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Etching Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. 伯東 本社 Tokyo//Electronic Components and Semiconductors
  3. 神港精機 東京支店 Tokyo//Industrial Machinery
  4. 4 二宮システム Osaka//others
  5. 5 フジ機工 Niigata//Industrial Machinery
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ion Beam Milling and Etching Equipment - Hakuto/Ns 伯東 本社
  2. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  3. Small Etching Device for Research and Development HPE40 二宮システム
  4. 4 Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device フジ機工
  5. 5 Semiconductor and printed circuit board horizontal manufacturing equipment - Etching equipment (pattern formation) フジ機工

Etching Equipment Product List

31～45 item / All 82 items

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Ion Beam Milling and Etching Equipment - Hakuto/Ns

Ion Beam Milling and Etching Equipment - Hakuto/Ns

We propose the optimal dry etching equipment for processing difficult-to-etch materials such as Au, Pt, and magnetic materials!

Ion beam milling equipment is used as a fine processing device in dry processes, with a wide range of applications from research and development to production. Due to its physical etching process that does not involve chemical reactions, materials such as Au, Pt, magnetic materials, and metal multilayers can be easily processed. 【Features】 (1) Capable of fine processing difficult-to-etch materials (2) Metal multilayers can be processed in a one-step process (3) The self-rotating stage allows for uniform simultaneous processing of multiple wafers (4) The substrate cooling stage (water-cooled or water/gas-cooled) suppresses substrate temperature rise, preventing resist burning (5) The variable stage angle makes taper processing easy (anisotropic etching)

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Bulk Etching Device "BEM-301"

Bulk Etching Device "BEM-301"

It can be easily used by anyone simply by specifying the etching amount (depth) and the material of the wafer.

The "BEM-301" is a device that uses ozone and vaporized fluorine for etching. Etching is performed while monitoring the etching amount, allowing for high-precision etching. Additionally, accurate etching can be achieved even from the first piece. 【Specifications】 ■ Etching rate: 2μm/H or more ■ Flatness: within 10% ■ Accuracy of etching amount (depth): within ±5% ■ Utilities: O2, N2, HF, DIW, cooling water, AC-100V, AC-200V, acid exhaust, acid wastewater ■ External dimensions: 1,000W × 1,300D × 2,000H (mm) ■ Weight: approximately 300Kg *For more details, please download the PDF or contact us.

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Wet etching device "BATCHSPRAY Autoload"

Wet etching device "BATCHSPRAY Autoload"

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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BATCHSPRAY Acid/Clean Autoload

BATCHSPRAY Acid/Clean Autoload

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

This 3-chamber system utilizes a patented retainer comb processing system, accommodating all types of wet etching processes and cleaning applications. The combination of acid/cleaning allows for high process flexibility and high throughput. By using SicOzone instead of peroxides or sulfuric acid for sustainable processes such as cleaning and resist stripping, it can reduce the consumption of chemicals and deionized water by up to 90%. 【Features】 ■ Throughput of up to 400 wph ■ Two cleaning process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recirculation through a tank system ■ EPD - End Point Detection *For more details, please download the catalog or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Small Thin Plate Etching Device FBE40

Small Thin Plate Etching Device FBE40

Small thin plate etching device FBE40

【Process】Input → Air Knife → Etching → Air Knife → Recirculating Water Wash → Direct Water Wash → Air Knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1445×L2010×H1230mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

  • Other surface treatment equipment
  • Etching Equipment
  • Other laboratory equipment and containers

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Compact Ultra-High Precision Etching Device MPE40

Compact Ultra-High Precision Etching Device MPE40

Compact Ultra-High Precision Etching Device MPE40

【Process】 Input → Etching → Liquid Drain → Acid Wash → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

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  • Etching Equipment
  • Other laboratory equipment and containers

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High-precision processing type micro-etching device

High-precision processing type micro-etching device

High-precision processing type micro-etching device

Achieves uniform surface accuracy with no irregularities in processing, compatible with thin plate transport (t50μm).

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Single-wafer plasma etching device "EXAM-Σ"

Single-wafer plasma etching device "EXAM-Σ"

Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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HCD type high-density plasma etching device

HCD type high-density plasma etching device

Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.

Achieves a plasma density that is an order of magnitude higher compared to conventional capacitively coupled plasma etching devices. High-precision etching is possible solely through innovations in the electrode structure, without using high-frequency antennas or magnets. It also has high hardware compatibility with conventional etching devices (CCP type and ICP type), contributing to low cost, high reliability, and operational efficiency. Capable of etching not only wafer-level substrates but also large substrates. A new type of high-density plasma etching device that can smoothly accommodate the increase in substrate size.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment

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Large plasma etching device

Large plasma etching device

Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

  • Etching Equipment
  • Plasma surface treatment equipment

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Dry etching equipment / XeF2 etching equipment

Dry etching equipment / XeF2 etching equipment

XeF2 etching device

● Since it is a completely dry process, it is possible to suppress the destruction of self-supporting devices due to stiction. ● No pre-treatment or post-treatment is required in the wet process. ● By intermittently flowing gas and etching, it is easy to control the etching speed and gas usage. ● Since it does not use plasma, there is no damage to the device from electric fields (electron or ion impact). ● Designed for research and development purposes, it is very compact and tabletop in design. ● As it is a dedicated machine, it is low-cost.

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ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

The RIE-330iPC is a multi-wafer processing etching device for compound semiconductor processes that employs an inductively coupled plasma (ICP) discharge method. 【Features】 ○ Compatible with large trays of Φ330mm Up to 27 pieces for Φ2-inch wafers, 17 pieces for Φ2.5-inch wafers, 12 pieces for Φ3-inch wafers, 7 pieces for Φ4-inch wafers, and 3 pieces for Φ6-inch wafers can be processed simultaneously. ○ By adopting the new SSTC (Symmetrical Shielded Tornado Coil) electrode as the ICP source, it enables high selectivity and excellent uniformity in etching over large areas. ○ Allows for low-damage processes at low bias (below -100V). ○ Stable etching conditions can be achieved through temperature control of the substrate stage and the inner walls of the reaction chamber. ○ A turbo molecular pump is also used in the load lock chamber, providing a more stable process.

  • Etching Equipment
  • Wafer processing/polishing equipment

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ICP etching equipment RIE-800iPC/RIE-400iPC

ICP etching equipment RIE-800iPC/RIE-400iPC

Introducing a full-scale production device equipped with a vacuum cassette chamber, offering excellent process reproducibility and stability.

The "RIE-800iPC/RIE-400iPC" is an ICP etching device that boasts stability for continuous processing of 25 SiC trench-shaped wafers. It can efficiently and stably apply high RF power (over 2 kW), achieving good uniformity. Additionally, by adopting an exhaust system directly connected to the reaction chamber, it realizes a wide process window from low flow and low pressure to high flow and high pressure. 【Features】 <RIE-800iPC> ■ Supports maximum Φ8” wafers ■ Uses inductively coupled plasma for discharge ■ Equipped with a vacuum cassette chamber, excelling in process reproducibility and stability ■ Optimizes the distance between the wafer and plasma to ensure good in-plane uniformity ■ Integrates TMP (Turbo Molecular Pump) and high-frequency power supply for easy replacement *For more details, please refer to the PDF document or feel free to contact us.

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Small etching device

Small etching device

Spin etcher that sprays etching solution while rotating the substrate.

The program can save up to 99 steps × 50 patterns. We also offer other models and customization based on your needs, upon consultation.

  • Etching Equipment
  • Other semiconductor manufacturing equipment

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