Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
46～60 item / All 82 items
Demo units available for loan! This is a device that performs a series of cleaning and etching processes, including pure water treatment and drying.
The spray-type wafer etching device performs a series of cleaning and etching processes, followed by pure water treatment and drying. For more details, please contact us or refer to the catalog.
Demo units available for loan! After pre-processing with a cassette, automatic etching is performed with a dedicated barrel.
This machine is a device for cleaning and etching wafers. After pre-treatment in a cassette, automatic etching is performed in a dedicated barrel. For more details, please contact us.
Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.
The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.
Easy and efficient etching with air jets.
A tabletop etching device capable of simultaneous etching of double-sided substrates, as well as etching multiple sheets together.
Is it still manual? Introducing the "spray-type small etching device" suitable for testing and experiments in a tabletop size! Examples of use such as etching films!
The "Spray-Type Compact Etching Device" is a tabletop-sized device for etching processes, such as those used for printed circuit boards, as well as for developing processes. It uses the chemical reaction of etching solution (ferric chloride) to etch (chemically corrode, engrave) copper foil according to the circuit pattern. By replacing manual tasks with the spray-type compact etching device, reproducibility improves and work efficiency increases! It has also been used for etching during printing on films, making it versatile for various applications! 【Features】 - Simple processing by just inserting the substrate due to the conveyor transport method - Spray (single-sided) type allows for high-quality substrates in a short time - Recommended for small-scale etching for experiments and prototypes - Supports work sizes up to 150×200mm - Compact type that can be placed on a desk for use By using the optional dedicated exhaust treatment cover (MODEL ES-400FC), it can be connected to exhaust devices such as Sunhayato's ES-F2 and KS-8. *For more details, please contact us or download the PDF materials for further information.
Customization specifications tailored to your requests. We can accommodate everything from experimental machines to production machines.
This is a device for processing sheet substrates used in LCD glass and touch panels. 【Features】 - Compatible with workpieces ranging from 100mm to 1000mm square (other sizes and shapes can be discussed separately) - By adding a swinging mechanism (horizontal swinging and spray nozzle pivoting), processing efficiency is improved - Cassette-to-cassette operation is also possible *For more details, please download the PDF (catalog) or feel free to contact us.
Etching device
Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.
The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).
The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration of unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can continuously process very thin and extremely fragile materials without causing scratches or wrinkles. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.
The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.
The device continuously performs etching on thin single-layer substrates such as FPC using a roll-to-roll transport method. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, the temperature and pressure of the chemical solutions are precisely controlled. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.
Introducing a device that transports thin products using our conveying technology, ensuring they are moved without scratches or wrinkles for continuous processing.
The "Roll to Roll Etching Device" is a machine that continuously processes thin products without scratches or wrinkles using our transport technology. The transport speed is typically 5.0m/min. We will propose the device configuration tailored to the resin film materials (such as aluminum, copper, stainless steel, etc.) that you are targeting. 【Features】 ■ Device size: 15000mm(L) × 2100mm(W) × 2600mm(H) ■ Base material width: MAX 310mm ■ Processing steps: Unwinding ⇒ Etching processing ⇒ Washing ⇒ Drying ⇒ Winding ■ Transport speed: Typically 5.0m/min *For more details, please refer to the PDF document or feel free to contact us.
Vacuum etching device
This is a vacuum etching device for substrate creation. Utilizing our proud chip-on-flexible and tape-on-board technology, we can minimize the substrate circuit width to as small as 25μm. 【Features】 ◆ Utilizing industry-leading vacuum etching technology ◆ Through collaboration with our other substrate manufacturing machines, we can minimize the circuit width to 25μm ■□■□■□■□■□■□■□■□■□■□■□■□ ＝＝＝＝＝ For more details, please contact us＝＝＝＝＝
High-precision pattern processing is achieved through vacuum etching technology! It finishes without variation across the surface.
We would like to introduce the etching equipment for pattern formation handled by Fujikiko Co., Ltd. Our vacuum etching technology enables high-precision pattern processing, resulting in minimal variation across the surface. Additionally, we can accommodate everything from fine semiconductor package substrates to thick copper substrates. 【Features】 ■ Supports from sheet substrates to flexible substrates via Roll to Roll ■ Accommodates fine semiconductor package substrates to thick copper substrates ■ Achieves high-precision pattern processing through vacuum etching technology ■ Finishes with minimal variation across the surface *For more details, please refer to the PDF document or feel free to contact us.
![[Demo in Progress!] Small Experimental Ion Beam Etching Device](https://image.mono.ipros.com/public/product/image/920/2000179235/IPROS8471193146044588669.JPG?w=280&h=280)
[Demo in progress!] Experimental device equipped with an ion source that can be customized to meet usage needs.
The "Small Experimental Ion Beam Etching Device" uses a DC ion source and is equipped with a substrate rotation cooling single stage. It easily etches materials such as Au, Pt, and magnetic materials, and taper processing can also be done easily. Processing is possible at a substrate surface temperature of 80°C or lower. It is ideal for microfabrication. 【Features】 ● No toxic gases are used, so exhaust gas treatment is unnecessary ● Endpoint detector can be installed ● For inquiries or questions about ion beam etching devices, ion sources, and ion beam technology, please feel free to consult us. For more details, please download the catalog or contact us.
This is an ion beam etching device that uses an ion source to irradiate the target material with an ion beam and perform dry etching.
The small ion beam etching device uses a DC ion source and is an ion beam etching (IBE) device equipped with a substrate rotation cooling single stage. It is capable of etching fine patterns, as well as metal and magnetic materials. 【Features】 ○ Easily etches Au, Pt, magnetic materials, etc. ○ Taper processing is easy ○ Processing is possible at substrate surface temperatures below 80°C ○ No toxic gases are used, so exhaust gas treatment is unnecessary ○ Can be equipped with an endpoint detector For more details, please contact us or download the catalog.
With cultivated skills and a new sensibility, we will continue to advance into the new era!
Sanyu Manufacturing Co., Ltd. is a manufacturing company that produces medical analytical instruments, accessories related to electron microscopes, and tools for semiconductor failure analysis. Since its establishment, the company has focused on precision machining, and the technology cultivated there has shaped our technical foundation. By maintaining a consistent production system from design, machining, to assembly and adjustment, we are able to respond to customers' demands for short delivery times. Currently, the majority of our production is related to medical analytical instruments, but in recent years, we have also been engaged in technology development aimed at the next generation. We aim to anticipate our customers' needs and continuously act as challengers, contributing to the advancement of science and the creation of the future. 【Business Activities】 ■ Manufacturing of accessories related to electron microscopes ■ Manufacturing of semiconductor failure analysis tools ■ Precision machining ■ Manufacturing of analytical instrument-related products *For more details, please download the PDF or feel free to contact us.
