dedicated device, it is low-priced.
It is a batch-type plasma cleaning device (plasma cleaner) suitable for surface modification.
This device allows you to select the processing mode from RIE mode and plasma mode, enabling optimal processing according to the type of substrate. Additionally, it is a very compact tabletop plasma cleaner designed to save space and can be used in various locations.
Achieving safe reduction and cleaning of metal oxide films! Plasma treatment device using water vapor.
The "Aqua Plasma Cleaner" is a plasma treatment device that primarily uses water vapor. It can safely and efficiently perform surface treatments such as the reduction of metal oxide films, cleaning of organic contaminants, photoresist ashing, and hydrophilization. It can be applied to the reduction, modification, and cleaning of silver and copper electrodes, as well as the reduction of other metal oxides, surface modification of resins, hydrophilization, and ashing. 【Features】 ■ Achieves safe reduction and cleaning of metal oxide films ■ Addition of oxygen enables faster cleaning speeds ■ Built-in automatic control system for water vapor generation and supply ■ Dedicated design reduces installation area to 60% of conventional models ■ Supports multi-stage processing (up to 3 stages) *For more details, please refer to the PDF document or feel free to contact us.
