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Soldering Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Soldering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 弘輝テック Saitama//Industrial Machinery
  2. アルファエレクトロニクス Saitama//Other manufacturing
  3. テクノデザイン工業 Saitama//Industrial Machinery
  4. 4 進和 戦略営業推進室 Aichi//Industrial Machinery
  5. 5 センスビー Kanagawa//Other manufacturing
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Soldering Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. List of Partial Soldering Equipment [Point Dip/Selective] アルファエレクトロニクス
  2. Selective soldering device 'SELBO-III' 弘輝テック
  3. Selective soldering device 'ULTIMA-NEO-L' 弘輝テック
  4. 4 Tabletop Selective Soldering Device 'ULTIMA-TRZ' 弘輝テック
  5. 5 Point jet soldering device 'EQSS-350SD' 弘輝テック

Soldering Equipment Product List

16～30 item / All 99 items

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Desktop Selective Soldering Series

Desktop Selective Soldering Series

The substrate size is X50×Y50mm (MIN), X330×Y250mm (MAX)! Introducing our soldering series.

We would like to introduce our tabletop selective soldering series, 'ULTIMA-TRZII/SPZII'. The board thickness ranges from 0.8 to 2.0 mm, and the nozzle is a two-fluid nozzle with an inner diameter of φ2 to 20 mm (standard specification) / air jet (optional). Please feel free to contact us when you need assistance. 【Specifications of ULTIMA-TRZII (excerpt)】 ■ Equipment dimensions: W620×D940×H442(mm) [for reference] ■ Power supply: Single-phase AC200V±5% 4kVA ■ Equipment weight: Approximately 120kg [for reference] ■ Notes: Nitrogen supply rate (reference value) 25L/min (0.4 to 0.5MPa) *For more details, please download the PDF or feel free to contact us.

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Notice of Participation in "JISSO PROTEC 2025"

Notice of Participation in "JISSO PROTEC 2025"

Held from June 4 (Wednesday) to June 6 (Friday), 2025! We plan to showcase new products at the exhibition venue.

Koki Tech Co., Ltd. will be exhibiting at the 'JISSO PROTEC 2025 (26th Assembly Process Technology Exhibition)' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of electronic component assembly technology. Advanced technologies related to electronic component assembly, which are essential for the electronics society, will be gathered in one place. We plan to showcase our all-in-one selective soldering machine model "NEO-L Smart (with IPH)" among others. We understand you are busy, but we kindly ask for your visit. 【Exhibited Equipment】 ■ All-in-one selective soldering machine model "NEO-L Smart (with IPH)" ■ Infrared and hot air circulation reflow oven "VFR-408N" ■ Desktop selective soldering machine "ULTIMA-TRZ" ■ Desktop selective spray machine "ULTIMA-SPZ" ■ Doctor Palette ■ Inline selective soldering machine "SELBO III" *For more details, please download the PDF or feel free to contact us.

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KOKI TEC ASIA Exhibition Hall

KOKI TEC ASIA Exhibition Hall

We provide equipment configurations tailored to our customers' needs based on unique ideas!

At the "KOKI TEC ASIA Exhibition Hall," you can verify soldering quality using reflow soldering, post-process soldering inspection, inline and tabletop selective soldering equipment. We offer operational training, soldering quality improvement, and maintenance (solder pot overhaul) training. Location: 5 minutes by car from BTS Udomsuk Station in Bangkok, located on Udomsuk Soi 31. 【Our Services】 ■ Manufacturing of automatic soldering equipment ■ After-sales service/training ■ Experiments (temperature profiles, soldering quality verification)/training (overhaul procedures, soldering teaching program creation procedures) *For more details, please download the PDF or feel free to contact us.

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Automatic Soldering Device Smart Dip L

Automatic Soldering Device Smart Dip L

Achieving high quality and high stability through patented technology.

The "Smart Dip L FXL-1" is a model compatible with L-sized circuit boards from the "Smart Dip Series," an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxidation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Additionally, the solder tank is made of cast iron (FC300) to enhance durability. Due to the low flow velocity of the generated waves, this method minimizes copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard automatic setup changeover using QR codes ■ Reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.

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Introduction of the IH soldering device S-WAVE.

Introduction of the IH soldering device S-WAVE.

Achieving low-cost carbon-neutral soldering!

The "S-WAVE Series" is a non-contact IH soldering device that employs a magnetic concentration and closed magnetic technology with an opening and closing mechanism. By inserting into the gap, it efficiently heats thick and thin pins, preheating the substrate with the leakage magnetic flux at the tip. After supplying solder, it heats the solder to stabilize the bonding. We deliver an automatic soldering device that realizes technology considerate of the environment, achieving speed, beauty, and low cost! 【Features】 ■ Adopts magnetic concentration and closed magnetic technology with an opening and closing mechanism ■ Capable of controlling power output at a speed of 100ms ■ Allows for optimal finishing of each point through heating adjustments ■ Achieves carbon-neutral soldering at a low cost ■ Reduces CO2 emissions during the soldering process *For more details, please refer to the PDF document or feel free to contact us.

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Lead-free compatible local soldering device TD-S102R model

Lead-free compatible local soldering device TD-S102R model

The speed can be easily adjusted with the electric slider controller!

This is a notice from Renqiu Electric Machinery Manufacturing Co., Ltd. regarding the "TD-S102R model."

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High-Temperature Soldering Device Model TD-H505-ML

High-Temperature Soldering Device Model TD-H505-ML

The quality of the product is guaranteed!

Anyone can easily perform soldering work, and newcomers can quickly transform into veteran workers.

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The IH soldering device "S-WAVE" achieves zero waste solder.

The IH soldering device "S-WAVE" achieves zero waste solder.

Zero waste solder + CO2 reduction for environmental measures!

The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, allowing for soldering in narrow areas that cannot be addressed manually. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and high-efficiency soldering even on high-density printed circuit boards. Since solder heating can be done non-contact, it achieves zero waste solder (free from solder residue on tips or in baths). This contributes to environmental issues by reducing CO2 emissions and lowering costs (a significant amount of CO2 is emitted during the recycling process of waste solder). <Features> ■ Energy-saving due to fewer consumables ■ Non-contact localized heating ■ Soldering possible from below ■ Low maintenance and low running costs ■ Rapid heating with high output even in hard-to-warm areas ■ High precision and fast soldering achievable *For more details, please refer to the PDF materials.

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IH Soldering Device S-WAVE [Improving Solder Quality and Increasing Production Volume]

IH Soldering Device S-WAVE [Improving Solder Quality and Increasing Production Volume]

"Non-contact soldering" meets high quality demands and mass production. A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.

The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It is suitable for production processes with high quality demands and is appropriate for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] link below. < Common Issues with Soldering > ◎ The running costs for adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.

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Soldering Device "Celsolder Series"

Soldering Device "Celsolder Series"

Ultra-compact design specialized for cell production!

The "Cell Soldier Series" is a super compact automatic soldering device that achieves excellent flow-up characteristics and maintainability at a low cost. Its compact design allows it to be implemented in small-scale workspaces at the office level. Despite being a small model, it can accommodate medium to large-sized PCBs (C250: width 250mm / C350: width 350mm). Additionally, the front cover open structure makes maintenance tasks easy to perform. It uses corrosion-resistant materials and employs cast iron for the tank material to reduce lead-free corrosion, while the PCB transport conveyor features resin claws to prevent solder adhesion. 【Features】 ■ Super compact ■ Easy maintenance ■ Uses corrosion-resistant materials *For more details, please refer to the catalog or feel free to contact us.

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Ultrasonic Soldering Device Solder Touchable [Labor Reduction, Prevents Corrosion]

Ultrasonic Soldering Device Solder Touchable [Labor Reduction, Prevents Corrosion]

Achieve astonishingly low prices! Soldering can be done on different materials such as glass and ceramics.

The Handatchable is a device that can solder materials such as glass and ceramics using ultrasonic waves. It is ideal for lead-out of solar cells, soldering aluminum wires, lead-out of superconductors and thermoelectric elements, and attaching electrodes to displays. <Features> - Compatible with various materials such as glass, ceramics, aluminum, and stainless steel - Eliminates the need for corrosive flux, allowing for a reduction in the number of processes and consideration for the environment - Achieves strength that is incomparable to conventional soldering As a pioneer in the manufacturing of ultrasonic soldering devices, our company offers a wide range of products. We cater to various needs, from handheld soldering irons to fully customized automated devices for mass production. For more details, please contact us or download the catalog.

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Inline laser soldering device

Inline laser soldering device

Leave your welding and joining needs to us! Soldering equipment with customizable individual process conditions.

This product is an inline laser soldering device. It significantly shortens the cycle time by welding from the underside without the need for flipping. It enables laser soldering of DIP components directly connected to the SMT assembly line. Additionally, all major mechanical dimensions and auxiliary equipment (laser, solder wire feeder, dispenser, etc.) can be customized according to your requests and work size. 【Features】 ■ Enables laser soldering of DIP components directly connected to the SMT assembly line ■ Significantly shortens cycle time through welding from the underside without the need for flipping ■ Individual process conditions can be set ■ Supports local procurement overseas ■ All major mechanical dimensions and auxiliary equipment can be customized according to your requests and work size *For more details, please refer to the PDF document or feel free to contact us.

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Space-saving inline type partial soldering device 'FUSION'

Space-saving inline type partial soldering device 'FUSION'

Low-cost inline partial soldering is possible! A device that can be configured with up to 8 stations.

"FUSION" is an inline production partial soldering device equipped with high-speed substrate transport, allowing for the selection of the number of stations and configurations according to the application. The standard 4-station setup accommodates substrates up to 381×460mm. With the optional substrate transport station, configurations of up to 8 stations are possible due to the inclusion of a return conveyor. For setups with 3 or more stations, it is more space-efficient than "SYNCHRODEX." Programs can be assigned to each station. A wide range of soldering nozzles, including micro nozzles, can be selected, and the use of an optional solder pot exchange trolley allows for easy replacement of the solder pot. 【Features】 ■ Low cost and space-saving ■ 3-axis control with DC servo mechanism with encoder ■ Maximum substrate size 746.5mm×460mm ■ Number of stations can be selected from 2 to 8 within the device *For more details, please refer to the catalog. Feel free to contact us with any inquiries. #Localized Soldering #Partial Soldering

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Best-selling batch-type soldering device 'JADE MKII'

Best-selling batch-type soldering device 'JADE MKII'

All soldering processes are completed with one machine! Interchangeable nozzles for high versatility! No pallet needed, built-in fractal. New pump adopted for improved maintenance!

Among the devices from Pillarhouse, a pioneer in selective soldering equipment, the 'JADE MKII', which boasts over 15 years of proven performance, has continuously evolved by incorporating the latest technologies. With the built-in fluxer and optional preheater, it becomes an all-in-one device. Various nozzles are available, including the Jet tip nozzle, which raises the jet height to about twice that of a standard nozzle, and micro nozzles with a minimum diameter of 1.5mm, allowing for soldering under various conditions such as components that are difficult to solder and narrow pitches. ■ Maskless ■ No need to change the circuit board from flux to soldering ■ Standard camera equipped for direct teaching *For more details, please refer to the catalog. Feel free to contact us with any inquiries. #Selective Soldering

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