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Etching Equipment Product List and Ranking from 21 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. null/null
  3. 山縣機械 Osaka//Industrial Machinery ＦＴＰ事業部
  4. 4 プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  5. 4 null/null
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  2. ICP etching equipment RIE-800iPC/RIE-400iPC サムコ
  3. ICP metal etching equipment
  4. 4 Ion Beam Milling and Etching Equipment - Hakuto/Ns
  5. 4 Single-wafer plasma etching device "EXAM-Σ"

Etching Equipment Product List

46～60 item / All 64 items

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Etching device (1)

Etching device (1)

The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).

The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration of unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can continuously process very thin and extremely fragile materials without causing scratches or wrinkles. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
  • Other surface treatment equipment
  • Etching Equipment

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Etching device (2)

Etching device (2)

The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.

The device continuously performs etching on thin single-layer substrates such as FPC using a roll-to-roll transport method. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, the temperature and pressure of the chemical solutions are precisely controlled. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Roll-to-roll etching device

Roll-to-roll etching device

Introducing a device that transports thin products using our conveying technology, ensuring they are moved without scratches or wrinkles for continuous processing.

The "Roll to Roll Etching Device" is a machine that continuously processes thin products without scratches or wrinkles using our transport technology. The transport speed is typically 5.0m/min. We will propose the device configuration tailored to the resin film materials (such as aluminum, copper, stainless steel, etc.) that you are targeting. 【Features】 ■ Device size: 15000mm(L) × 2100mm(W) × 2600mm(H) ■ Base material width: MAX 310mm ■ Processing steps: Unwinding ⇒ Etching processing ⇒ Washing ⇒ Drying ⇒ Winding ■ Transport speed: Typically 5.0m/min *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements

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Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device

Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device

Vacuum etching device

This is a vacuum etching device for substrate creation. Utilizing our proud chip-on-flexible and tape-on-board technology, we can minimize the substrate circuit width to as small as 25μm. 【Features】 ◆ Utilizing industry-leading vacuum etching technology ◆ Through collaboration with our other substrate manufacturing machines, we can minimize the circuit width to 25μm ■□■□■□■□■□■□■□■□■□■□■□■□ ＝＝＝＝＝ For more details, please contact us＝＝＝＝＝

  • Other machine tools

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Semiconductor and printed circuit board horizontal manufacturing equipment - Etching equipment (pattern formation)

Semiconductor and printed circuit board horizontal manufacturing equipment - Etching equipment (pattern formation)

High-precision pattern processing is achieved through vacuum etching technology! It finishes without variation across the surface.

We would like to introduce the etching equipment for pattern formation handled by Fujikiko Co., Ltd. Our vacuum etching technology enables high-precision pattern processing, resulting in minimal variation across the surface. Additionally, we can accommodate everything from fine semiconductor package substrates to thick copper substrates. 【Features】 ■ Supports from sheet substrates to flexible substrates via Roll to Roll ■ Accommodates fine semiconductor package substrates to thick copper substrates ■ Achieves high-precision pattern processing through vacuum etching technology ■ Finishes with minimal variation across the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)
  • Circuit board processing machine
  • Etching Equipment

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[Demo in Progress!] Small Experimental Ion Beam Etching Device

[Demo in Progress!] Small Experimental Ion Beam Etching Device

[Demo in progress!] Experimental device equipped with an ion source that can be customized to meet usage needs.

The "Small Experimental Ion Beam Etching Device" uses a DC ion source and is equipped with a substrate rotation cooling single stage. It easily etches materials such as Au, Pt, and magnetic materials, and taper processing can also be done easily. Processing is possible at a substrate surface temperature of 80°C or lower. It is ideal for microfabrication. 【Features】 ● No toxic gases are used, so exhaust gas treatment is unnecessary ● Endpoint detector can be installed ● For inquiries or questions about ion beam etching devices, ion sources, and ion beam technology, please feel free to consult us. For more details, please download the catalog or contact us.

  • Etching Equipment

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Small Ion Beam Etching Device

Small Ion Beam Etching Device

This is an ion beam etching device that uses an ion source to irradiate the target material with an ion beam and perform dry etching.

The small ion beam etching device uses a DC ion source and is an ion beam etching (IBE) device equipped with a substrate rotation cooling single stage. It is capable of etching fine patterns, as well as metal and magnetic materials. 【Features】 ○ Easily etches Au, Pt, magnetic materials, etc. ○ Taper processing is easy ○ Processing is possible at substrate surface temperatures below 80°C ○ No toxic gases are used, so exhaust gas treatment is unnecessary ○ Can be equipped with an endpoint detector For more details, please contact us or download the catalog.

  • Etching Equipment

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Roll-to-roll (RtoR) film etching device

Roll-to-roll (RtoR) film etching device

The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.

The "Roll-to-Roll (RtoR) Film Etching Device" continuously etches roll-to-roll films. In roll-to-roll (RtoR) film transport, excessive tension can cause the substrate to stretch. Our company has implemented a tension control drive in the middle to ensure that the film is transported without exceeding a certain load. By minimizing the number of transport rolls and maximizing the spray range without interfering with the spray ejection from the transport rolls, we achieve high spray efficiency. 【Features】 ■ Continuous etching of M-ITO films and ITO films is possible ■ Film transport technology at low tension ■ High spray efficiency *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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PDP manufacturing equipment - etching equipment

PDP manufacturing equipment - etching equipment

If it's about making etching machines, Kimura Etching.

We design and manufacture various wet processing equipment (etching, developing, stripping, cleaning, etc.) for applications ranging from research and development experimental devices to production equipment. The main material for the equipment body is PVC, but we also manufacture using PP, PVDF, and SUS depending on the chemicals and temperatures used. All of our equipment is custom-made to meet the specific requirements of our customers. We also undertake on-site work such as equipment modifications and relocations.

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GaAs etching equipment

GaAs etching equipment

Automatically mixes the chemical solution and delivers the required amount to the etching tank! It employs a sequencer control method.

The product is a device that automatically transports and etches GaAs wafers using a dedicated basket. When GaAs wafers placed in the basket from the loader section are introduced, they are automatically transported by a conveyor from the loader section to the etching tank, rinse tank, and unloader section. Additionally, there is a chemical supply tank located at the bottom of the device, which automatically mixes the chemicals and supplies the necessary amount to the etching tank. 【Main Specifications】 ■ Heated material: GaAs (Gallium Arsenide) block ■ Cassette: Dedicated PTFE cassette ■ Conveyor: Automatic robot transport (servo motor driven) ■ Control method: Sequencer control *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Glass Etching Equipment [LCD Glass Substrate] | NSCEng

Glass Etching Equipment [LCD Glass Substrate] | NSCEng

As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.

× The tact does not match in mechanical polishing. × Glass dissolution with hydrofluoric acid does not result in a clean finish. We solve such problems. Our glass etching equipment comes in two types: "immersion dip type" and "sheet transport spray type." Both are devices with numerous achievements as mass production equipment. 【Features of Our Equipment】 ■ Achievable Cpk of 1.33 or higher with target plate thickness of ±30μm ■ One-pass finishing possible with automatic thickness control ■ Low cost achieved through liquid regeneration system ■ Latest technology enables transport of thicknesses down to 30μm ■ Designed with a focus on chemical resistance for long-lasting equipment ■ Complete with safety interlocks ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ Example of Processing 【Type of Glass】 Non-alkali glass, soda glass, aluminosilicate glass 【Product Size】 300×400 to 1500×1850mm 【Processing Accuracy】 In-plane thickness accuracy of R10μm after 70% reduction 【Main Chemical】 Hydrofluoric acid ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ 【Notes】 - Proposals, design, and manufacturing possible from development prototypes - Sample processing using actual liquid is possible

  • Other processing machines
  • Etching Equipment
  • Other surface treatment equipment

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Defective Analysis Etching Device '200FA/200R/200I'

Defective Analysis Etching Device '200FA/200R/200I'

Removal of unnecessary areas through stripping treatment! Introducing the defective analysis etching equipment handled by our company.

The "200FA/200R/200I" is a defect analysis device for semiconductor chips and wafers. Through the delamination process, it is possible to remove unnecessary areas and analyze the causes of defects. 【Features】 ■ Selectable delamination technologies (RIE, HCD, ICPRIE) ■ Flexibility in sample shapes (die, package die, wafer fragments, full wafers) ■ Flexibility in transport (direct load, pre-load shuttle, pre-load shuttle with load lock) * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Other analyses

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Plasma-based atomic layer etching device "Takachi ALE"

Plasma-based atomic layer etching device "Takachi ALE"

Etching of surface monolayers! It can minimize damage to the etched object!

We would like to introduce our plasma-based atomic layer etching device, the 'Takachi ALE.' The Takachi system enables the ALE process by incorporating an ALE kit. Since etching is performed one atomic layer at a time on the surface, it minimizes damage to the etched object. 【Features】 ■ Equipped with an ALE kit, enabling the ALE process ■ Etches one atomic layer at a time on the surface ■ Minimizes damage to the etched object *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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