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Soldering Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

Soldering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

  1. 弘輝テック Saitama//Industrial Machinery
  2. アルファエレクトロニクス Saitama//Other manufacturing
  3. FAシンカテクノロジー Fukushima//Industrial Machinery
  4. 4 神港精機 東京支店 Tokyo//Industrial Machinery
  5. 5 センスビー Kanagawa//Other manufacturing
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Soldering Equipment Product ranking

Last Updated： Aggregation Period:Mar 25, 2026～Apr 21, 2026
This ranking is based on the number of page views on our site.

  1. List of Partial Soldering Equipment [Point Dip/Selective] アルファエレクトロニクス
  2. Selective soldering device 'ULTIMA-NEO-L' 弘輝テック
  3. Selective soldering device 'SELBO-III' 弘輝テック
  4. 4 Point jet soldering device 'EQSS-350SD' 弘輝テック
  5. 5 Tabletop Selective Soldering Device 'ULTIMA-TRZ' 弘輝テック

Soldering Equipment Product List

61～90 item / All 98 items

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Tabletop Selective Device "ULTIMA Series"

Tabletop Selective Device "ULTIMA Series"

Space-saving, cost-effective replacement of hand soldering processes and improvement in quality is possible.

The "ULTIMA series" is easy to handle and designed for tabletop use. It addresses the shortage of manual soldering workers and quality instability by replacing them with automated soldering equipment. (Method) Flux application (SPZ) → Preheating (PHS) → Soldering (TRZ) *Material handling is done by the operator. Automation of flux application from manual to automated, reduction of flux liquid volume through uniform application, quality improvement, and labor saving are possible. To accommodate increased production, adding a soldering tank (TRZ) allows for easy and cost-effective solutions. *There are many cases where one operator can handle up to the maximum soldering tank capacity (depending on the circuit board). Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency flux application under optimal conditions ■ Easy numerical management with OP digital flow display ■ Preheating device (PHS) available for reducing soldering time and effective for solder rise ■ A variety of nozzles necessary for soldering can be selected ■ Stable soldering quality, quality improvement, and labor saving are possible *For more details, please refer to the PDF materials or feel free to contact us.

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  • spray
  • Soldering Equipment

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[Induction Heating Application Cases by Industry] Solar Cells

[Induction Heating Application Cases by Industry] Solar Cells

Improving the soldering process in solar cell manufacturing! Introducing examples of high-frequency induction heating applications in the solar cell manufacturing process.

We would like to introduce a case study on the application of induction heating in solar cell manufacturing. The original specification of AroNix's IH (Induction Heating) high-speed soldering module improves the soldering process in solar cell manufacturing. **Features of the IH (Induction Heating) High-Speed Soldering Module:** - **Speed:** Soldering of busbars and interconnectors takes 0.1 to 0.3 seconds per location, and soldering of cell electrodes takes 1 to 2 seconds per location. - **High Control:** Startup time of 5 milliseconds, high-speed automatic frequency tuning with a compact induction heating power supply. - **Clean Heating:** Non-contact direct heating using the IH (Induction Heating) method. - **Energy Saving:** Power consumption is only during heating time, with no need for continuous output. - **Universal Power Supply:** The induction heating power supply is a standard production item, ensuring short delivery times and no maintenance concerns, making it suitable for production lines. - **Flexible Adaptability:** The head weighs approximately 2.6 kg, and the cable between the head and the induction heating power supply is about 4 meters. It can also be adapted for use in automated machines with robots. *For more details, please download the PDF or feel free to contact us.*

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  • Other heating equipment
  • Soldering Equipment

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BGA soldering equipment

BGA soldering equipment

Rework for mobile devices!!

- It has a compact design that allows for installation on a tabletop. - Since it uses partial heating, it minimizes thermal load on surrounding components that should not be heated. - It can flexibly accommodate a variety of circuit boards. - It can handle complex temperature profiles.

  • Soldering Equipment
  • Soldering Equipment

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Automatic Soldering Device Smart Dip II

Automatic Soldering Device Smart Dip II

Realization of high quality and high stability through patented technology.

The "Smart Dip II FXM-1" is an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxide generation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow rate of the generated waves, this method minimizes the occurrence of copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Reduces daily maintenance time ■ Low oxide generation allows for reduced running costs *For more details, please feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Ultra-compact all-in-one soldering device

Ultra-compact all-in-one soldering device

Supports production of 1 cell in a flow! Space-saving design that doesn't take up much room even when installed in a laboratory.

The "SSF-200-B3" is a W-wave flow soldering machine that can perform flux application, preheating, soldering, and cooling in a space-saving manner. It allows for optimal condition settings tailored to the circuit board and fine condition adjustments for prototypes. The layout can be easily changed, enabling the construction of dedicated cell lines. 【Features】 ■ Usable for multiple purposes ■ Compatible with single-piece flow cell production ■ Numerical management of solder operation conditions is possible ■ High space efficiency ■ Space-saving design that does not take up much room, making it suitable for installation in laboratories for development and prototyping *For more details, please feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Automatic Soldering Device Smart Dip Return Back Type

Automatic Soldering Device Smart Dip Return Back Type

Reduce pattern erosion at low flow rates! It can also accommodate soldering of long lead PCBs.

The "Smart Dip Return Back Type FZH-4639" is an automatic soldering device that utilizes our patented technology. Thanks to the stirring mechanism (our patented technology), it enables uniform and reproducible soldering. The low flow velocity of the generated waves makes it less likely for copper erosion to occur with lead-free solder. The workpiece returns to the input port, allowing for one-man operation. The operator can remove the workpiece and prepare the next workpiece, such as inserting components, while it returns to their hands. 【Features】 ■ Low flow velocity soldering ■ Compatible with long leads ■ Supports cell production ■ Static tank + stirring soldering method ■ Minimal generation of oxides *For more details, please feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Automatic Soldering Device Smart Dip II Inline

Automatic Soldering Device Smart Dip II Inline

Realization of high quality and high stability through patented technology.

The "Smart Dip II FXM-2" is an inline model of the automatic soldering device from the "Smart Dip Series," which achieves high quality and high stability. It uses a stirring mechanism (our patented technology) to generate waves, promoting heat exchange and performing soldering. This maintains the advantages of reduced oxidation in the stagnant tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow velocity of the generated waves, this method is less likely to cause copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Possible reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Wire harness automatic soldering device

Wire harness automatic soldering device

Skillfully control flexible objects with unstable postures. Automation of difficult tasks eliminates the need for certified operators!

We would like to introduce the "Wire Harness Automated Soldering Solution" provided by our group company, Nagano Japan Radio Co., Ltd. We focus on the processing of flexible wire harnesses and the automation of soldering operations! In addition to the company's strength in wire harness processing technology, our unique robot vision technology enables high-precision positioning of difficult-to-handle wire harnesses at the targeted locations. We achieve stable quality with solder parameters suitable for the workpiece. 【Features】 ■ Technology that accurately moves the robot to the targeted position using image recognition technology ■ Technology that uses a unique robot hand to grasp flexible materials without causing damage and position them ■ Automation from wire harness processing to soldering operations ■ Full automation of the production line, including the upstream and downstream processes and transportation (customizable) ■ Long-standing track record of implementation in major machinery and parts manufacturers *For more details, please download the PDF or feel free to contact us. Inquiries will be handled directly by Nagano Japan Radio Co., Ltd.

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  • Soldering Equipment
  • Soldering Equipment

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Lead-free compatible local soldering device EP-22LM type

Lead-free compatible local soldering device EP-22LM type

Adjustable to match the height of the parts!

This is a notice from Renq Electric Manufacturing Co., Ltd. regarding the "EP-22LM model."

  • Soldering Equipment
  • Soldering Equipment

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High-Temperature Soldering Device TD-H551-ML-C Type

High-Temperature Soldering Device TD-H551-ML-C Type

For soldering transformers and special coils!

This is a notice from Renq Electric Manufacturing Co. regarding the "TD-H551-ML-C model."

  • Soldering Equipment
  • Soldering Equipment

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[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

Achieving improved OEE and reduced CT in the soldering process. Minimizing upstream and downstream processes while maximizing automatic soldering time with the IH soldering device 'S-WAVE'.

The IH soldering device "S-WAVE" was born as a device that allows for soldering without the need for tool changes, enabling quick and beautiful soldering with high thermal capacity. This document introduces the improvement in production capacity arising from the above two features. It provides detailed explanations on topics such as "Changes in the soldering process flow with S-WAVE" and "Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read through it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]

Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]

Since it heats metal non-contact, soldering is possible even with a "4mm" wall terminal! We will also introduce examples of achieving soldering on a 6-layer thick copper substrate.

The IH soldering device "S-WAVE" has a magnetic concentration head tip that remains below 100°C, while only the terminals can rise to 250°C, allowing for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have increased in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Cases" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Cases" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the advantages of the WAVE series IH soldering, making it easy to reference when considering implementation. **Advantages of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Solder
  • Soldering Equipment

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【IH Soldering Example】Wall Terminal

【IH Soldering Example】Wall Terminal

Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!

This is an example of soldering with IH (induction heating) on the edge terminal of an automotive product. When the resin part is close to the terminal, issues often arise with the soldering iron method due to radiant heat, and with the laser method due to reflected light, which can melt the resin part. In the case of the IH method, the tip of the magnetic concentration head remains below 100°C while the terminal itself rises to 250°C. This characteristic allows for soldering without issues even when resin is nearby. [Case Summary] ■ Issues - With the soldering iron method, radiant heat is a problem, and with the laser method, reflected light can often melt the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

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  • Soldering Equipment
  • Soldering Equipment

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A 3D local heating IH soldering device that can also accommodate characteristic substrates!

A 3D local heating IH soldering device that can also accommodate characteristic substrates!

Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It can accommodate characteristic substrates such as busbars, power semiconductors, four-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards that require a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Capability to accommodate characteristic substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

  • Heating device
  • Soldering Equipment

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IH soldering device "S-WAVE FBA series"

IH soldering device "S-WAVE FBA series"

Equipped with loader/unloader! Targeting inline processes after soldering and multi-product production, etc.

The "S-WAVE FBA Series" is a product designed to suppress solder balls during low-temperature soldering at 250°C. It allows for non-contact tool changes that are unnecessary for an extended period. It is applicable to general through-hole mounting of electronic components, terminals with insufficient solder, and areas with heat-sensitive components or surrounding parts. Additionally, the use of solder wire supply reduces solder material consumption, and the power consumption during soldering is less than 300W. 【Features】 ■ Suppresses solder balls during low-temperature soldering at 250°C ■ Non-contact tool changes are unnecessary for an extended period ■ Daily maintenance is automated with a temperature checker/cleaning device (optional) ■ Reduces solder material consumption through solder wire supply ■ Power consumption is less than 300W (during soldering) *For more details, please refer to the PDF document or feel free to contact us.

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  • Soldering Equipment
  • Soldering Equipment

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Device: Ultra-Compact Automatic Soldering Device, Cell Solder Series

Device: Ultra-Compact Automatic Soldering Device, Cell Solder Series

Lead-free compatible ultra-compact automatic soldering device Cell Solder series

Ultra-compact design specialized for small quantities and diverse varieties in cell production!

  • Soldering Equipment
  • Soldering Equipment

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Ultra-compact soldering device "SS-8300"

Ultra-compact soldering device "SS-8300"

For those struggling with soldering in parts repair/repair/reimplementation! Featuring super chips! An ultra-compact soldering device with comprehensive lead-free measures.

For soldering equipment, turn to Denon Equipment. The "SS-8300" uses lead-free compatible chip materials (special alloys) to reduce solder erosion, oxidation corrosion, and thermal expansion compared to conventional products, ensuring excellent temperature characteristics. Only the tip of the soldering iron can be replaced, making it cost-effective. Additionally, the adoption of a newly developed chip-inside heater excels in temperature rise characteristics and thermal recovery characteristics. Static electricity measures are also thorough. 【Features】 ○ The heater and sensor are inserted into the chip, resulting in extremely high temperature characteristics (world-class level) ○ The chip and heater can be separated, allowing for low-cost chips ○ The lifespan of the super chip is 2 to 4 times longer compared to conventional products (plated copper) For more details, please contact us or download the catalog.

  • Soldering Equipment
  • Soldering Equipment

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Production equipment and tools: Small automatic soldering device

Production equipment and tools: Small automatic soldering device

From conventional large equipment to compact! Shortened time for solder melting!

At Maruhi Co., Ltd., we handle everything from the design and development of production equipment and tools to parts processing and assembly. We possess processing equipment such as NC lathes, machining centers, wire cutting, inner diameter grinding, and outer diameter grinding, and we respond to customer requests from prototype to mass production. Our compact automatic soldering device has been reduced in size from traditional large equipment and has achieved a shorter time for solder melting. Compared to jet type devices, it significantly reduces electricity and solder consumption. It is energy-efficient and ensures a stable solder liquid level while reducing solder oxidation. For more details, please contact us or refer to our catalog.

  • Soldering Equipment
  • Soldering Equipment

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Apollo Seiko Co., Ltd. Soldering Equipment Comprehensive Catalog

Apollo Seiko Co., Ltd. Soldering Equipment Comprehensive Catalog

Comprehensive catalog of soldering equipment. Featuring devices characterized by high quality, high efficiency, and ease of use.

The "Soldering Equipment Comprehensive Catalog" from Apollo Seiko Co., Ltd., handled by Keitecno Co., Ltd., features the next-generation robot "L-CAT NEO," which is equipped with all the necessary functions for soldering, as well as various high-quality, high-efficiency, and user-friendly soldering robots and equipment. The soldering equipment from Apollo Seiko Co., Ltd. includes features such as "solder tip exchange," "solder ball scattering prevention mechanism," and "accumulated technological expertise." [Contents] - Automatic soldering robots - Soldering units - Manual soldering equipment - Soldering-related devices - Soldering options and consumables For more details, please contact us or download the catalog.

  • Soldering Equipment
  • Other industrial robots
  • Soldering Equipment

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Sale of used equipment

Sale of used equipment

Our company will fully support your needs with our high level of equipment technology!

At Aiwa Kiko Co., Ltd., we are engaged in the "sale of used equipment." In the area of assembly-related equipment, we offer a lineup that includes the "N2 reflow oven," "spray fluxer," "conveyor," and "metal mask cleaning machine." Additionally, we have a wide range of products related to clean rooms, such as "air showers" and "humidifiers." Please feel free to contact us. 【Product List (Excerpt)】 ■ Soldering-related - N2 reflow oven (Tamura) - Soldering machine (Tamura) - Spray fluxer (Tamura) - Humidifier Clean Wetter (Aiwa Kiko) - Metal mask cleaning machine (Sauer Corporation) *For more details, please refer to the PDF materials or feel free to contact us through our website.

  • Other services
  • Reflow Equipment
  • Air Shower
  • Soldering Equipment

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Laser soldering device

Laser soldering device

We propose automation of equipment tailored to your needs.

We would like to introduce the "Laser Soldering Equipment" handled by OMC Corporation. Compatible with various devices from Panasonic Production Engineering, including semiconductor infrared lasers of 10W/30W/75W and blue lasers of 10W/50W. We offer PC/PLC control, dedicated machines/inline machines, and support for solder wire feeding devices/cream solder dispensers from various manufacturers. We will build a system using the equipment of your choice according to your budget. 【Features】 ■ Easy operation for high-quality soldering ■ Suitable for fine processing (minimum spot diameter: 0.4mm, solder wire diameter: φ0.3mm) ■ Establishment of a Class 4 laser management area, ensuring comprehensive safety measures ■ Equipped with semiconductor lasers from Panasonic Production Engineering *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Inline type partial soldering device "SYNCHRODEX"

Inline type partial soldering device "SYNCHRODEX"

Achieving reduced cycle time and high productivity in an inline manner! A flexible, high-quality, low-cost soldering device.

The "SYNCHRODEX" is a modular inline production partial soldering device. Equipped with a built-in fluxer, it can handle everything from flux application to soldering with just one unit. By increasing the number of connected units, the takt time can be further shortened. The number of connected units and the layout within the module can be freely selected. Since it uses the same software as other Pillarhouse devices, program sharing is possible. It has a track record of over 10 years since its launch. In addition, we also offer the batch production system "JADE MK2." 【Features】 ■ PCB size compatibility: 457×610mm ■ Inline & batch operation ■ Built-in drop jet fluxer (ultrasonic fluxer option) ■ Nitrogen atmosphere ■ Top-side IR preheater option ♯Localized soldering ♯Partial soldering ♯Selective soldering

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  • Soldering Equipment
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List of Partial Soldering Equipment [Point Dip/Selective]

List of Partial Soldering Equipment [Point Dip/Selective]

The "Demo Now Available" partial soldering device, also known as point dip or selective flow, solves the problems of flow soldering!

The Pillarhouse partial soldering equipment allows for replacement of flow soldering baths and enables soldering in areas that were not possible with conventional methods. 1. No Pallet Eliminates the need for pallets, reducing costs and setup time. 2. High-Quality Soldering Allows control over the position and time of the jet flow for each component, with a lineup of over 30 types of solder jet nozzles ranging from 1.5mm to 25mm to accommodate various circuit boards. 3. Excellent Operability All models are equipped with teaching cameras, allowing program creation while viewing actual circuit boards, eliminating the need to import drawings. 4. Reduction of Dross The solder bath is small, and the soldering area is in a nitrogen atmosphere, significantly reducing solder dross. For differences between each device, please refer to the 'Lineup' section. Feel free to contact us with any inquiries. #LocalizedSoldering #Solder #PartialSoldering

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  • Soldering Equipment
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Inline type partial soldering device "SYNCHRODEX PRO"

Inline type partial soldering device "SYNCHRODEX PRO"

Achieve reduced cycle time and high productivity with inline methods! Enhanced version of the high-quality soldering equipment SYNCHRODEX.

The "SYNCHRODEX PRO" is a partial soldering device compatible with inline production methods. It comes in two types of enclosures: large frame and standard frame. It can be modified to a twin bus configuration. Each motor shaft uses a DC servo. The soldering pot and pump can be exchanged between mechanical (impeller) and electromagnetic induction types. An optional bottom IR preheater can also be installed within the soldering pot module. #Partial Soldering Device #Local Soldering Device #Selective #Point Dip

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  • Soldering Equipment
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Selective soldering device "PSI-250 Line"

Selective soldering device "PSI-250 Line"

Flexible assembly with a modular system! Achieves excellent detail application with a two-fluid spray method!

The "PSI-250 Line" is a soldering device that allows for flexible coordination of process configurations using a modular system. By adopting a new mechanism, it achieves user-friendly high performance. Additionally, the new transport mechanism improves access within the device. It also enables interlocking functions for operation. 【Features】 ■ Flexible configuration with a modular system ■ Improved access within the device with a new transport mechanism ■ Interlocking functions for operation ■ Easy programming with SSolder *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
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Multipoint Soldering "MPS Series"

Multipoint Soldering "MPS Series"

A device that can perform soldering with high efficiency and high quality!

We offer the "Automatic Bulk Soldering Machine for High-Density Mounting Boards," the Multi-Point Solderer 'MPS Series-2000/4000.' The 'MPS Series-2000/4000' allows for easy and stable soldering of multiple inserted components in a short time by simply placing and pressing them down in the post-process of surface-mounted boards. 【Product Lineup】 ■ MPS-2000 ■ MPS-4000 *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Solder
  • Soldering Equipment

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Quspa SOALA

Quspa SOALA

Unifying coating and area laser soldering. Achieve space-saving and time-saving with this one machine!

**Features** ◆ Space-saving By consolidating two different processes into one, we have achieved a 30% reduction in space compared to the traditional two equipment setups. Inline integration becomes easier. ◆ Time-saving By adopting area lasers, simultaneous soldering can be performed on multiple pins. A cycle time of 0.7 seconds per pin for solder application is now possible. This achieves a 60% reduction in cycle time compared to wire soldering and spot lasers. ◆ Labor-saving Non-contact operation allows for implementation in narrow spaces where the soldering tip cannot reach, without putting stress on the circuit board or terminals. Maintenance such as cleaning or replacing the soldering tip is unnecessary, facilitating automation through continuous operation. ◆ Energy-saving Since no soldering tip is used, the cost of consumables is reduced. Additionally, compared to solder baths and reflow ovens, there is no need for constant heating, allowing for savings on electricity costs. ◆ Enhanced customization capability We cater to various needs such as product size, weight, flow direction, and appearance inspection.

  • Soldering Equipment
  • Soldering Equipment

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Automatic soldering machine 'SHF-350'

Automatic soldering machine 'SHF-350'

Achieve increased exhaust power and reduced wave impact! The preheating four zones allow for individual temperature control!

The "SHF-350" is a lead-free compatible automatic soldering machine. It is equipped with special features that support pallet jigs, making it capable of handling large circuit boards. The full-open structure allows for easy maintenance from both the front and back. Thanks to special development technology, it achieves increased discharge power and reduced wave motion, and it employs iron rails and special transport claws designed for heavy circuit board jig transport. 【Features】 ■ Lead-free compatible ■ Increased discharge power and reduced wave motion achieved through special development technology ■ The four-zone preheating can be individually temperature controlled ■ Iron rails and special transport claws designed for heavy circuit board jig transport ■ Full-open structure allows for easy maintenance from both the front and back *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Soldering Equipment

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Automatic soldering device 'FPD-300UD'

Automatic soldering device 'FPD-300UD'

Preheating, soldering, and solder withdrawal speed can be controlled!

The "FPD-300UD" is an automatic soldering machine that supports printed circuit boards with a maximum size of L410×W310(mm) to a minimum size of L100×W100. It is capable of mass production with three transport carriers (760 carriers in 8 hours). Additionally, it supports mixed production of different types and quantities. Please feel free to contact us when you need assistance. 【Features】 ■ Supported board size: Maximum L410×W310(mm) to minimum L100×W100 ■ Mass production with three transport carriers (760 carriers in 8 hours) ■ Control over preheating, soldering, and solder removal speeds, etc. ■ Supports mixed production of different types and quantities (individual condition settings for each of the three carriers) *For more details, please refer to the PDF document or feel free to contact us.

  • Company：VEMS
  • Price：Other
  • Soldering Equipment
  • Soldering Equipment

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Tabletop Point Jet Soldering Device 'ULTIMA-STR2'

Tabletop Point Jet Soldering Device 'ULTIMA-STR2'

Equipped with laser-type jet wave height detection function! Introducing the production equipment of VEMS Corporation.

The "ULTIMA-STR2" is a tabletop point soldering device equipped with a laser-type jet wave height detection function. It supports board sizes from 50W×50L to 250W×330L mm. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

  • Company：VEMS
  • Price：Other
  • Soldering Equipment
  • Soldering Equipment

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