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Polishing machine Product List and Ranking from 43 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Polishing machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  4. 4 チップトン Aichi//Manufacturing and processing contract
  5. 5 null/null

Polishing machine Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. [Grinding Device] Tape Grinding Unit "BM Series" Kovax Corporation
  3. Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper. アイエムティー
  4. 4 Plate-shaped white particles of titanium phosphate contribute to the improvement of the lubrication performance of solid lubricants! フジミインコーポレーテッド
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing machine Product List

706~720 item / All 812 items

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Small Path High-Speed Ball Grinding Machine HPS-50H

High precision and stable finish.

It is a high-performance compact spherical grinding machine with a processing axis that precisely oscillates the spherical core.

  • Other processing machines

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Fluid polishing device

- By mixing abrasive particles with the medium and discharging it, the inner walls of the water pipe are "polished." - Even complex water pipes can be polished.

This is a device that "polishes" the inner wall of water pipes by repeatedly reciprocating a medium containing abrasive particles under high pressure (up to 2.5 MPa on the work side safety valve). Fluid Polishing Device KMM - Power: Hydraulic pump - Voltage: AC200 50/60Hz 3-phase - Apparent power: 3.7 kVA - Pressure: 1.5 MPa - Tank capacity: 1.5L x 2 - Abrasive: Alumina - Flow rate change: Example: during shaping 1.5L/min → 2.5L/min - Processing purpose: Rust removal and polishing of water pipes - Target parts: Water pipes of molds in general, parts and devices with water pipes - External dimensions (mm): W580 × D902 × H1304 (Piping part: 91, Patrol light: 158) - Weight: 235 kg

  • Contract manufacturing

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Processing machinery - Grinding machine

Leave it to us for polishing machines!

Our company develops and manufactures ultra-precision processing machines, and we handle "grinding machines" as processing equipment. We offer a range of machines including ultra-large double-sided lapping machines, optical grinding machines, and oscillating single-sided grinding machines. Please feel free to contact us if you have any inquiries. 【Product Lineup】 ■ Ultra-large double-sided lapping machine: MODEL TDX-48B ■ Optical grinding machine: MODEL TOP-1200 ■ Oscillating single-sided grinding machine: MODEL TSOP-600 *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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WISE Corporation Printed Circuit Board Hole Filling Paste Removal Grinding Device

A completely different polishing method from the conventional one! It demonstrates high capability in removing resin, paste, and ink after the filling process.

We would like to introduce the "Filling Paste Removal Polishing Device" manufactured by WISE (Italy), which we handle. This product utilizes a completely different polishing method from conventional ones, demonstrating high capability in removing resin, paste, and ink after the filling process. The processing range for substrates is 650 and 760 mm. It can accommodate panel thicknesses from 0.3 mm up to a maximum of 12 mm. 【Features】 ■ A completely different polishing method from conventional ones ■ High capability in removing resin, paste, and ink after the filling process ■ Processing range for substrates: 650 and 760 mm ■ Panel thickness: 0.3 mm ■ Maximum panel thickness: 12 mm *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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One company provides comprehensive support for grinding processes (internal diameter grinding, external diameter grinding, and flat grinding)!

The world of grinding requires precision at the 1μ level! Reducing costs such as labor expenses for transportation to external suppliers.

Our company is equipped with internal grinding machines for inner diameter polishing, cylindrical grinding machines for outer diameter polishing, and surface grinding machines for flat surface polishing, allowing us to perform internal, external, and flat polishing consistently in-house. We achieve short delivery times through integrated processing. By not outsourcing, we maintain our technical standards and ensure stable quality assurance. Furthermore, we have skilled workers with over 10 years of experience, and we pass on their expertise to the younger generation, enabling us to carry out integrated production in-house. 【Features】 - Achieves short delivery times through integrated processing - Reduces costs associated with labor for transportation to outsourcing partners - Maintains our technical standards and ensures stable quality assurance by not outsourcing - Capable of performing internal, external, and flat polishing consistently in-house - Employs skilled workers with over 10 years of experience *For more details, please refer to the related link page or feel free to contact us.

  • Processing Contract

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Round Blade Grinder LA300 (Manufactured by MVM) [Short Delivery Time]

A 'reasonable' sharpening machine for re-sharpening slitter knives!

The "LA300" is a grinding machine designed for sharpening slitter knives (upper and lower blades). This practical, convenient, and compact machine is easy to use and can grind up to an outer diameter of 300mm. Additionally, it uses a 1.5kW motor with automatic feed and allows for angle settings from 0 degrees to 70 degrees. 【Specifications】 ■ Grinding stone motor power: 1.5kW ■ Grinding stone outer diameter: 127mm ■ Table rotation speed: 3 to 35rpm ■ Maximum grindable outer diameter: 300mm ■ Machine size: 700x500x1500mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Round blade grinding machine / grinding machine with rotating table LA500 (manufactured by MVM)

A 'reasonable' grinding machine for sharpening slitter knives of various shapes!

The "LA500" is a very versatile, unique, and user-friendly grinding machine. It features a very sturdy and high-rigidity base, and thanks to its excellent weight distribution, it operates without vibration, allowing for high-quality finishing grinding. Additionally, we also offer a version called "LA700" for grinding circular blades and discs with a diameter of up to 700mm. 【Specifications】 ■ Grinding wheel motor power: 2.2-3.7kW ■ Grinding wheel inner diameter: 150mm ■ Outer diameter of the central hole of the grinding wheel: 20mm ■ Variable speed of the rotating table: 3-35rpm ■ Diameter of the magnetic table: 300-350-400mm ■ Outer diameter of the magnetic chuck: 25mm *For more details, please download the PDF or feel free to contact us.

  • Other processing machines
  • Grinding Machine
  • Other abrasives

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Ultrasonic Polishing Device "LAPTRONμ"

Ultrasonic polishing device suitable for processing the corners of discharge targets!

"LAPTRONμ" is an ultrasonic polishing device that features the smallest diameter in the series at Φ20mm for the ultrasonic hand tool and a Φ5mm chuck. It can be used not only with ceramics and wood chips + paste but also with metal bond diamond chips. It is particularly suitable for processing corners of discharge surfaces that are prone to unevenness and for product shapes that are less than 1mm. 【Specifications】 ■ Size and Weight ・ Main Unit: W236×D160×H105 (mm) / Approx. 2.3kg ・ Hand Tool: Φ20×L120 (mm) / Approx. 57g ■ Input: AC100V 50/60HZ ■ Output: Maximum 13W, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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"Super Eight Finisher" - 8-Shape Full Flow Barrel Polishing Machine

Achieving efficient polishing with an 8-shaped centrifugal surface flow type.

The "Super Eight Finisher" is a fully flowing high-speed barrel polishing machine that processes various materials uniformly through an "8-shaped motion." It can be used for materials other than metal, such as resin-based works, which are prone to cracking and deformation in conventional barrel polishing machines. Additionally, it can simultaneously process different applications and workpieces, allowing for a large quantity of workpieces to be processed at once. 【Features】 ■ The "8-shaped" flow created by rotation and revolution allows for smooth and uniform finishing in a short time. ■ Wide adaptability regardless of shape or material. ■ Suitable for high-speed automatic polishing of a variety of small lots with a four-tank system. *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Ultra-compact Centrifugal Barrel Polisher 'Mini Barrel II'

This is an ultra-compact and lightweight model of a horizontal centrifugal barrel polishing machine.

The "Mini Barrel II" is a super compact centrifugal barrel polishing machine suitable for metal polishing of ultra-small parts, widely used for small-scale production processing in small manufacturing facilities and prototype processing in various research and development departments. It addresses issues such as "the tank is too large," "there is no installation space," and "the price is too high," which prevent the introduction of barrel polishing machines in small production lines and research and development facilities. 【Features】 ■ Ideal for automating the polishing of small parts in small quantities ■ Equipped with two polishing tanks of just 250cc each ■ Ultra-compact design that can be placed on a desk or workbench ■ Achieves an affordable price for a centrifugal barrel polishing machine ■ Easily usable with a standard AC100V power supply *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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Urethane rotary barrel polishing machine

Contributing to the reduction of environmental impact and total cost down in the barrel polishing process.

Our company offers a dual-purpose "urethane rotary barrel polishing machine" that excels not only in functionality but also in cost performance. Compared to conventional natural rubber (NR), it features a lining made of cast urethane resin with very high durability. Additionally, it significantly reduces the various costs, waiting times, and environmental impact associated with relining rubber linings. 【Key Points】 ■ High durability ■ Significant reduction in costs, waiting times, and environmental impact ■ Stable quality ■ Minimal thermal distortion ■ Improved maintenance workability *For more details, please download the PDF or feel free to contact us.

  • Wafer processing/polishing equipment

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[Production Achievements] Cutting Blade Grinding Machine / Three-Sided Blade Grinding Machine

Up to a blade length of 2000mm! A clean and functional edge alignment is required for both appearance and performance!

The "cutting blade sharpening machine" is a grinder used in paper mills and other facilities for sharpening cutting blades up to 2 meters in length used for cutting paper. Since blades can chip within a day, it is often used late at night to re-sharpen the blades in time for the next day's paper production. The cutting edge of the blade is thin and continuous like a Japanese sword, requiring a beautifully precise sharpening accuracy both visually and functionally. Additionally, there is a "three-way blade" sharpening machine used in binding factories that simultaneously cuts all three edges of magazines, which is equipped with a mechanism for automatic supply and discharge of the workpiece. Both types are designed for the workpiece to move, but there are also models with a moving column that have been produced. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Vibratory Automatic Polishing Machine "Vibromet 2"

Specialized polishing machine for final finishing. Compatible with large samples using a 12-inch polishing bowl.

Vibromet 2 can remove slight tissue alterations that occur during sample preparation without using hazardous chemicals required for electrolytic polishing, exposing the material's original structure on the analysis surface. ■ No worry about distorting the sample surface. Finishes the surface suitable for AFM and EBSD analysis. ■ Does not use hazardous chemicals. ■ No adjustments needed during polishing.

  • Testing Equipment and Devices

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[Research Material] World Market for Optical Grinding Machines

Global Market for Optical Polishing Machines: High-Speed Polishers, Medium-Speed Polishers, Low-Speed Polishers, Optical Lens Polishing, Optical Glass Polishing, Optical Equipment Polishing

This research report (Global Optics Polishing Machine Market) investigates and analyzes the current state and outlook for the global optics polishing machine market over the next five years. It includes information on the overview of the global optics polishing machine market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the optics polishing machine market focus on high-speed polishing machines, medium-speed polishing machines, and low-speed polishing machines, while the segments by application cover optical lens polishing, optical glass polishing, and optical equipment polishing. The regional segments calculate the market size of optics polishing machines by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the optics polishing machine sector, product and business overviews, and sales performance.

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[Research Material] The Global Market for Activated Zinc Oxide

World Market for Active Zinc Oxide: Nano Zinc Oxide, Particle Grade, Ultrafine, Rubber, Coatings, Ceramics, Pharmaceuticals, Fertilizers, Electronics

This research report (Global Active Zinc Oxide Market) investigates and analyzes the current status and outlook for the global active zinc oxide market over the next five years. It includes information on the overview of the global active zinc oxide market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the active zinc oxide market focus on nano zinc oxide, particle grade, and ultrafine, while the segments by application cover rubber, coatings, ceramics, pharmaceuticals, fertilizers, and electronics. The regional segments calculate the market size of active zinc oxide by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in active zinc oxide, product and business overviews, and sales performance.

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