We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Etching Equipment.
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Etching Equipment Product List and Ranking from 21 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. null/null
  3. 山縣機械 Osaka//Industrial Machinery ＦＴＰ事業部
  4. 4 プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  5. 4 null/null
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  2. ICP etching equipment RIE-800iPC/RIE-400iPC サムコ
  3. ICP metal etching equipment
  4. 4 Ion Beam Milling and Etching Equipment - Hakuto/Ns
  5. 4 Single-wafer plasma etching device "EXAM-Σ"

Etching Equipment Product List

61～64 item / All 64 items

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Plasma etching equipment for semiconductor failure analysis

Plasma etching equipment for semiconductor failure analysis

Remove the insulation layer of the IC! A system with a small footprint and high cost-effectiveness.

We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Semiconductor inspection/test equipment

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Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.

  • Etching Equipment

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Photo Mask Dry Etching Equipment for Research and Development Purposes

Photo Mask Dry Etching Equipment for Research and Development Purposes

A must-see for those involved in the new development of photomasks! A dry etching device with a compact design that can process photomasks and wafers of various sizes.

We would like to introduce our "RIE Dry Etching Equipment for Photomasks." By adopting a "shuttle" as the carrier for photomasks, it is possible to process various sizes of photomasks simply by replacing the "shuttle," without the need to change the hard wafer. We offer both open load and load lock types, and with the load lock type, it is possible to etch MoSi, Cr, and Ta materials in a single chamber. 【Features】 ■ Compact design ■ Easy cleaning of the reactor interior through plasma cleaning ■ Use of liners to prevent contamination within the reactor chamber ■ Easy to remove due to the plug-in design *For more details, please download the PDF (English version) or feel free to contact us.

  • Etching Equipment

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