Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process.
On printed circuit boards. A Pd coating with excellent corrosion resistance is formed, providing outstanding corrosion resistance.
The 'Electrolytic Ni/Electrolytic Au Plating Alternative Plating Process' forms a dense and corrosion-resistant Pd film between the electrolytic Ni plating and the electrolytic Au plating, resulting in excellent corrosion resistance. The solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. For more details, please contact us or download the catalog.
- Company:三協 本社工場
- Price:Other