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Etching Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Etching Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 伯東 本社 Tokyo//Electronic Components and Semiconductors
  2. 神港精機 東京支店 Tokyo//Industrial Machinery
  3. サムコ Kyoto//Industrial Machinery
  4. 4 フジ機工 Niigata//Industrial Machinery
  5. 5 二宮システム Osaka//others
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Etching Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Ion Beam Milling and Etching Equipment - Hakuto/Ns 伯東 本社
  2. Dry etching device RIE-10NR (parallel plate type RIE device) サムコ
  3. CCP plasma etching device 'CCP-T60M/B2M' 片桐エンジニアリング
  4. 4 Flat milling and SEM observation
  5. 4 Semiconductor and printed circuit board horizontal manufacturing equipment: Vacuum etching device フジ機工

Etching Equipment Product List

16～30 item / All 82 items

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Custom-made production achievements: Dry etching equipment

Custom-made production achievements: Dry etching equipment

We have a track record of devices such as "XeF2 etching equipment" and "batch-type ashing equipment."

We would like to introduce the custom manufacturing achievements of Japan Create Co., Ltd. regarding "Dry Etching Equipment." We have a track record of "ICP Etching Equipment for Research and Development," "ICP Plasma Etching Equipment," "XeF2 Etching Equipment," and "Batch-type Ashing Equipment." Sample processing is being conducted using demo units. Please feel free to contact us when needed. 【Manufacturing Achievements】 ■ ICP Etching Equipment for Research and Development ■ ICP Plasma Etching Equipment ■ XeF2 Etching Equipment ■ Batch-type Ashing Equipment *For more details, please refer to the PDF materials or feel free to contact us.

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  • Etching Equipment

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scia Cube 300/450/750

scia Cube 300/450/750

Substrate bias mechanism! Introducing our microwave PECVD/etching equipment.

The "scia Cube 300/450/750" is a microwave PECVD/etching device compatible with substrates of 300×300mm, 450×450mm, and 750×750mm. The processes include microwave PECVD and reactive ion etching (RIE). Please feel free to consult us when you need assistance. 【Features】 ■ Compatible with substrates of 300×300mm, 450×450mm, and 750×750mm ■ Substrate bias mechanism ■ Substrate cooling and heating mechanism (-10 to 850℃) *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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ICP-RIE『SI 500』

ICP-RIE『SI 500』

High-selectivity etching! Optimization of radical supply by adjusting the spacing between the ICP source and the substrate electrode.

The "SI 500" is an ICP-RIE that controls ion density through ICP power. It achieves a high etch rate with a high plasma density of 10^12 [ions/cm3] using the unique PTSA200ICP source. Additionally, it features low-damage etching through control of ion energy via bias power. 【Features】 ■ Control of ion density through ICP power ■ Control of ion energy through bias power ■ Optimization of radical supply by adjusting the distance between the ICP source and the substrate electrode ■ Low-damage etching ■ High selectivity etching *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Plasma deposition and etching equipment "FLARION Series"

Plasma deposition and etching equipment "FLARION Series"

Plasma-assisted reactive film deposition is possible! It also supports options for integration.

The "FLARION series" is a plasma deposition and etching device. It enables plasma-assisted reactive deposition using the seamless ICP of the PLUM series. Additionally, it can be equipped with a substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism, accommodating options for customization and integration. 【Features】 ■ Plasma-assisted reactive deposition possible with the seamless ICP of the PLUM series ■ Capable of being equipped with substrate rotation mechanism, bias mechanism, and program-controlled axis motion mechanism ■ Options available for customization and integration *For more details, please refer to the PDF materials or feel free to contact us.

  • Plasma surface treatment equipment

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WET process equipment LCD single-sheet etching equipment

WET process equipment LCD single-sheet etching equipment

The LCD substrate will undergo etching, shower cleaning, and drying processes through horizontal transport.

The WET process device, LCD single-sheet etching device, performs etching, shower cleaning, and drying processes for LCD substrates through horizontal transport. The WET device technology from Denshi Giken Co., Ltd., including cleaning spins, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, by cleaning wafers, glass substrates, printed circuit boards, metal substrates, and more. 【Features】 ○ Achieves uniform processes through dip, spray, and oscillation function etching ○ Parallel processing of etching/shower cleaning/drying processes ○ High efficiency of natural drop effect and replacement through substrate inclined washing function For more details, please contact us or download the catalog.

  • Circuit board processing machine
  • Etching Equipment

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Tabletop Plasma Etching Device 'TP-50B'

Tabletop Plasma Etching Device 'TP-50B'

Tabletop plasma etching device capable of localized processing with unique spot plasma technology.

The "TP-50B" is a 50W model that does not require installation permission applications under the Radio Law, and it is easy to operate, making it a tabletop plasma etching device that allows for casual plasma processing. With its unique spot plasma technology, it enables localized processing and can handle a wide range of plasma processing, from pre-treatment (exposing wiring) for semiconductor failure analysis samples to various plasma applications. Additionally, its compact size makes it suitable for research laboratories with limited space. 【Features】 ■ Compact tabletop size ■ Capable of localized plasma processing (Φ0.5mm and above) ■ Achieves low residue and high-speed processing (10μm/min) ■ Low output RF power supply (maximum output under 50W) ■ Allows for extensive processing by moving samples on a stage *For more details, please download the PDF or feel free to contact us.

  • Etching Equipment
  • Other semiconductor manufacturing equipment

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[Analysis Case] Removal of Organic Contaminants by Etching

[Analysis Case] Removal of Organic Contaminants by Etching

We will remove surface contamination and conduct an evaluation using XPS.

XPS is a surface-sensitive technique, so carbon derived from organic contaminants due to the atmosphere is detected at a significant level. Reducing the influence of this carbon from organic contaminants is important for evaluating the original composition of the film. Typically, Ar ion sputtering is used to remove organic contaminants, but damage caused by sputtering may prevent the evaluation of the film's original composition and bonding states. We present an example where the influence of carbon from organic contaminants was reduced by removing the surface oxide layer using wet etching instead of Ar ion sputtering.

  • Contract Analysis

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SUS etching device

SUS etching device

Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.

The "SUS Etching Device" is a product that etches patterned SUS foil. Thanks to our uniquely developed design for the arrangement of transport components (rolls), stable transport is possible even for ultra-thin products without wrinkles, corner bends, or dents. An automatic management system for spray pressure, chemical concentration and temperature, and chemical specific gravity continuously creates an appropriate etching balance, maintaining consistent product quality. 【Features】 ■ Etches patterned SUS foil ■ Adopts an automatic management system ■ Stable transport of ultra-thin products *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Research and development experimental equipment - Vertical etching device

Research and development experimental equipment - Vertical etching device

If it's about making etching machines, Kimura Etching.

We design and manufacture various wet processing equipment (etching, developing, stripping, cleaning, etc.) ranging from experimental devices for research and development purposes to production equipment. The main material for the equipment body is PVC, but we also manufacture using PP, PVDF, and SUS depending on the chemicals and temperatures used. All of our equipment is custom-made to meet the specific requirements of our customers. We also undertake on-site work such as equipment modifications and relocations.

  • others

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Etching device "MS-3030LWE"

Etching device "MS-3030LWE"

Formation of localized etching areas! High-precision shape creation through scanning.

The "MS-3030LWE" is a numerically controlled local wet etching device that can create arbitrary shapes by scanning a locally controlled liquid phase etching area with speed control. Since it is a non-contact chemical distortion-free processing method, it is insensitive to disturbances such as vibrations. The processing amount can be accurately controlled with nanometer-order precision based on the etchant's residence time and temperature, allowing for the creation of arbitrary shapes. [Features] - Non-contact processing - Chemical distortion-free processing - Nanometer-order processing precision - Creation of arbitrary shapes through 5-axis NC control *For more details, please refer to the catalog or feel free to contact us.

  • others

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CCP plasma etching device 'CCP-T60M/B2M'

CCP plasma etching device 'CCP-T60M/B2M'

High-precision and high-reliability oxide film microfabrication! Selectively generating radicals from process gases.

The "CCP-T60M/B2M" is a parallel plate etching device that achieves high precision and high reliability in oxide film microfabrication. It selectively generates radicals from process gases and applies 60MHz power to the upper electrode to obtain low electron temperature and high-density plasma. Additionally, it is equipped with a sequence program that constantly maintains appropriate etching process conditions. 【Features】 ■ Parallel plate etching device ■ Achieves high precision and high reliability in oxide film microfabrication ■ Selectively generates radicals from process gases ■ Applies 60MHz power to the upper electrode ■ Equipped with a sequence program *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment

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Hybrid etching device

Hybrid etching device

Stable mass production, low cost! Etching equipment with low impact on the substrate.

At Tokyo Kako, we handle hybrid etching equipment that stably achieves a high etch factor in mass production. Since it does not use special additives, it is low-cost, and thanks to new technology, the etching shapes on both sides are equivalent. It is suitable for thin material transport and can handle 40μm transport. The impact on the substrate is low, which is advantageous for tenting. 【Features】 ■ Low cost as it does not use special additives ■ Stably achieves a high etch factor in mass production ■ New technology ensures equivalent etching shapes on both sides ■ Suitable for thin material transport, capable of 40μm transport ■ Low impact on the substrate, advantageous for tenting *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Eminent Series Third Generation Etching Device "Eminent 2"

Eminent Series Third Generation Etching Device "Eminent 2"

High maintainability! An etching device with improved etching uniformity and pattern accuracy.

Tokyo Kako's "Eminent 2" is the successor to the etching device "Eminent," boasting a track record of delivering 180 units across five countries. The uniformity on both sides of the substrate has improved by over 35% due to enhancements in spray shape and flow rate. Additionally, by adopting a new type of wheel, we have established support for mass transport of core material substrates at 40μm. Maintenance has also been significantly improved. 【Features】 ■ Improved etching uniformity ■ Enhanced transportability for thin materials ■ Significant improvement in maintenance ■ Improved pattern accuracy *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment

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Wire and tube etching device

Wire and tube etching device

Processing that is stronger than UV treatment but weaker than blasting or polishing is possible. It is suitable for processing elongated workpieces, compact, and has low running costs.

- Can process workpieces with weak mechanical strength - Non-contact treatment that does not damage the workpiece - Does not use liquids - Can process not only metals but also resins - Only Ar gas and water are required for the process - Does not produce dust or waste - Can be installed in clean rooms (excluding vacuum pumps)

  • Other processing machines

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