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glue Product List and Ranking from 279 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

glue Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 積水フーラー Tokyo//Chemical
  3. 理経 Tokyo//IT/Telecommunications
  4. 4 ヘンケルジャパン Kanagawa//Chemical
  5. 5 Matsumoto kakou Co.,Ltd. Shizuoka//Manufacturing and processing contract
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glue Product ranking

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

  1. Epoxy adhesive Araldite RAPID 寺田
  2. Adhesive Araldite AW106J CI/HV953U J CI 寺田
  3. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  4. 4 Neutron and mold adhesive "Corefix 9-0.5"
  5. 5 Epoxy adhesive Araldite 2014-2 (TDS and SDS available) 寺田

glue Product List

1051～1072 item / All 1072 items

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[Research Material] Global Market for Denture Adhesives

[Research Material] Global Market for Denture Adhesives

Global Market for Denture Adhesives: Direct Restoration Bonding, Indirect Restoration Bonding, Hospitals, Clinics

This research report (Global Denture Adhesives Market) investigates and analyzes the current status and outlook for the global denture adhesives market over the next five years. It includes information on the overview of the global denture adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on direct restoration bonding and indirect restoration bonding, while the segments by application target hospitals and clinics. The regional segments calculate the market size of denture adhesives by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in denture adhesives, product and business overviews, and sales performance.

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[Research Material] Global Market for Functional Hot Melt Adhesives

[Research Material] Global Market for Functional Hot Melt Adhesives

Global Market for Functional Hot Melt Adhesives: Reactive Hot Melt Adhesives, Water-Based Hot Melt Adhesives, Hot Melt Sealant Adhesives, ...

This research report (Global Functional Hot Melt Adhesives Market) investigates and analyzes the current status and outlook for the global market of functional hot melt adhesives over the next five years. It includes information on the overview of the global functional hot melt adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the functional hot melt adhesives market include reactive hot melt adhesives, water-dispersible hot melt adhesives, hot melt sealant adhesives, hot melt pressure-sensitive adhesives, and others. The segments by application cover paper packaging, bookbinding, labels and tapes, hygiene, transportation, construction, woodworking, textiles/footwear, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of functional hot melt adhesives. The report also includes the market share of major companies in functional hot melt adhesives, product and business overviews, and sales performance.

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[Research Material] Global Market for Epoxy Adhesives

[Research Material] Global Market for Epoxy Adhesives

Global Market for Epoxy Adhesives: Single-component, Two-component, Aerospace & Defense, Automotive, Marine, Electrical & Electronics, Construction, Energy & Power

This research report (Global Epoxy Adhesive Market) investigates and analyzes the current state of the global epoxy adhesive market and its outlook for the next five years. It includes information on the overview of the global epoxy adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on single-component and two-component adhesives, while the segments by application target aerospace & defense, automotive, marine, electrical & electronics, construction, and energy & power. The regional segments calculate the market size of epoxy adhesives by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the epoxy adhesive sector, product and business overviews, and sales performance.

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[Research Material] Global Market for Low VOC Adhesives

[Research Material] Global Market for Low VOC Adhesives

Global Market for Low VOC Adhesives: Polyamide Polyamine-Epichlorohydrin, Polyvinyl Alcohol, Vinyl Acetate-Ethylene Copolymer...

This research report (Global Low VOC Adhesive Market) investigates and analyzes the current status and outlook for the global low VOC adhesive market over the next five years. It includes information on the overview of the global low VOC adhesive market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the low VOC adhesive market include polyamide polyamine-epichlorohydrin, polyvinyl alcohol, vinyl acetate-ethylene copolymer emulsion, ethylene-vinyl acetate copolymer, polyurethane, and epoxy resin. The segments by application cover construction, wood, transportation, consumer, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of low VOC adhesives. The report also includes the market share of major companies in the low VOC adhesive sector, product and business overviews, and sales performance.

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[Research Document] World Market for Electronic Adhesives

[Research Document] World Market for Electronic Adhesives

World Market for Electronic Adhesives: Conductive, Thermal Conductive, UV Curing, Others, Printed Circuit Boards, Semiconductors & ICs

This research report (Global Electronic Adhesives Market) investigates and analyzes the current state of the global electronic adhesives market and its outlook for the next five years. It includes information on the overview of the global electronic adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the electronic adhesives market include conductive, thermally conductive, UV-curable, and others, while the segments by application focus on printed circuit boards and semiconductors & ICs. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of electronic adhesives. It also includes the market share of major companies in electronic adhesives, product and business overviews, and sales performance.

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[Research Material] Global Market for Marine Adhesives

[Research Material] Global Market for Marine Adhesives

Global Market for Marine Adhesives: Epoxy, Acrylic, Polyurethane, Cargo Ships, Passenger Ships, Boats, Others

This research report (Global Marine Adhesives Market) investigates and analyzes the current state and outlook for the global market of marine adhesives over the next five years. It includes information on the overview of the global marine adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the marine adhesives market focus on epoxy, acrylic, and polyurethane, while the segments by application target cargo ships, passenger ships, boats, and others. The regional segments calculate the market size of marine adhesives by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in marine adhesives, product and business overviews, and sales performance.

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[Research Material] Global Market for Adhesives for Non-Woven Fabrics in Healthcare

[Research Material] Global Market for Adhesives for Non-Woven Fabrics in Healthcare

World Market for Medical Nonwoven Adhesives: Styrenic Block Copolymers, Amorphous Polyalphaolefins, Ethylene Vinyl Acetate ...

This research report (Global Non-woven Adhesives for Medical Market) investigates and analyzes the current state and outlook for the global market of non-woven adhesives for medical applications over the next five years. It includes information on the overview of the global market for medical non-woven adhesives, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the medical non-woven adhesives market focus on styrenic block copolymers, amorphous polyalphaolefins, and ethylene vinyl acetate, while the segments by application cover hot melt and others. The regional segments calculate the market size for medical non-woven adhesives by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in medical non-woven adhesives, product and business overviews, and sales performance.

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[Market Report] Global Market for Polyurethane Adhesives

[Market Report] Global Market for Polyurethane Adhesives

The global market for polyurethane adhesives announces adhesive solutions and predicts remarkable growth.

The global polyurethane adhesive market achieved approximately $9.63 billion in revenue in 2022 and is poised to redefine adhesive solutions. With a steadfast commitment to enhancing connections and ensuring product integrity, industry experts predict that this market will reach an estimated sales figure of $16.4 billion by 2031. This anticipated transformation highlights an astonishing compound annual growth rate (CAGR) of 6.1% during the forecast period from 2023 to 2031. Polyurethane adhesives play an essential role as the unsung heroes of bonding applications across diverse industries, crucial for joining materials, enhancing structural integrity, and prolonging product lifespan. From automotive assembly and construction projects to electronics and footwear, these innovations provide reliable and durable adhesive solutions that enhance performance and efficiency. You can check the application method by clicking the [PDF Download] button or apply directly through the related links.

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[Market Report] Global Curing Agent Market

[Market Report] Global Curing Agent Market

The global hardener market is expected to reach 22 billion USD by 2031.

The global curing agent market continues to experience significant growth, with revenues reaching approximately 12 billion USD in 2022. According to recent market research, the market is expected to achieve a robust compound annual growth rate (CAGR) of 7% during the forecast period. From 2023 to 2031, it is projected to ultimately reach 22 billion USD by 2031. The global curing agent market is poised for continuous expansion in the coming years due to rapid industrialization, infrastructure development, and technological advancements. As industries aim to improve product quality, efficiency, and sustainability, the demand for high-performance curing agents is expected to remain strong, driving market growth and innovation. For application methods, please check the [PDF download] button or apply directly through the related links.

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DOWSIL SE 9184 White RTV

DOWSIL SE 9184 White RTV

UL94 V-0 certification obtained! Short tack-free time, no oven required.

"DOWSIL SE 9184 White RTV" is a thermal silicone adhesive designed to provide the necessary adhesion and thermal conductivity for cooling various electronic components. It is a one-component, room temperature curing product that is white, non-flowable, and fast-drying. Curing can also be accelerated by heating. It is a low molecular siloxane reduced product and is solvent-free. Please feel free to contact us when you need it. 【Features】 ■ One-component, room temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Non-flowable ■ Thermal conductivity ■ UL 94 V-0 (flame retardant) *For more details, please download the PDF or feel free to contact us.

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Silicone adhesive "DOWSIL SE 9185"

Silicone adhesive "DOWSIL SE 9185"

Improved reliability due to low stress after curing! Low molecular siloxane reduction product.

"DOWSIL SE 9185" is a one-component, room-temperature curing silicone adhesive. It is translucent or white, non-flowing, and fast-drying. It has high elongation, allowing for stress relief. It is a solvent-free, low molecular weight siloxane reduced product, and curing can also be accelerated by heating. Please feel free to contact us when needed. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Non-flowing ■ High elongation allowing for stress relief ■ Solvent-free ■ Low molecular weight siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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DOWSIL SE 9186 L Sealant

DOWSIL SE 9186 L Sealant

High fluidity quick-drying type suitable for insulation coating applications!

"DOWSIL SE 9186 L Sealant" is a one-component, room temperature curing silicone adhesive. It is a fast-drying product available in translucent or black, featuring high fluidity, making it suitable for insulation coating applications. It is flexible and low-stress, and is a solvent-free low molecular siloxane reduced product. Curing can also be accelerated by heating. 【Features】 ■ One-component, room temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Fluidity ■ Flexibility, low stress ■ Solvent-free ■ Low molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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DOWSIL SE 9187 L Adhesive

DOWSIL SE 9187 L Adhesive

Ideal for adhesive for display modules and conformal coating materials for PCBs!

"DOWSIL SE 9187 L Adhesive" is a one-component, room temperature curing silicone adhesive with very high fluidity. It is available in translucent, black, or white, and is fast-drying with reduced low molecular siloxane. It can also be used as a potting material for electronic devices. With low viscosity, it excels in flowability, filling properties, and self-leveling after application, and is a solvent-free type. 【Features】 ■ One-component, room temperature curing (short tack-free time, no oven required) ■ Hardening can also be accelerated by heating ■ Low viscosity (excellent flowability, filling properties, and self-leveling after application) ■ UL 94HB (black and white) ■ When applied to FR-4, the clear version achieves UL 94 V-0 *For more details, please download the PDF or feel free to contact us.

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Silicone adhesive "DOWSIL SE 9188 RTV"

Silicone adhesive "DOWSIL SE 9188 RTV"

UL94 V-0 certification obtained! Achieving quick-drying with a gray non-flowable type.

"DOWSIL SE 9188 RTV" is a one-component, room-temperature curing silicone adhesive. It is a gray, non-flowable, fast-drying low molecular siloxane reduced product. Curing can also be accelerated by heating. It is suitable for fixing components on circuit boards and within modules, as well as for reducing vibration of fixed components. Please feel free to contact us when needed. 【Features】 ■ One-component, room-temperature curing (short tack-free time, no oven required) ■ Curing can also be accelerated by heating ■ Non-flowable ■ UL94 V-0 (flame retardant) ■ Solvent-free ■ Low molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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DOWSIL(TM) 7091 Adhesive Sealant

DOWSIL(TM) 7091 Adhesive Sealant

After curing, it forms a strong and flexible rubber with excellent adhesion to many substrates!

The "DOWSIL (TM)7091 Adhesive Sealant" is a one-component, room temperature curing silicone adhesive. It is available in multiple colors (black, white, or gray) and is non-flowable. It is suitable for applications that require strength and flexibility, such as bonding materials with different thermal expansion rates, like glass to metal and glass to plastic. It cures at room temperature when exposed to moisture in the air, exhibiting stable flexibility from -40 degrees to 180 degrees. 【Features】 - One-component adhesive, non-flowable, paste-like - Alkoxy condensation curing, easy to apply - Excellent adhesion to many substrates - Stable flexibility from -40 degrees to 180 degrees - Forms a tough and flexible rubber after curing - Certified to railway standard EN 45545-2 *For more details, please download the PDF or feel free to contact us.

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DOWSIL(TM) SE 1701 LTV W/C

DOWSIL(TM) SE 1701 LTV W/C

It has fluidity and allows for filling and self-leveling! Achieves a long pot life.

"DOWSIL(TM) SE 1701 LTV W/C" is a two-component, heat-curing silicone adhesive with a mixing ratio of 10:1. It has a medium viscosity and flowability, featuring self-leveling and high tear strength. It is solvent-free, allowing for rapid curing through temperature control and various curing processes. It has a long working time and excellent workability. [Features] - Flowable, capable of filling and self-leveling - Heat curing - Long working time - Solvent-free - Rapid curing and various curing processes possible through temperature control *For more details, please download the PDF or feel free to contact us.

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DOWSIL SE 1720 CV Kit

DOWSIL SE 1720 CV Kit

Curing and adhesion occur at a relatively low temperature (80°C)! Contributes to the reduction of energy and process time.

The "DOWSIL SE 1720 CV Kit" is a two-component, white, heat-curing silicone adhesive with a mixing ratio of 1:1. It is a non-flowable type and a low molecular siloxane reduced product, ensuring sufficient working time after mixing. It is solvent-free and allows for rapid curing and various curing processes through temperature control. It also supports energy and time savings through low-temperature curing and short curing times. 【Features】 ■ Non-flowable ■ 1:1 mixing ■ Good curing properties at relatively low temperatures ■ Sufficient working time after mixing ■ Low molecular siloxane reduced product ■ Solvent-free *For more details, please download the PDF or feel free to contact us.

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Heat-curing silicone adhesive "DOWSIL(TM) SE 1750"

Heat-curing silicone adhesive "DOWSIL(TM) SE 1750"

No mixing required with a 1-component formula! It has fluidity and is capable of self-leveling and filling.

"DOWSIL(TM) SE 1750" is a white, high tensile strength, heat-curing silicone adhesive. It is solvent-free and allows for rapid curing through temperature control and various curing processes. After application, it has fluidity and is suitable for filling and self-leveling. It is a product with high tensile strength. 【Features】 ■ Fluidity ■ Heat curing ■ High tensile strength ■ Solvent-free ■ No mixing required *For more details, please download the PDF or feel free to contact us.

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Heat-conductive silicone adhesive 'DOWSIL(TM) SE 4420'

Heat-conductive silicone adhesive 'DOWSIL(TM) SE 4420'

1-component type, white moisture-curing type! Suitable for cooling electrical products including communication and power supply.

"DOWSIL(TM) SE 4420" is a moisture-curing thermal conductive silicone adhesive suitable for efficiently cooling electrical products, including communication and power supply devices. It has a thermal conductivity of 0.9 W/mK and achieves an adhesion strength of 2.7 MPa with aluminum lap shear joints. Additionally, the tack-free time is 8 minutes, and the elongation at break exceeds 75%. Please feel free to contact us if you need assistance. 【Features】 ■ Thermal conductivity: 0.9 W/mK ■ Room temperature curing: Moisture exposure ■ Adhesion strength: 2.7 MPa aluminum lap shear joint ■ Tack-free time: 8 minutes ■ Elongation at break: Exceeds 75% *For more details, please download the PDF or feel free to contact us.

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Heat-dissipating silicone adhesive "DOWSIL(TM) SE 4490 CV"

Heat-dissipating silicone adhesive "DOWSIL(TM) SE 4490 CV"

Non-flowable low molecular siloxane reduction product! Dissipates heat from electronic components to improve reliability.

"DOWSIL(TM) SE 4490 CV" is a one-component, white, room-temperature curing thermal silicone adhesive. It has good thermal conductivity and is suitable for cooling automotive control modules, power supplies, and display driver ICs. Designed for efficient thermal conductivity, it is a low molecular weight siloxane reduced product. Please feel free to contact us if you need assistance. 【Features】 ■ Non-flowable ■ Good thermal conductivity ■ Low molecular weight siloxane reduced product ■ Dissipates heat from electronic components to improve reliability *For more details, please download the PDF or feel free to contact us.

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Silicone adhesive "DOWSIL (TM)SE 9152 HT"

Silicone adhesive "DOWSIL (TM)SE 9152 HT"

Suitable for use in extreme high-temperature applications! Achieves heat resistance against continuous exposure to 275°C.

"DOWSIL(TM) SE 9152 HT" is a one-component, reddish-brown, low-viscosity silicone adhesive that cures at room temperature. It is self-leveling and fast-drying, and it is a low-molecular siloxane reduced product, exhibiting excellent thermal stability. It is solvent-free and can be accelerated by heating. It has good flowability, filling properties, and self-leveling characteristics after application. 【Features】 - One-component, room temperature curing (short tack-free time, no oven required) - Curing can also be accelerated by heating - Low viscosity (good flowability, filling properties, and self-leveling characteristics after application) - Solvent-free - Low-molecular siloxane reduced product *For more details, please download the PDF or feel free to contact us.

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