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Soldering Equipment Product List and Ranking from 35 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Soldering Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 弘輝テック Saitama//Industrial Machinery
  2. アルファエレクトロニクス Saitama//Other manufacturing
  3. テクノデザイン工業 Saitama//Industrial Machinery
  4. 4 進和 戦略営業推進室 Aichi//Industrial Machinery
  5. 5 センスビー Kanagawa//Other manufacturing
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Soldering Equipment Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. List of Partial Soldering Equipment [Point Dip/Selective] アルファエレクトロニクス
  2. Selective soldering device 'SELBO-III' 弘輝テック
  3. Selective soldering device 'ULTIMA-NEO-L' 弘輝テック
  4. 4 Tabletop Selective Soldering Device 'ULTIMA-TRZ' 弘輝テック
  5. 5 Point jet soldering device 'EQSS-350SD' 弘輝テック

Soldering Equipment Product List

61～75 item / All 99 items

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Tabletop Selective Device "ULTIMA Series"

Tabletop Selective Device "ULTIMA Series"

Space-saving, cost-effective replacement of hand soldering processes and improvement in quality is possible.

The "ULTIMA series" is easy to handle and designed for tabletop use. It addresses the shortage of manual soldering workers and quality instability by replacing them with automated soldering equipment. (Method) Flux application (SPZ) → Preheating (PHS) → Soldering (TRZ) *Material handling is done by the operator. Automation of flux application from manual to automated, reduction of flux liquid volume through uniform application, quality improvement, and labor saving are possible. To accommodate increased production, adding a soldering tank (TRZ) allows for easy and cost-effective solutions. *There are many cases where one operator can handle up to the maximum soldering tank capacity (depending on the circuit board). Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency flux application under optimal conditions ■ Easy numerical management with OP digital flow display ■ Preheating device (PHS) available for reducing soldering time and effective for solder rise ■ A variety of nozzles necessary for soldering can be selected ■ Stable soldering quality, quality improvement, and labor saving are possible *For more details, please refer to the PDF materials or feel free to contact us.

  • 卓上型セレクティブスプレー装置『ULTIMAシリーズ』2.JPG
  • spray

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[Induction Heating Application Cases by Industry] Solar Cells

[Induction Heating Application Cases by Industry] Solar Cells

Improving the soldering process in solar cell manufacturing! Introducing examples of high-frequency induction heating applications in the solar cell manufacturing process.

We would like to introduce a case study on the application of induction heating in solar cell manufacturing. The original specification of AroNix's IH (Induction Heating) high-speed soldering module improves the soldering process in solar cell manufacturing. **Features of the IH (Induction Heating) High-Speed Soldering Module:** - **Speed:** Soldering of busbars and interconnectors takes 0.1 to 0.3 seconds per location, and soldering of cell electrodes takes 1 to 2 seconds per location. - **High Control:** Startup time of 5 milliseconds, high-speed automatic frequency tuning with a compact induction heating power supply. - **Clean Heating:** Non-contact direct heating using the IH (Induction Heating) method. - **Energy Saving:** Power consumption is only during heating time, with no need for continuous output. - **Universal Power Supply:** The induction heating power supply is a standard production item, ensuring short delivery times and no maintenance concerns, making it suitable for production lines. - **Flexible Adaptability:** The head weighs approximately 2.6 kg, and the cable between the head and the induction heating power supply is about 4 meters. It can also be adapted for use in automated machines with robots. *For more details, please download the PDF or feel free to contact us.*

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  • Other heating equipment

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BGA soldering equipment

BGA soldering equipment

Rework for mobile devices!!

- It has a compact design that allows for installation on a tabletop. - Since it uses partial heating, it minimizes thermal load on surrounding components that should not be heated. - It can flexibly accommodate a variety of circuit boards. - It can handle complex temperature profiles.

  • Soldering Equipment

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Automatic Soldering Device Smart Dip II

Automatic Soldering Device Smart Dip II

Realization of high quality and high stability through patented technology.

The "Smart Dip II FXM-1" is an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxide generation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow rate of the generated waves, this method minimizes the occurrence of copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Reduces daily maintenance time ■ Low oxide generation allows for reduced running costs *For more details, please feel free to contact us.

  • Soldering Equipment

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Ultra-compact all-in-one soldering device

Ultra-compact all-in-one soldering device

Supports production of 1 cell in a flow! Space-saving design that doesn't take up much room even when installed in a laboratory.

The "SSF-200-B3" is a W-wave flow soldering machine that can perform flux application, preheating, soldering, and cooling in a space-saving manner. It allows for optimal condition settings tailored to the circuit board and fine condition adjustments for prototypes. The layout can be easily changed, enabling the construction of dedicated cell lines. 【Features】 ■ Usable for multiple purposes ■ Compatible with single-piece flow cell production ■ Numerical management of solder operation conditions is possible ■ High space efficiency ■ Space-saving design that does not take up much room, making it suitable for installation in laboratories for development and prototyping *For more details, please feel free to contact us.

  • Soldering Equipment

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Automatic Soldering Device Smart Dip Return Back Type

Automatic Soldering Device Smart Dip Return Back Type

Reduce pattern erosion at low flow rates! It can also accommodate soldering of long lead PCBs.

The "Smart Dip Return Back Type FZH-4639" is an automatic soldering device that utilizes our patented technology. Thanks to the stirring mechanism (our patented technology), it enables uniform and reproducible soldering. The low flow velocity of the generated waves makes it less likely for copper erosion to occur with lead-free solder. The workpiece returns to the input port, allowing for one-man operation. The operator can remove the workpiece and prepare the next workpiece, such as inserting components, while it returns to their hands. 【Features】 ■ Low flow velocity soldering ■ Compatible with long leads ■ Supports cell production ■ Static tank + stirring soldering method ■ Minimal generation of oxides *For more details, please feel free to contact us.

  • Soldering Equipment

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Automatic Soldering Device Smart Dip II Inline

Automatic Soldering Device Smart Dip II Inline

Realization of high quality and high stability through patented technology.

The "Smart Dip II FXM-2" is an inline model of the automatic soldering device from the "Smart Dip Series," which achieves high quality and high stability. It uses a stirring mechanism (our patented technology) to generate waves, promoting heat exchange and performing soldering. This maintains the advantages of reduced oxidation in the stagnant tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow velocity of the generated waves, this method is less likely to cause copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Possible reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.

  • Soldering Equipment

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ERSA Automatic Local Jet Soldering Device

ERSA Automatic Local Jet Soldering Device

This is a selective point dip soldering device from the German company ERSA, which boasts the world's top market share.

◆Value of ERSA ERSA's automatic localized jet soldering equipment boasts the world's top market share among selective point soldering devices. ERSA believes that providing the best equipment for assembly lines is the most effective approach. Leading the world in automatic localized jet soldering technology, it maximizes production efficiency for high-value-added products that fit every requirement perfectly. ◆Technology of ERSA All models use the same solder pot and electromagnetic induction jet pump. Regardless of the model chosen, there is no change in performance or high soldering quality. With no moving parts like those found in propeller pumps, it allows for stable and precise jet control, resulting in minimal dross generation and very low maintenance frequency. The unique peel-off control rapidly drops the jet, enabling solder to be cut without bridging, even on narrow pitch patterns at the edge of the substrate. A variety of options can also be equipped.

  • Soldering Equipment
  • Other mounting machines

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Wire harness automatic soldering device

Wire harness automatic soldering device

Skillfully control flexible objects with unstable postures. Automation of difficult tasks eliminates the need for certified operators!

We would like to introduce the "Wire Harness Automated Soldering Solution" provided by our group company, Nagano Japan Radio Co., Ltd. We focus on the processing of flexible wire harnesses and the automation of soldering operations! In addition to the company's strength in wire harness processing technology, our unique robot vision technology enables high-precision positioning of difficult-to-handle wire harnesses at the targeted locations. We achieve stable quality with solder parameters suitable for the workpiece. 【Features】 ■ Technology that accurately moves the robot to the targeted position using image recognition technology ■ Technology that uses a unique robot hand to grasp flexible materials without causing damage and position them ■ Automation from wire harness processing to soldering operations ■ Full automation of the production line, including the upstream and downstream processes and transportation (customizable) ■ Long-standing track record of implementation in major machinery and parts manufacturers *For more details, please download the PDF or feel free to contact us. Inquiries will be handled directly by Nagano Japan Radio Co., Ltd.

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  • Soldering Equipment

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Lead-free compatible local soldering device EP-22LM type

Lead-free compatible local soldering device EP-22LM type

Adjustable to match the height of the parts!

This is a notice from Renq Electric Manufacturing Co., Ltd. regarding the "EP-22LM model."

  • Soldering Equipment

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High-Temperature Soldering Device TD-H551-ML-C Type

High-Temperature Soldering Device TD-H551-ML-C Type

For soldering transformers and special coils!

This is a notice from Renq Electric Manufacturing Co. regarding the "TD-H551-ML-C model."

  • Soldering Equipment

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[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

[Technical Information + Case Studies] IH Automatic Soldering Equipment that Meets High-Quality Demands

Achieving improved OEE and reduced CT in the soldering process. Minimizing upstream and downstream processes while maximizing automatic soldering time with the IH soldering device 'S-WAVE'.

The IH soldering device "S-WAVE" was born as a device that allows for soldering without the need for tool changes, enabling quick and beautiful soldering with high thermal capacity. This document introduces the improvement in production capacity arising from the above two features. It provides detailed explanations on topics such as "Changes in the soldering process flow with S-WAVE" and "Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read through it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvement in production capacity with S-WAVE = Improvement in OEE and reduction in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]

Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]

Since it heats metal non-contact, soldering is possible even with a "4mm" wall terminal! We will also introduce examples of achieving soldering on a 6-layer thick copper substrate.

The IH soldering device "S-WAVE" has a magnetic concentration head tip that remains below 100°C, while only the terminals can rise to 250°C, allowing for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have increased in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Cases" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Cases" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the advantages of the WAVE series IH soldering, making it easy to reference when considering implementation. **Advantages of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Solder

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【IH Soldering Example】Wall Terminal

【IH Soldering Example】Wall Terminal

Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!

This is an example of soldering with IH (induction heating) on the edge terminal of an automotive product. When the resin part is close to the terminal, issues often arise with the soldering iron method due to radiant heat, and with the laser method due to reflected light, which can melt the resin part. In the case of the IH method, the tip of the magnetic concentration head remains below 100°C while the terminal itself rises to 250°C. This characteristic allows for soldering without issues even when resin is nearby. [Case Summary] ■ Issues - With the soldering iron method, radiant heat is a problem, and with the laser method, reflected light can often melt the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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A 3D local heating IH soldering device that can also accommodate characteristic substrates!

A 3D local heating IH soldering device that can also accommodate characteristic substrates!

Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It can accommodate characteristic substrates such as busbars, power semiconductors, four-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards that require a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Capability to accommodate characteristic substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

  • Heating device

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