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Etching Equipment Product List and Ranking from 36 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. 伯東 本社 Tokyo//Electronic Components and Semiconductors
  3. 神港精機 東京支店 Tokyo//Industrial Machinery
  4. 4 二宮システム Osaka//others
  5. 5 NSC エンジニアリング本部 Osaka//Industrial Machinery
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Ion Beam Milling and Etching Equipment - Hakuto/Ns 伯東 本社
  2. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  3. Plasma etching device "EXAM" sample testing now accepting applications. 神港精機 東京支店
  4. Glass Etching Equipment [LCD Glass Substrate] | NSCEng NSC エンジニアリング本部
  5. 4 Eminent Series Third Generation Etching Device "Eminent 2" 東京化工機 本社・長野工場

Etching Equipment Product List

31～60 item / All 84 items

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Bulk Etching Device "BEM-301"

Bulk Etching Device "BEM-301"

It can be easily used by anyone simply by specifying the etching amount (depth) and the material of the wafer.

The "BEM-301" is a device that uses ozone and vaporized fluorine for etching. Etching is performed while monitoring the etching amount, allowing for high-precision etching. Additionally, accurate etching can be achieved even from the first piece. 【Specifications】 ■ Etching rate: 2μm/H or more ■ Flatness: within 10% ■ Accuracy of etching amount (depth): within ±5% ■ Utilities: O2, N2, HF, DIW, cooling water, AC-100V, AC-200V, acid exhaust, acid wastewater ■ External dimensions: 1,000W × 1,300D × 2,000H (mm) ■ Weight: approximately 300Kg *For more details, please download the PDF or contact us.

  • Etching Equipment
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Cryo Plasma Etching Takachi ICP Cryo

Cryo Plasma Etching Takachi ICP Cryo

We would like to introduce the etching equipment for ultra-low temperature environments that we handle.

We would like to introduce the "Takachi ICP Cryo," which we handle. It is used in etching processes that require higher anisotropy and selectivity. 【Features】 ■ Temperature range: -150℃ to +350℃ ■ Wafer size: 2" to 8" * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment
  • Etching Equipment

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Siconnex Company Profile

Siconnex Company Profile

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals.

Our company is a manufacturer of equipment for the semiconductor chip manufacturing process (wet etching, resist stripping, cleaning). We offer a variety of products, including the "BATCHSPRAY Clean Autoload" with a maximum throughput of 600 wph and the "BATCHSPRAY Solvent Autoload," which employs a chemical circulation system with a tank system. Please feel free to contact us when you need assistance. 【Reasons to Choose Siconnex】 ■ 100% focus on BATCHSPRAY technology ■ Significant reduction in water, exhaust, and chemicals ■ Cost-efficient processes that support environmental conservation ■ Comprehensive support system (service, parts, processes) ■ Partnership approach with free annual equipment inspections, training, telephone support, and regular maintenance in the first year *For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Etching Equipment

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Wet etching device "BATCHSPRAY Autoload"

Wet etching device "BATCHSPRAY Autoload"

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Etching Equipment

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Small Thin Plate Etching Device FBE40

Small Thin Plate Etching Device FBE40

Small thin plate etching device FBE40

【Process】Input → Air Knife → Etching → Air Knife → Recirculating Water Wash → Direct Water Wash → Air Knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1445×L2010×H1230mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

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  • Etching Equipment
  • Other laboratory equipment and containers
  • Etching Equipment

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Compact Ultra-High Precision Etching Device MPE40

Compact Ultra-High Precision Etching Device MPE40

Compact Ultra-High Precision Etching Device MPE40

【Process】 Input → Etching → Liquid Drain → Acid Wash → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs

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Ninomiya System manufactured H-down device

Ninomiya System manufactured H-down device

Ninomiya System manufactured H-down device

Achieving excellent surface accuracy with an ideal nozzle arrangement.

  • Etching Equipment
  • Etching Equipment

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High-precision processing type micro-etching device

High-precision processing type micro-etching device

High-precision processing type micro-etching device

Achieves uniform surface accuracy with no irregularities in processing, compatible with thin plate transport (t50μm).

  • Etching Equipment
  • Etching Equipment

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Single-wafer plasma etching device "EXAM-Σ"

Single-wafer plasma etching device "EXAM-Σ"

Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
  • Etching Equipment

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HCD type high-density plasma etching device

HCD type high-density plasma etching device

Achieving high-density plasma with a simple mechanism. Compatible with substrates from wafers to 1 m². Damage-free etching of Si-based materials, metals, organic films, and various thin films.

Achieves a plasma density that is an order of magnitude higher compared to conventional capacitively coupled plasma etching devices. High-precision etching is possible solely through innovations in the electrode structure, without using high-frequency antennas or magnets. It also has high hardware compatibility with conventional etching devices (CCP type and ICP type), contributing to low cost, high reliability, and operational efficiency. Capable of etching not only wafer-level substrates but also large substrates. A new type of high-density plasma etching device that can smoothly accommodate the increase in substrate size.

  • Etching Equipment
  • Ashing device
  • Plasma surface treatment equipment
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Large plasma etching device

Large plasma etching device

Batch-type etching equipment with extensive experience in etching and ashing of wafers, glass, and large substrates. Also compatible with semiconductor manufacturing equipment parts and materials.

Based on the highly successful batch-type plasma etching system "EXAM," the stage has been expanded to accommodate a maximum diameter of 600 mm or 500 mm square. The large stage supports a wide range of processes, including fine-pitch etching, ashing of various organic materials, surface modification, and cleaning. Similar to the conventional model EXAM, it performs etching on wafers, glass, and ceramic substrates, and has extensive experience in etching, cleaning, and surface treatment of large mounted substrates and pre-cut film substrates. This new dry process tool is also optimal for processing large products that require cleanliness and delicate surface treatment, such as semiconductor manufacturing equipment parts and materials, in addition to electronic devices.

  • Etching Equipment
  • Plasma surface treatment equipment
  • Etching Equipment

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Dry etching equipment / XeF2 etching equipment

Dry etching equipment / XeF2 etching equipment

XeF2 etching device

● Since it is a completely dry process, it is possible to suppress the destruction of self-supporting devices due to stiction. ● No pre-treatment or post-treatment is required in the wet process. ● By intermittently flowing gas and etching, it is easy to control the etching speed and gas usage. ● Since it does not use plasma, there is no damage to the device from electric fields (electron or ion impact). ● Designed for research and development purposes, it is very compact and tabletop in design. ● As it is a dedicated machine, it is low-cost.

  • Etching Equipment
  • Etching Equipment

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ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

ICP etching equipment for compound semiconductor processes

The RIE-330iPC is a multi-wafer processing etching device for compound semiconductor processes that employs an inductively coupled plasma (ICP) discharge method. 【Features】 ○ Compatible with large trays of Φ330mm Up to 27 pieces for Φ2-inch wafers, 17 pieces for Φ2.5-inch wafers, 12 pieces for Φ3-inch wafers, 7 pieces for Φ4-inch wafers, and 3 pieces for Φ6-inch wafers can be processed simultaneously. ○ By adopting the new SSTC (Symmetrical Shielded Tornado Coil) electrode as the ICP source, it enables high selectivity and excellent uniformity in etching over large areas. ○ Allows for low-damage processes at low bias (below -100V). ○ Stable etching conditions can be achieved through temperature control of the substrate stage and the inner walls of the reaction chamber. ○ A turbo molecular pump is also used in the load lock chamber, providing a more stable process.

  • Etching Equipment
  • Wafer processing/polishing equipment
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ICP etching equipment RIE-800iPC/RIE-400iPC

ICP etching equipment RIE-800iPC/RIE-400iPC

Introducing a full-scale production device equipped with a vacuum cassette chamber, offering excellent process reproducibility and stability.

The "RIE-800iPC/RIE-400iPC" is an ICP etching device that boasts stability for continuous processing of 25 SiC trench-shaped wafers. It can efficiently and stably apply high RF power (over 2 kW), achieving good uniformity. Additionally, by adopting an exhaust system directly connected to the reaction chamber, it realizes a wide process window from low flow and low pressure to high flow and high pressure. 【Features】 <RIE-800iPC> ■ Supports maximum Φ8” wafers ■ Uses inductively coupled plasma for discharge ■ Equipped with a vacuum cassette chamber, excelling in process reproducibility and stability ■ Optimizes the distance between the wafer and plasma to ensure good in-plane uniformity ■ Integrates TMP (Turbo Molecular Pump) and high-frequency power supply for easy replacement *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
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Small etching device

Small etching device

Spin etcher that sprays etching solution while rotating the substrate.

The program can save up to 99 steps × 50 patterns. We also offer other models and customization based on your needs, upon consultation.

  • Etching Equipment
  • Other semiconductor manufacturing equipment
  • Etching Equipment

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Etching device - Spray-type wafer etching device

Etching device - Spray-type wafer etching device

Demo units available for loan! This is a device that performs a series of cleaning and etching processes, including pure water treatment and drying.

The spray-type wafer etching device performs a series of cleaning and etching processes, followed by pure water treatment and drying. For more details, please contact us or refer to the catalog.

  • Etching Equipment
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Etching equipment - Semi-automatic wafer etching equipment

Etching equipment - Semi-automatic wafer etching equipment

Demo units available for loan! After pre-processing with a cassette, automatic etching is performed with a dedicated barrel.

This machine is a device for cleaning and etching wafers. After pre-treatment in a cassette, automatic etching is performed in a dedicated barrel. For more details, please contact us.

  • Etching Equipment
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Dry etching equipment

Dry etching equipment

Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.

The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.

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Tabletop Etching Device ES-10/ES30

Tabletop Etching Device ES-10/ES30

Easy and efficient etching with air jets.

A tabletop etching device capable of simultaneous etching of double-sided substrates, as well as etching multiple sheets together.

  • Etching Equipment
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Substrate manufacturing device - Spray-type small etching device

Substrate manufacturing device - Spray-type small etching device

Is it still manual? Introducing the "spray-type small etching device" suitable for testing and experiments in a tabletop size! Examples of use such as etching films!

The "Spray-Type Compact Etching Device" is a tabletop-sized device for etching processes, such as those used for printed circuit boards, as well as for developing processes. It uses the chemical reaction of etching solution (ferric chloride) to etch (chemically corrode, engrave) copper foil according to the circuit pattern. By replacing manual tasks with the spray-type compact etching device, reproducibility improves and work efficiency increases! It has also been used for etching during printing on films, making it versatile for various applications! 【Features】 - Simple processing by just inserting the substrate due to the conveyor transport method - Spray (single-sided) type allows for high-quality substrates in a short time - Recommended for small-scale etching for experiments and prototypes - Supports work sizes up to 150×200mm - Compact type that can be placed on a desk for use By using the optional dedicated exhaust treatment cover (MODEL ES-400FC), it can be connected to exhaust devices such as Sunhayato's ES-F2 and KS-8. *For more details, please contact us or download the PDF materials for further information.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other semiconductor manufacturing equipment
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Conveyor-type etching device

Conveyor-type etching device

Customization specifications tailored to your requests. We can accommodate everything from experimental machines to production machines.

This is a device for processing sheet substrates used in LCD glass and touch panels. 【Features】 - Compatible with workpieces ranging from 100mm to 1000mm square (other sizes and shapes can be discussed separately) - By adding a swinging mechanism (horizontal swinging and spray nozzle pivoting), processing efficiency is improved - Cassette-to-cassette operation is also possible *For more details, please download the PDF (catalog) or feel free to contact us.

  • Resist Device
  • Etching Equipment

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Etching device

Etching device

Etching device

Device for etching copper foil after development using ferric chloride and cupric chloride 【Features】 ○ Lane configuration: 2 Lane ○ Transport speed: 2.0m/min ○ Material width: 35mm to 160mm for TAB/CSP/COF (250mm to 300mm for FPC) ○ Material thickness: PI 25μm and above ○ Processing surface: Single side ○ Device configuration: Unwinding → Etching → Rinsing → Liquid removal → Drying → Winding ○ Utilities: - Power supply: AC200V・220V / 50Hz・60Hz - Tap water, pure water, cooling water, scrubber, heat exhaust, (steam) ○ Device dimensions: 16m (L) × 2.5m (W) × 2.5m (H) ● For other functions and details, please contact us.

  • Etching Equipment
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Etching device (1)

Etching device (1)

The transport speed is 5.0 m/min, and it can accommodate material widths up to 310 mm! Etching the surface of metal foils (such as aluminum).

The device is used for etching the surface of metal foils (such as aluminum). The transport speed is 5.0 m/min, and it can accommodate material widths of up to 310 mm. The device consists of a configuration of unwinding, etching processing, cleaning, drying, and winding. Using our low-tension transport technology, we can continuously process very thin and extremely fragile materials without causing scratches or wrinkles. 【Specifications】 ■ Lane configuration: 1 Lane ■ Material thickness: 20 μm and above ■ Processing surface: Single-sided and double-sided ■ Utilities: Power supply (AC 200/220V / 50/60Hz), pure water, tap water, cooling water, scrubber, heat exhaust, (steam) ■ Dimensions: 15 m (L) × 2 m (W) × 2.5 m (H) *Excluding control panel and ancillary equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Drying Equipment
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Etching device (2)

Etching device (2)

The transport speed is 1.5m/min, and it can accommodate material widths up to 350mm! The chemical temperature and pressure are controlled with high precision.

The device continuously performs etching on thin single-layer substrates such as FPC using a roll-to-roll transport method. The device consists of the following processes: unwinding (substrate loading) → laminating → etching → rinsing → acid washing → rinsing → winding (substrate peeling) → rinsing → drying → substrate stacking. In addition to the transport mechanism, the temperature and pressure of the chemical solutions are precisely controlled. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.5 m/min ■ Material width: MAX 350 mm ■ Material thickness: 50 μm and above ■ Processing surface: single side *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
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Roll-to-roll etching device

Roll-to-roll etching device

Introducing a device that transports thin products using our conveying technology, ensuring they are moved without scratches or wrinkles for continuous processing.

The "Roll to Roll Etching Device" is a machine that continuously processes thin products without scratches or wrinkles using our transport technology. The transport speed is typically 5.0m/min. We will propose the device configuration tailored to the resin film materials (such as aluminum, copper, stainless steel, etc.) that you are targeting. 【Features】 ■ Device size: 15000mm(L) × 2100mm(W) × 2600mm(H) ■ Base material width: MAX 310mm ■ Processing steps: Unwinding ⇒ Etching processing ⇒ Washing ⇒ Drying ⇒ Winding ■ Transport speed: Typically 5.0m/min *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
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High-temperature etching compatible machine

High-temperature etching compatible machine

High-temperature etching compatible machine

This is an etching machine that performs etching at high temperatures. 【Features】 ◆ Etching at a high temperature of 80℃ ◆ Capable of etching thick materials such as titanium ◆ High quality unique to a wet etching equipment manufacturer with 52 years of experience ■□■□■□■□■□■□■□■□■□■□■□■□ ＝＝＝＝＝ Please contact us for more details＝＝＝＝＝

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Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device

Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device

Vacuum etching device

This is a vacuum etching device for substrate creation. Utilizing our proud chip-on-flexible and tape-on-board technology, we can minimize the substrate circuit width to as small as 25μm. 【Features】 ◆ Utilizing industry-leading vacuum etching technology ◆ Through collaboration with our other substrate manufacturing machines, we can minimize the circuit width to 25μm ■□■□■□■□■□■□■□■□■□■□■□■□ ＝＝＝＝＝ For more details, please contact us＝＝＝＝＝

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Semiconductor and printed circuit board horizontal manufacturing equipment - Etching equipment (pattern formation)

Semiconductor and printed circuit board horizontal manufacturing equipment - Etching equipment (pattern formation)

High-precision pattern processing is achieved through vacuum etching technology! It finishes without variation across the surface.

We would like to introduce the etching equipment for pattern formation handled by Fujikiko Co., Ltd. Our vacuum etching technology enables high-precision pattern processing, resulting in minimal variation across the surface. Additionally, we can accommodate everything from fine semiconductor package substrates to thick copper substrates. 【Features】 ■ Supports from sheet substrates to flexible substrates via Roll to Roll ■ Accommodates fine semiconductor package substrates to thick copper substrates ■ Achieves high-precision pattern processing through vacuum etching technology ■ Finishes with minimal variation across the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Substrate transport device (loader/unloader)
  • Circuit board processing machine
  • Etching Equipment
  • Etching Equipment

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[Demo in Progress!] Small Experimental Ion Beam Etching Device

[Demo in Progress!] Small Experimental Ion Beam Etching Device

[Demo in progress!] Experimental device equipped with an ion source that can be customized to meet usage needs.

The "Small Experimental Ion Beam Etching Device" uses a DC ion source and is equipped with a substrate rotation cooling single stage. It easily etches materials such as Au, Pt, and magnetic materials, and taper processing can also be done easily. Processing is possible at a substrate surface temperature of 80°C or lower. It is ideal for microfabrication. 【Features】 ● No toxic gases are used, so exhaust gas treatment is unnecessary ● Endpoint detector can be installed ● For inquiries or questions about ion beam etching devices, ion sources, and ion beam technology, please feel free to consult us. For more details, please download the catalog or contact us.

  • Etching Equipment
  • Etching Equipment

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Small Ion Beam Etching Device

Small Ion Beam Etching Device

This is an ion beam etching device that uses an ion source to irradiate the target material with an ion beam and perform dry etching.

The small ion beam etching device uses a DC ion source and is an ion beam etching (IBE) device equipped with a substrate rotation cooling single stage. It is capable of etching fine patterns, as well as metal and magnetic materials. 【Features】 ○ Easily etches Au, Pt, magnetic materials, etc. ○ Taper processing is easy ○ Processing is possible at substrate surface temperatures below 80°C ○ No toxic gases are used, so exhaust gas treatment is unnecessary ○ Can be equipped with an endpoint detector For more details, please contact us or download the catalog.

  • Etching Equipment
  • Etching Equipment

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