Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 82 items
We will propose an etching system tailored to your needs!
This is an announcement from Nappu Industrial Co., Ltd. regarding a continuous automatic etching system. Printing → Drying → Etching → Stripping → Washing → Wiping → Applying protective film.
Flattening various materials at the atomic scale through pads with catalytic functions.
A unique etching technology that utilizes catalytic action to chemically remove only the protrusions on the processed surface by moving ultra-pure water as the processing fluid over a substrate with pads that have catalytic functions (such as films of Pt or Ni). It flattens the surfaces of various materials, including glass and SiC, at the atomic scale. CARE further achieves a P-V of 0.7 nm and aims to become the ultimate processing method capable of achieving flatness at the level of a single atom in the future.
![Soft Etching Device [nanoETCH]](https://image.mono.ipros.com/public/product/image/e80/2000071234/IPROS34856758710167043703.jpeg?w=280&h=280)
<30W Low power - Etching control precision 10mW Achieving damage-free and delicate etching processing.
【nanoETCH】Model. ETCH5A Achieves fine and damage-free etching processing with low output RF etching at <30W (control accuracy 10mA). A jointly developed product with the graphene research group at the University of Manchester, led by Nobel Prize winners who discovered graphene in 2010.
The film is transported to ensure that the load does not exceed a certain value! This achieves high spray efficiency.
The "Roll-to-Roll (RtoR) Film Etching Device" continuously etches roll-to-roll films. In roll-to-roll (RtoR) film transport, excessive tension can cause the substrate to stretch. Our company has implemented a tension control drive in the middle to ensure that the film is transported without exceeding a certain load. By minimizing the number of transport rolls and maximizing the spray range without interfering with the spray ejection from the transport rolls, we achieve high spray efficiency. 【Features】 ■ Continuous etching of M-ITO films and ITO films is possible ■ Film transport technology at low tension ■ High spray efficiency *For more details, please refer to the PDF document or feel free to contact us.
If it's about making etching machines, Kimura Etching.
We design and manufacture various wet processing equipment (etching, developing, stripping, cleaning, etc.) for applications ranging from research and development experimental devices to production equipment. The main material for the equipment body is PVC, but we also manufacture using PP, PVDF, and SUS depending on the chemicals and temperatures used. All of our equipment is custom-made to meet the specific requirements of our customers. We also undertake on-site work such as equipment modifications and relocations.
Optimal nozzle arrangement! An etching device capable of handling workpieces of various widths and thicknesses!
The "etching device and cleaning device" is a system that performs the etching process in a continuous manner, from unwinding to etching, rinsing, drying, and rewinding. It features a custom design that accommodates both development and mass production equipment. 【Features】 ■ A system that performs the etching process in a continuous manner ■ Compatible with various workpieces (materials, width, thickness) ■ Optimal nozzle arrangement ■ Custom design that accommodates both development and mass production equipment *For more details, please refer to the PDF document or feel free to contact us.
Automatically mixes the chemical solution and delivers the required amount to the etching tank! It employs a sequencer control method.
The product is a device that automatically transports and etches GaAs wafers using a dedicated basket. When GaAs wafers placed in the basket from the loader section are introduced, they are automatically transported by a conveyor from the loader section to the etching tank, rinse tank, and unloader section. Additionally, there is a chemical supply tank located at the bottom of the device, which automatically mixes the chemicals and supplies the necessary amount to the etching tank. 【Main Specifications】 ■ Heated material: GaAs (Gallium Arsenide) block ■ Cassette: Dedicated PTFE cassette ■ Conveyor: Automatic robot transport (servo motor driven) ■ Control method: Sequencer control *For more details, please refer to the PDF document or feel free to contact us.
![Glass Etching Equipment [LCD Glass Substrate] | NSCEng](https://image.mono.ipros.com/public/product/image/20d/2000504191/IPROS45783172456342674077.png?w=280&h=280)
As an automatic device for chemical polishing of thin glass substrates for LCDs, it is suitable for thinning processes up to the G6 generation.
× The tact does not match in mechanical polishing. × Glass dissolution with hydrofluoric acid does not result in a clean finish. We solve such problems. Our glass etching equipment comes in two types: "immersion dip type" and "sheet transport spray type." Both are devices with numerous achievements as mass production equipment. 【Features of Our Equipment】 ■ Achievable Cpk of 1.33 or higher with target plate thickness of ±30μm ■ One-pass finishing possible with automatic thickness control ■ Low cost achieved through liquid regeneration system ■ Latest technology enables transport of thicknesses down to 30μm ■ Designed with a focus on chemical resistance for long-lasting equipment ■ Complete with safety interlocks ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ Example of Processing 【Type of Glass】 Non-alkali glass, soda glass, aluminosilicate glass 【Product Size】 300×400 to 1500×1850mm 【Processing Accuracy】 In-plane thickness accuracy of R10μm after 70% reduction 【Main Chemical】 Hydrofluoric acid ◇◆◇◆◇◆◇◆◇◆◇◆◇◆◇◆ 【Notes】 - Proposals, design, and manufacturing possible from development prototypes - Sample processing using actual liquid is possible
Removal of unnecessary areas through stripping treatment! Introducing the defective analysis etching equipment handled by our company.
The "200FA/200R/200I" is a defect analysis device for semiconductor chips and wafers. Through the delamination process, it is possible to remove unnecessary areas and analyze the causes of defects. 【Features】 ■ Selectable delamination technologies (RIE, HCD, ICPRIE) ■ Flexibility in sample shapes (die, package die, wafer fragments, full wafers) ■ Flexibility in transport (direct load, pre-load shuttle, pre-load shuttle with load lock) * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Etching of surface monolayers! It can minimize damage to the etched object!
We would like to introduce our plasma-based atomic layer etching device, the 'Takachi ALE.' The Takachi system enables the ALE process by incorporating an ALE kit. Since etching is performed one atomic layer at a time on the surface, it minimizes damage to the etched object. 【Features】 ■ Equipped with an ALE kit, enabling the ALE process ■ Etches one atomic layer at a time on the surface ■ Minimizes damage to the etched object *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.
Remove the insulation layer of the IC! A system with a small footprint and high cost-effectiveness.
We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.
We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.
Etching and film deposition for a wide range of markets, including fault analysis, MEMS, optical MEMS, and advanced packaging, are possible!
The "Shuttleline200 Series" is a flexible and multipurpose platform for etching and PECVD applications. By adopting a unique shuttle concept, it enables handling of samples in various sizes, from small pieces to full wafers, providing a multipurpose etching and deposition solution. It also allows for plasma processing technologies such as RIE, ICP, PECVD, and ICP-CVD, offering suitable processing for R&D applications and small-scale production. Specifically, it can perform etching and deposition for a wide range of markets, including failure analysis, MEMS, optical MEMS, advanced packaging, and processes for power semiconductors. 【Features】 ■ Easily adaptable to a wide variety of substrate shapes and sizes due to the unique shuttle concept. ■ User-friendly equipment with a wealth of options and high upgradeability. ■ Multipurpose capability to meet advanced and specific requirements such as RIE and ICP etching. *For more details, please feel free to contact us.
Inert gas Ar etching and enhanced RIBE using reactive gases are possible!
"QuaZar" is an etching processing technology that enables vertical etching capability, which is difficult to achieve with plasma etching, in the etching process of hard-to-etch materials such as ferroelectric PZT, thanks to its large-area ion source and advanced motion control. By adopting a unique Ion Source, Marathon Grids, and optional Dual PBN, it triples the MTBM compared to conventional products (and can also be installed in existing equipment from other companies). Additionally, the REDEP Breaker and AUXILIARY Electrode prevent RF shunting and anode disappearance. 【Features】 ■ In PZT etching applications, etch stop is possible with noble metal electrode layers without EPD (with no deposition on sidewalls and a smooth surface). ■ The selectivity of photoresist in PZT etching improves from 0.6:1 with inert IBE to 1.1:1 with RIBE. ■ The etching speed for PZT improves from about 20 nm/min with inert IBE to about 30 nm/min with RIBE. *For more details, please feel free to contact us.
At the seminar, we plan to introduce new technologies such as HDRF-high-density radicals for low-temperature removal of polymers and HDI resists.
Plasma Thermo Japan Co., Ltd. will be exhibiting at "Semicon Japan 2024" held at Tokyo Big Sight. Our company specializes in plasma technology, handling etching, deposition, cleaning equipment, ALD-like deposition equipment, ion beam equipment, PVD equipment, and RTP equipment. We also offer batch-type sputtering equipment and electron beam evaporation equipment, enabling us to propose solutions for various applications. In the seminar held at our booth, we plan to introduce new technologies that enable low-temperature removal of polymers and HDI resist using HDRF-high-density radicals, as well as new technologies for ALD-like deposition with the deposition rate of KBOUS FAST-CVD. We look forward to your visit. 【Event Overview】 ■ Dates: December 11 (Wed) - 13 (Fri), 2024, 10:00 - 17:00 ■ Venue: Tokyo Big Sight, East Hall 4, Booth 4032 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (approximately 7 minutes on foot) - Yurikamome, Tokyo Big Sight Station (approximately 3 minutes on foot) *For more details, please refer to the related links or feel free to contact us.
