Exposure equipment for industrial and electronic components
A exposure machine that aligns the glass mask and work, and transfers fine mask patterns.
We have both automatic and manual exposure machines available.
- Company:ウシオライティング
- Price:Other
Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.
61~85 item / All 85 items
A exposure machine that aligns the glass mask and work, and transfers fine mask patterns.
We have both automatic and manual exposure machines available.
A mask aligner that achieves a high throughput of 190 WPH.
This is a fully automatic exposure device compatible with a 2-inch wafer size. By replacing the conventional multi-joint robots used in wafer transport with three self-developed transport robots, we have achieved a high throughput of 190 pieces (2-inch wafers) per hour. In particular, the newly developed alignment image processing employs auto-alignment that performs composite searches with arbitrary coordinate specification and intelligent θ search. Additionally, to ensure stable visibility, the microscope's halogen lighting incorporates a new mechanism that feeds back illumination attenuation through image processing. The operator simply sets the photomask and wafer and selects a pre-stored exposure recipe, allowing for automatic wafer transport, alignment with the photomask, and exposure, enabling stable exposure with precision that does not depend on the operator or experience level.
A maskless exposure device suitable for research and prototyping where trial and error is essential.
The "DDB-701 Series" is a maskless exposure device that allows for photolithography, a representative of MEMS technology, to be performed easily and freely on a desktop. The device size has been thoroughly minimized to achieve an installation area of A3 size. By adopting a floating structure, vibrations are suppressed, eliminating the need for an anti-vibration table and incorporating an air source for vacuum suction, thus removing utilities such as compressed air that can often be obstacles during installation. 【Features】 ■ Desktop type that does not require a specific installation location ■ Low price setting that overturns industry norms ■ Pursuit of user-friendly operability *For more details, please download the PDF or feel free to contact us.
Wafer size post-process projection exposure equipment MRS adopts UV-LED light source as the standard light source (enabling reduction of running costs without sacrificing productivity!)
■ For 8 inches and below, "single exposure method" is available, while for 12 inches, "step and repeat exposure method" can be selected. ■ Achieves high productivity due to a wide exposure area. ■ Has a deep focal depth, with numerous achievements in the MEMS and RF filter industries. ■ Compatible with TAIKO wafers. ■ Global alignment method. ■ High-precision alignment exposure is achieved with a high-rigidity frame. ■ Focus map mechanism is standard equipment.
Mirror projection mask aligner, a unit that enables double-sided exposure with contact aligners. There is also a proven track record for IR (near-infrared) specifications.
There is a strong demand for mirror projection exposure machines that can perform batch exposure without damaging masks. This machine has contributed to the production of MEMS, such as transistors and power semiconductors, for many years with its compact footprint and low maintenance costs. It continues to tackle challenges related to degradation over time, such as reduced illuminance and deterioration of resolution and uniformity, through unique technologies like mirror regeneration. 【Equipment Modification】 ■ Sale of refurbished used equipment ■ Change of substrate size ■ Chamber refrigerant modification ■ Mirror regeneration 【Parts Sales】 【Pickup Overhaul】 【Regular Maintenance】 【Relocation Services】 ■ In-house relocation ■ Factory relocation 【Troubleshooting】
We provide service for Canon FPA3000 and Nikon NSR.
The FPA3000 series, which is an i-line stepper, has a proven track record as a standard silicon wafer production machine, and it is highly regarded for its ability to handle the characteristics of compound wafers, such as warping and weight, making it widely supported in that field. Our company is committed to maintaining appropriate inventory levels and has established a demo environment equipped with a developer, microscope, and CDSEM. 【Equipment Modification】 ■ Sale of refurbished used equipment ■ Wafer size change ■ Reticle size change ■ Change of reticle changer type ■ Chamber refrigerant modification 【Parts Sales】 【Parts Repair】 ■ Repair of circuit boards 【Regular Maintenance】 【Relocation Services】 ■ In-house relocation ■ Factory relocation 【Troubleshooting】
The dust prevention measures are different from previous exposure devices!
Our unique system performs exposure with the substrate in an upright position, eliminating yield loss due to debris issues.
Up to 25 locations can be exposed with varying exposure conditions using open-frame exposure.
The UVES series photo process analysis exposure device is an exposure tool for research and development of photoresists. By performing step exposure, it allows for open-frame exposure with varying exposure conditions at up to 25 locations. By developing and analyzing the exposed samples using a resist development analyzer, it accelerates the material and process development of photoresists. Furthermore, by using the optional degassing collection unit, it enables component analysis of outgassing from the resist during exposure. For more details, please contact us or refer to the catalog.
EQ-10 equipped with EUV light source, extreme ultraviolet light compatible analysis exposure device.
The EUV exposure device EUVES-7000 for resist analysis is equipped with the EQ-10 EUV light source manufactured by Energetiq Technology in the United States, enabling open-frame exposure compatible with extreme ultraviolet light at a wavelength of 13.5 nm.
It has excellent exposure stability and reproducibility.
JEM's large exposure device is a state-of-the-art high-performance large exposure system that incorporates an integrated light integrator, ballast mechanism, large dry rotary pump, vacuum regulator, and other components to achieve consistently uniform exposure.
It is a compactly designed manual auto-alignment exposure device (mask aligner).
【Main Features】 - A manual batch exposure device ideal for multi-variety, small-lot production and experiments/research. - Equipped with high-precision auto-alignment and backside alignment functions. - Capable of auto-alignment for cracked substrates. - Achieves space-saving by reducing the footprint. - UV-LED light source can be installed. - Recipe management function. - Operator assistance and log storage using a barcode reader.
Exposure device (mask aligner) compatible with Ø200mm and Ø300mm.
**Main Features** - Equipped with a self-developed mirror optical lamp house, achieving uniformity on the irradiation surface and high brightness. - Adopts a unique coaxial alignment method and high-speed image processing technology, enabling high-precision alignment. Compatible with IR methods and back-side methods. - Utilizes a proprietary optical gap sensor to set the proximity gap between the mask and substrate non-contactly with high speed and precision. - Equipped with a mask changer that can automatically exchange up to 20 photomasks. Up to 3 load ports can be installed.
Selectable irradiation range according to purpose! Versatile wavelength compatibility for experiments and research.
The "UV-1500MT" is a UV exposure device suitable for experiments and research, capable of interchangeable use with a 1500W metal halide lamp and mercury lamp, and compatible with multiple wavelengths. It features a unique optical design that achieves high power and compactness. By using high-stability, long-life, ozone-free lamps, it allows for the selection of irradiation wavelengths according to the application. It is equipped with a variety of functions, including rich remote capabilities for automated lines and comprehensive noise prevention measures. 【Features】 ■ Unique optical design that achieves high power and compactness ■ Use of high-stability, long-life, ozone-free lamps ■ Ability to select irradiation wavelengths according to application ■ Intensity adjustment possible from 70% to 100% ■ Rich remote functions compatible with automated lines ■ Comprehensive noise prevention measures *For more details, please refer to the PDF document or feel free to contact us.
Implemented in the press room, developing room, and clean room! Introducing our process equipment.
Our company performs "patterning (inner layer)" using process equipment. In the press room, we check the inner layer pattern with an X-ray drilling machine and create reference holes. In the developing room, we clean the boards cut to specified sizes and improve the adhesion of the dry film. In the clean room, we peel off the polyethylene film with an auto-laminating cutter while pressing it with a heat roll to ensure adhesion between the film and the substrate, followed by exposure to ultraviolet light. In the developing room, we swell and peel off the unexposed areas. [Process] ■ Reference hole processing ■ Surface leveling ■ Exposure ■ Development *For more details, please refer to the PDF document or feel free to contact us.
Mirror projection mask aligner, a unit that enables double-sided exposure with contact aligners.
The "Backside Alignment System (IRAS)" is a unit that allows for the alignment of the backside of wafers by being mounted on MPA and PLA. It is designed for using MPA and PLA as backside exposure devices. It is suitable for users considering the purchase of a new backside exposure device. Please feel free to contact us if you have any inquiries. 【Overview】 ■ Main Additional Components - CCD camera for mask alignment - Near-infrared CCD camera for backside wafer alignment - Monitor and computer for image analysis - Backside camera unit stage - Others ■ Compatible Models: MPA600 Series, PLA Series ■ Installation Period: 1.5 weeks ■ Near-infrared specifications are also available * For more details, please download the PDF or contact us.
We also provide proposals and support for consumables! We handle everything from selecting and installing pharmaceuticals to manufacturing equipment comprehensively.
At YKC Corporation, our "Printed Circuit Board Business" provides comprehensive services from the selection and installation of manufacturing equipment to the chemicals involved in printed circuit board manufacturing. We also offer proposals and support for consumables such as router bits, drills, and cartridge filters. We respond to diverse needs, so please feel free to contact us when you require assistance. 【Features】 ■ Comprehensive support from the selection and installation of chemicals to manufacturing equipment ■ Proposals and support for consumables *For more details, please refer to the PDF materials or feel free to contact us.
Easy setup, automatic parallel adjustment, complete non-contact gap management. A low-cost manual mask aligner without a transport system.
This product is a manual batch equal exposure mask alignment device. It is a device that sets the substrate on the exposure stage and performs exposure. The wafer is manually set onto the exposure stage. The tedious alignment of the photomask and wafer, as well as gap adjustments, are done automatically. Additionally, by incorporating a super-precision UVW drive stage and performing high-performance image processing, the alignment of the photomask and wafer is carried out accurately. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. Custom orders for special substrates are also accepted. 【Features】 - Complete non-contact alignment and exposure of photomask and wafer - Equipped with auto-alignment function - Easy setup changes, compatible with multiple substrate sizes - Suitable for small-batch production, research, and development - Space-saving and easy maintenance - Achieves low price and compact design - Equipped with super-precision UVW stage - Custom orders for special substrates available *For more details, please refer to the PDF document or feel free to contact us.
MEMSデバイスの研究開発から少ロット・多品種、量産まで対応可能な露光装置/マスクアライナーをラインアップ!
株式会社三明では、コンパクトな微細露光機や両面プロセスのローコストアシストモデル、 両面・多面プロセスのスタンダード量産機である手動型の露光機をはじめ、 少ロット多品種から量産まで対応した半自動・全自動タイプなど優れたローコストな露光装置を多数ラインアップしております。 【各種ラインアップの特長】 (マニュアル マスクアライナー) ■高倍率ズーム顕微鏡を備えた、手動式露光装置! ■片面露光タイプ、両面露光タイプ、両面同時露光タイプと多彩なシリーズをラインナップ! (セミオート マスクアライナー) ■自動ギャップ調整から手動アライメント、自動コンタクト露光、自動搬出の流れで量産が可能! (フルオート マスクアライナー) ■C to C 自動搬送 ■丸形、角形試料など、各種デバイスへ露光可能! ※詳しくはお問い合わせ、もしくはカタログをご覧ください。
Supports everything from MEMS devices to mass production. Assists in the miniaturization process.
In the semiconductor industry, miniaturization technology is essential due to the increasing performance of devices. In the miniaturization process, high-precision exposure technology is required, which affects the quality and yield of the manufacturing process. The selection of exposure equipment leads to improved product reliability and yield. Our exposure equipment supports the miniaturization process of our customers, from research and development of MEMS devices to small lot, diverse varieties, and mass production. 【Application Scenarios】 - MEMS device manufacturing - Pattern exposure on semiconductor wafers - Microfabrication processes 【Benefits of Implementation】 - Improved yield through high-precision exposure - Compatibility with a variety of devices - Establishment of a low-cost mass production system
Used semiconductor manufacturing equipment
Our company website features information on used equipment related to FPD and semiconductors. For used equipment, contact High-Tech Systems! For inquiries about semiconductor manufacturing equipment, reach out to High-Tech Systems!
Exposure machine/Aligner/Stepper/Stepper
Our company website features information on used equipment related to FPD and semiconductors. Used equipment from High Tech Systems!
Easy setup, automatic parallel adjustment, complete non-contact gap management. Semi-automatic mask aligner equipped with a transport unit.
This product is a semi-automatic batch equal exposure mask alignment device. It sets one substrate at a time and automatically performs transportation and exposure after the substrate is set. It conducts fully non-contact automatic parallel adjustment between the photomask and the wafer. The cumbersome task of manually adjusting the gap is completely unnecessary. Additionally, by equipping a super-precise UVW drive stage and performing high-performance image processing, it accurately aligns the photomask and the wafer. It supports both soft and hard contact. With a lineup tailored to production volume, ranging from manual machines to fully automatic machines, we achieve low prices by handling everything from design to manufacturing and sales in-house. Custom orders for special substrates are also accepted. 【Features】 ■ Fully non-contact parallel alignment and exposure of photomask and wafer ■ Equipped with auto-alignment function ■ Easy setup change, compatible with multiple substrate sizes ■ Suitable for small-batch production, research, and development ■ Space-saving and easy maintenance ■ Achieves low price and compact design ■ Equipped with super-precise UVW stage ■ Custom orders for special substrates available *For more details, please refer to the PDF document or feel free to contact us.
Pattern exposure at matching positions on the front and back of samples with different processes! Nanotech exposure equipment.
The mask alignment exposure device "BA Series" for backside alignment of samples is a low-cost mask alignment device that enables alignment from the backside of the sample, which was difficult with conventional exposure devices. This device allows for alignment and exposure of the mask pattern to a specified position on the opposite side (the second side) relative to the alignment mark pre-formed on the first side of the sample. Its compact design also allows it to be used as a standard single-sided exposure mask aligner, supporting the development of various MEMS and semiconductor devices with double-sided features. 【Features】 ■ Equipped with a dual-objective 2-field CCD microscope dedicated to backside observation ■ Minimum objective lens spacing of 16mm ■ Capable of aligning small samples ■ Equipped with a freeze-wipe processing device optimized for backside alignment ■ High-precision alignment stage with front slide for convenient sample access, among others *For more details, please refer to the catalog or feel free to contact us.