We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for glue.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

glue Product List and Ranking from 273 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 理経 Tokyo//IT/Telecommunications
  3. スリーエム ジャパン Tokyo//Other manufacturing
  4. 4 積水フーラー Tokyo//Chemical
  5. 5 ノガワケミカル Tokyo//Building materials, supplies and fixtures

glue Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Epoxy adhesive Araldite RAPID 寺田
  2. Adhesives compliant with the Food Sanitation Act for the assembly of food machinery and equipment maintenance. 日本アイケミカル 本社
  3. Comprehensive Catalog "Industrial Adhesives" ノガワケミカル
  4. 4 Solvent-free low linear expansion adhesive NICBOND NB3004 DAIZO NICHIMOLY
  5. 5 Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田

glue Product List

526~540 item / All 1144 items

Displayed results

Glue Gun "AK-812"

Easy application with air! Perfect for bonding cartons, circuit boards, and more!

The "AK-812" is a hot melt glue gun equipped with an air cylinder. It has a different structure from conventional glue guns, allowing for easy application without using force. Additionally, the temperature can be adjusted from 140 to 220°C, making it suitable for use in various work lines. Moreover, a consistent amount of glue can be applied in one shot using the rear adjustment bolt. 【Features】 ■ Ideal for bonding cartons, circuit boards, etc. ■ Equipped with an air cylinder ■ Adjustable discharge speed ■ Temperature adjustable ■ Capable of precise application *For more details, please refer to the catalog or feel free to contact us.

  • tool

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

  • plastic
  • Coating Agent
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Waterproof sealing of substrates, sensors, etc. Hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

I want to use hot melt molding, but... ▼ The equipment is too expensive to adopt. ▼ Since the products are in the range of dozens per lot, we cannot consume the materials. ▼ Due to fluctuations in production quantity, we want to create a buffer through outsourcing. ▼ I want to adopt it immediately, but... I can't wait for the equipment delivery time. We respond to such customer "troubles." Our company applies hot melt molding to parts such as circuit boards entrusted to us and returns them. - We can handle almost all types of molding hot melt materials, including polyamide-based, polyester-based, polyolefin-based, and reactive polyurethane-based. - Materials are kept in standard stock for each grade, minimizing the burden on our customers. Our factory is ISO 9001 certified and also supports encapsulation molding for automotive parts. ◆ Please feel free to contact us.

  • EMS
  • Coating Agent

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Hot Melt Molding Case Study: "LED Module Waterproof Sealing"

LED module waterproof sealing! A case of process improvement through switching from potting.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

  • Other molds
  • Coating Agent
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Hot Melt Molding Case Study: "Sealing of IC Tags"

Introducing a case where low melting viscosity hot melt was used for sealing IC tags.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. Matsumoto Processing Co., Ltd. has responded to the request to encapsulate IC tags (fine wire coils) using resin molding. [Challenges] - IC tags that are coiled into an antenna shape. - While wanting to encapsulate them with resin molding, bending of the coil leads to wire breakage, making commercialization impossible. [Effects] - A hot melt with low melting viscosity is used (1,900 m·Pa·s). - By molding at an extremely low pressure of 0.5 MPa, encapsulation was achieved without damaging the coil. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

For waterproofing and dustproofing of electrical components. Hot melt molding.

Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!

"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.

  • Processing Contract
  • Coating Agent
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Custom-made partition board

We will design according to your requests, dimensions, and the shape for storage.

Used for transportation within the project, - Oil-resistant - Washable - Capable of supporting metal parts A sturdy partition... In response to these requirements, a partition as shown on the left was created using foam resin board.

  • Processing Contract

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Suitable for sealing LED lighting, optical sensors, etc.! Colorless transparent hot melt.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

A waterproof insert molding method that directly injects thermoplastic adhesives into electronic components! We have received many inquiries and requests in the past for applications such as LED lighting fixtures, decorative lighting, and optical sensors, but conventional materials had a strong yellow tint and issues with light transmittance. This time, we are introducing a material that not only supports low-pressure molding sealing of electronic components like traditional hot melts but also excels in light transmittance. <Expected products for use> - LED lighting equipment - Display devices using LEDs, etc. - Light-based sensors such as photo sensors and fiber sensors

  • Other polymer materials
  • Other electronic parts
  • Coating Agent

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Introduction video for waterproof sealing of electrical components using hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

  • Other polymer materials
  • Coating Agent
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Halogen Free Adhesive

Compliant with the halogen-free standards IEC, IPC, and JPCA of various international organizations.

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Other electronic parts
  • Other semiconductors
  • Other optical parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

"Waterproof, dustproof" epoxy adhesive for seals IPX Level 7

This is a new type of adhesive that combines ultra-flexibility and stretchability with the reliability of epoxy resin.

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Circular Connectors
  • Rectangular Connector
  • Automotive Connectors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

"Conductive Grade" Silver Epoxy

Ideal for semiconductor die attach and interconnection between modules and substrates.

The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.

  • Other electronic parts
  • Other semiconductors
  • IC tag

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Heat Resistance Grade

It is ideal for high temperature and heat-resistant applications.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Pack-4.JPG
  • Other electronic parts
  • Other Auto Parts
  • Other motors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Super Flexible Epoxy Adhesive Premium Flexible

While maintaining the high reliability characteristic of epoxy resin, it achieves rubber-like elasticity and stretch.

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • Rectangular Connector
  • Rectangular Connector
  • Automotive Connectors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Free sample of ultra-flexible epoxy adhesive.

Growing rapidly!? Growth rate over 200%! We are giving away samples of our super flexible epoxy adhesive to 30 lucky winners! A collection of case studies you want to read before selection.

Growing rapidly!? Over 200% growth rate!? We are currently giving away samples of our super flexible epoxy adhesive to 30 lucky winners through a lottery! The NICBOND sample in this giveaway is our self-developed adhesive, a culmination of years of experience and accumulated knowledge in applied chemistry. In addition to our standard lineup products that cater to a wide range of applications, we also offer bespoke solutions tailored to meet the specific needs of our customers. We have samples available for various adhesives including conductive, insulating, halogen-free, heat-dissipating, heat-resistant, and super flexible types. These can be applied to devices requiring a wide range of functionalities such as conductive applications, heat dissipation, device assembly, motor assembly, and connector assembly. *If you would like a sample, please feel free to contact us through the inquiry form. Additionally, for those who want to read before selection! Download our free case study collection on adhesives! We highly recommend it. [Contents Included] - Optical adhesives/UV-curable adhesives - Insulating heat-dissipating adhesives - Conductive adhesives

  • E-Parts All 1.jpg
  • Other machine elements
  • Other motors
  • Other Connectors

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration