We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Etching Equipment.
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Etching Equipment Product List and Ranking from 34 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  4. 4 伯東 本社 Tokyo//Electronic Components and Semiconductors
  5. 5 二宮システム Osaka//others
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  2. Ion Beam Milling and Etching Equipment - Hakuto/Ns 伯東 本社
  3. Photo Mask Dry Etching Equipment for Research and Development Purposes プラズマ・サーモ・ジャパン
  4. ICP etching equipment RIE-800iPC/RIE-400iPC サムコ
  5. 5 ICP metal etching equipment 神港精機 東京支店

Etching Equipment Product List

76～80 item / All 80 items

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Cu etching compatible high-density plasma etching device

Cu etching compatible high-density plasma etching device

Equipped with a new plasma source HCD (hollow cathode discharge) electrode, capable of etching various metals and Cu thin films. A new type of etching device that also facilitates large-area processing.

Equipped with a newly developed plasma source HCd (hollow cathode discharge) type electrode. Achieves a plasma density that is an order of magnitude higher than conventional electrodes with a simple k structure that is free of magnetic fields and antennas. Supports etching of not only various metals but also difficult-to-etch materials such as Cu thin films with uniquely developed high-density plasma and proprietary processes. The newly developed HCD type head allows for easy scale-up and enables high-precision etching of rectangular substrates and large substrates. Supports metal etching of 300 mm wafers, stacked substrates, and substrates up to 1 m². A new type of etching device that covers semiconductor peripheral materials (photo masks, high-density mounting substrates) that have seen increasing demand in recent years, breaking away from conventional plasma etching methods.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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[English Market Research Report] Semiconductor Dielectric Etching Equipment Market

[English Market Research Report] Semiconductor Dielectric Etching Equipment Market

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The global semiconductor dielectric etching equipment market size reached 1.3 billion USD in 2023. Going forward, the IMARC Group forecasts a growth rate of 3.26% (CAGR) from 2024 to 2032, expecting it to reach 1.8 billion USD by 2032. One of the main factors driving the market is the significant expansion of the electronics industry, the increase in semiconductor demand, and the widespread adoption of smart devices.

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[Research Document] Global Market for Semiconductor Etching Equipment

[Research Document] Global Market for Semiconductor Etching Equipment

Global Market for Semiconductor Etching Equipment: Dry Etching Equipment, Wet Etching Equipment, Logic & Memory, MEMS, Power Supply Equipment, Others

This research report (Global Semiconductor Etch Equipment Market) investigates and analyzes the current state of the global semiconductor etching equipment market and its outlook for the next five years. It includes information on the overview of the global semiconductor etching equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the semiconductor etching equipment market by type include dry etching equipment and wet etching equipment, while the segments by application cover logic/memory, MEMS, power devices, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor etching equipment. The report also includes the market share of major companies in semiconductor etching equipment, product and business overviews, and sales performance.

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Fundamental and Fine Processing Correspondence in Wet Etching and Development of Advanced Material Applications

Fundamental and Fine Processing Correspondence in Wet Etching and Development of Advanced Material Applications

What is the cutting-edge etching for the formation of transparent electrode patterns for next-generation power device substrates, touch panels, and fine-pitch electronic components?!

**Lecturer** Mr. Kimihiko Ikeda, Head of the Implementation Materials Research Laboratory, Electronic Materials Development Research Institute, Research and Development Division, ADEKA Corporation **Target Audience** Engineers, researchers, and beginners interested in wet processes and wet etching technology **Venue** Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 4 [Tokyo, Nihonbashi] 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3) **Date and Time** December 26, 2011 (Monday) 13:30-16:30 **Capacity** 20 participants. *Registration will close once full. Please apply early.* **Participation Fee** **[Early Bird Discount Price]** 46,200 yen (tax included, including text costs) for up to 2 participants from one company. *Limited to Tech-Zone members who apply by December 12. Membership registration is free.* *After December 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company.*

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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[Research Material] Global Market for Wet Etching Equipment for Semiconductors

[Research Material] Global Market for Wet Etching Equipment for Semiconductors

World Market for Wet Etching Equipment for Semiconductors: Silica Wet Etching Equipment, Metal Wet Etching Equipment, Others, PCB Manufacturing, Chip Manufacturing, Others

This research report (Global Semiconductor Wet Etch Equipment Market) investigates and analyzes the current status and outlook for the global market of wet etching equipment for semiconductors over the next five years. It includes information on the overview of the global semiconductor wet etch equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include silica wet etch equipment, metal wet etch equipment, and others, while the segments by application focus on PCB manufacturing, chip manufacturing, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of wet etching equipment for semiconductors. It also includes the market share of major companies in the semiconductor wet etch equipment market, product and business overviews, and sales performance.

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