High-precision processing type micro-etching device
High-precision processing type micro-etching device
Achieves uniform surface accuracy with no irregularities in processing, compatible with thin plate transport (t50μm).
- Company：二宮システム
- Price：Other
Etching Equipment Product List and Ranking from 21 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Etching Equipment Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
- サムコ Kyoto//Industrial Machinery
- null/null
- 山縣機械 Osaka//Industrial Machinery ＦＴＰ事業部
- 4 プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
- 4 null/null
Etching Equipment Product ranking
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Etching Equipment Product List
31～45 item / All 64 items
Displayed results
Dry etching equipment / XeF2 etching equipment
XeF2 etching device
● Since it is a completely dry process, it is possible to suppress the destruction of self-supporting devices due to stiction. ● No pre-treatment or post-treatment is required in the wet process. ● By intermittently flowing gas and etching, it is easy to control the etching speed and gas usage. ● Since it does not use plasma, there is no damage to the device from electric fields (electron or ion impact). ● Designed for research and development purposes, it is very compact and tabletop in design. ● As it is a dedicated machine, it is low-cost.
- Company：サムコ
- Price：Other
ICP etching equipment for compound semiconductor processes
ICP etching equipment for compound semiconductor processes
The RIE-330iPC is a multi-wafer processing etching device for compound semiconductor processes that employs an inductively coupled plasma (ICP) discharge method. 【Features】 ○ Compatible with large trays of Φ330mm Up to 27 pieces for Φ2-inch wafers, 17 pieces for Φ2.5-inch wafers, 12 pieces for Φ3-inch wafers, 7 pieces for Φ4-inch wafers, and 3 pieces for Φ6-inch wafers can be processed simultaneously. ○ By adopting the new SSTC (Symmetrical Shielded Tornado Coil) electrode as the ICP source, it enables high selectivity and excellent uniformity in etching over large areas. ○ Allows for low-damage processes at low bias (below -100V). ○ Stable etching conditions can be achieved through temperature control of the substrate stage and the inner walls of the reaction chamber. ○ A turbo molecular pump is also used in the load lock chamber, providing a more stable process.
- Company：サムコ
- Price：Other
ICP etching equipment RIE-800iPC/RIE-400iPC
Introducing a full-scale production device equipped with a vacuum cassette chamber, offering excellent process reproducibility and stability.
The "RIE-800iPC/RIE-400iPC" is an ICP etching device that boasts stability for continuous processing of 25 SiC trench-shaped wafers. It can efficiently and stably apply high RF power (over 2 kW), achieving good uniformity. Additionally, by adopting an exhaust system directly connected to the reaction chamber, it realizes a wide process window from low flow and low pressure to high flow and high pressure. 【Features】 <RIE-800iPC> ■ Supports maximum Φ8” wafers ■ Uses inductively coupled plasma for discharge ■ Equipped with a vacuum cassette chamber, excelling in process reproducibility and stability ■ Optimizes the distance between the wafer and plasma to ensure good in-plane uniformity ■ Integrates TMP (Turbo Molecular Pump) and high-frequency power supply for easy replacement *For more details, please refer to the PDF document or feel free to contact us.
- Company：サムコ
- Price：Other
Small etching device
Spin etcher that sprays etching solution while rotating the substrate.
The program can save up to 99 steps × 50 patterns. We also offer other models and customization based on your needs, upon consultation.
- Company：アクテス京三 技術センター
- Price：Other
Tabletop Etching Device ES-10/ES30
Easy and efficient etching with air jets.
A tabletop etching device capable of simultaneous etching of double-sided substrates, as well as etching multiple sheets together.
- Company：サンハヤト
- Price：Other
Substrate manufacturing device - Spray-type small etching device
Is it still manual? Introducing the "spray-type small etching device" suitable for testing and experiments in a tabletop size! Examples of use such as etching films!
The "Spray-Type Compact Etching Device" is a tabletop-sized device for etching processes, such as those used for printed circuit boards, as well as for developing processes. It uses the chemical reaction of etching solution (ferric chloride) to etch (chemically corrode, engrave) copper foil according to the circuit pattern. By replacing manual tasks with the spray-type compact etching device, reproducibility improves and work efficiency increases! It has also been used for etching during printing on films, making it versatile for various applications! 【Features】 - Simple processing by just inserting the substrate due to the conveyor transport method - Spray (single-sided) type allows for high-quality substrates in a short time - Recommended for small-scale etching for experiments and prototypes - Supports work sizes up to 150×200mm - Compact type that can be placed on a desk for use By using the optional dedicated exhaust treatment cover (MODEL ES-400FC), it can be connected to exhaust devices such as Sunhayato's ES-F2 and KS-8. *For more details, please contact us or download the PDF materials for further information.
- Company：サンハヤト
- Price：Other
Etching device
Etching device
Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
