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process Product List and Ranking from 45 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

process Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  2. クロスライトソフトウェアインク日本支社 Chiba//software
  3. ネツレン　高周波熱錬株式会社 Tokyo//Machine elements and parts
  4. 4 柿原工業 Hiroshima//Automobiles and Transportation Equipment
  5. 5 アイ'エムセップ 研究開発部 Kyoto//Electronic Components and Semiconductors
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process Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Semiconductor Process & Device Simulator "NovaTCAD" クロスライトソフトウェアインク日本支社
  2. Electroless copper plating process for glass substrates for TGV surface treatment 奥野製薬工業 大阪・放出、東京、名古屋など
  3. Mild carburizing process ネツレン　高周波熱錬株式会社
  4. 4 Plating on Polyimide (PI) Film: Top SAPINA Process 奥野製薬工業 大阪・放出、東京、名古屋など
  5. 4 Dry plating process "Chrome PVD" 柿原工業

process Product List

106～120 item / All 131 items

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Metallizing Arc Thermal Spray Process

Metallizing Arc Thermal Spray Process

Can be sprayed on any substrate! The thermal spray coating is porous and has good oil retention, especially demonstrating excellent wear resistance.

Introducing the thermal spraying process "Metalizing Arc." The wire-like materials used for thermal spraying are formulated from metals and alloys specifically for this purpose, allowing for spraying on any metal regardless of the substrate material. Since thermal spraying is typically performed at low temperatures around 100°C, it does not impart thermal effects on the substrate, preventing distortion or degradation. 【Features】 ■ Can be sprayed on any metal ■ Can be sprayed on any substrate ■ Does not cause thermal effects or distortion to the substrate ■ The sprayed coating is resistant to wear *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Thermal spray process "Thermospray"

Thermal spray process "Thermospray"

Prevention of oxidation in Ni-Cr alloys! Applicable in uses where both wear resistance and corrosion resistance are desired, as well as in severe sliding surfaces.

Introducing the thermal spray process "Thermo Spray." It enables thermal spraying of materials that cannot be wired, such as ceramic and tungsten carbide-based cermets. By re-melting the sprayed coating with an oxygen-acetylene (or propane) flame, an alloy layer is formed at the interface between the base metal and the sprayed coating, eliminating pores between the sprayed particles. 【Features】 ■ Enables thermal spraying of materials that cannot be wired ■ Thermal spraying of self-fusing alloys ■ Prevents oxidation of Ni-Cr alloys ■ Lowers the melting point of Ni-Cr alloys, allowing melting at approximately 1000°C to 1100°C *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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High Velocity Oxy-Fuel (HVOF) Thermal Spray Process

High Velocity Oxy-Fuel (HVOF) Thermal Spray Process

You can obtain a coating with a dense and high adhesion! It will be finished with excellent surface roughness through mirror polishing processing.

Introducing the thermal spraying process "High Velocity Oxygen Fuel (HVOF)." Compared to conventional plasma spraying, it can form coatings with higher hardness and excellent wear resistance. The accelerated spraying material undergoes minimal oxidation or compositional changes, allowing for the formation of high-quality coatings with high density and low porosity (below 0.5%). 【Features】 ■ High hardness ■ Coatings with high adhesion strength can be obtained ■ Easier to achieve ultra-mirror finishes ■ Low porosity coatings are formed *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Biopharmaceuticals: Innovative Manufacturing Processes

Biopharmaceuticals: Innovative Manufacturing Processes

Achieve high purity, high yield, and high efficiency processing with a single-use chromatography device. It also contributes to cost reduction.

We would like to introduce solutions for bioprocesses using Sorbentam's chromatography devices. As products that help simplify processes in biopharmaceutical manufacturing, we offer "3M(TM) Harvest RC," which allows for cell removal and clarification in one step, as well as "3M(TM) Polisher ST," which enables stable virus removal under a wide range of conditions. These are designed for compact installation and are easy to handle with single-use specifications. Scaling up from lab to production grade can also be done easily. 【Features of "3M(TM) Harvest RC"】 ■ Minimizes cell disruption ■ Eliminates the need for centrifugation and depth filtration ■ Efficiently removes soluble and insoluble impurities ■ High antibody recovery rate ▽ Here is the homepage for 3M(TM) Harvest RC https://www.3mcompany.jp/3M/ja_JP/bioprocessing-jp/products-solutions/harvest/ * You can view the product catalog by selecting "PDF Download." Please feel free to contact us with any inquiries.

  • Other physicochemical equipment

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The process of cutting.

The process of cutting.

Forming a scribeline that serves as a trigger! Introducing the process of cutting.

I would like to introduce the process of "scoring." After forming the scribe line that triggers the scoring, cracks are propagated along the scribe line to create pieces, and tape is expanded to prevent contact between adjacent pieces. Please feel free to contact us when you need assistance. 【Process】 1. Scribing process 2. Breaking process 3. Expanding *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract

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Process Co., Ltd.

Process Co., Ltd.

Screen printing and pad printing

Corporate PR (Sales Points, Highlighted Technologies, etc.) The heat-resistant masking seal and tape division sources materials for surface treatment masking from manufacturers worldwide, and particularly ships masking tapes and seals for electrodeposition coating, powder coating, melamine coating, plastic coating, blasting, plating, thermal spraying, etc., quickly. The heat-resistant masking seal and tape division possesses numerous unique products and technologies, providing them widely to the manufacturing industry. We process and sell to approximately 2,000 companies across Japan. In the screen printing division, we print on all types of materials, from long-length prints to precision parts. Utilizing years of expertise in screen printing and pad printing, we handle the printing of parts for various companies.

  • others

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Development of SAW device technology and material processes, high frequency and high performance, applications.

Development of SAW device technology and material processes, high frequency and high performance, applications.

Basics, elastic surface waves, electrode formation, smartphone, SAW filter, medical sensors, touch panel sensors.

Elastic surface wave devices are being increasingly applied and diversified due to the high-frequency and narrow-band requirements of communication devices such as mobile phones and portable terminals. In recent years, there has also been progress in the application of touch panels and the development of various sensors. This lecture will organize and study the fundamental technologies to serve as a foundation for future application developments. The history of SAW devices, a discussion on the development to commercialization of SAW devices handled by the instructor, and the future technological trends of SAW devices will be covered. If time permits, the reasons for SAW devices that did not reach commercialization will also be discussed.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar

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Prototyping Development Process

Prototyping Development Process

Development without the use of specialized tools or molds is also possible! Proposals for processes that can solve your problems.

We would like to introduce our "Prototype Development Process." We assist from the confirmation of requirements related to the speed-up and slow-down mechanisms, such as increase/decrease ratios, mounting space, and sound volume, to design, manufacturing, assembly, and operational evaluation. Additionally, we provide data to mass production companies regarding processing methods and precision management values for each process. 【Development Process】 1. Proposal of processes that can achieve what is difficult with conventional methods 2. Design 3. Manufacturing 4. Assembly 5. Data provision for mass production *For more details, please refer to the related links or feel free to contact us.

  • Gearbox
  • Prototype Services

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Introduction Consideration Process "Smart Fitting"

Introduction Consideration Process "Smart Fitting"

Three-step introduction consideration process! A shortcut to problem-solving that can be proposed by KTC.

"Smart Fitting" is a solution implementation consideration process that can only be realized by our company, which knows the field thoroughly as a tool manufacturer. We visit the work site to observe the workflow and tasks. We conduct investigations and confirmations from various angles, organizing issues and countermeasures aimed at problem-solving, improving productivity, and implementing work traceability. We consider suitable work tools, points for improving work procedures, and operational policies for work traceability, and after evaluating risks and costs, we formulate a plan for smooth implementation. [Process] STEP 01. Site Confirmation and Recommendations STEP 02. Fitting STEP 03. Economic Evaluation and Implementation Plan *For more details, please refer to the related links or feel free to contact us.

  • Embedded system design service
  • Other contract services

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Semiconductor fabless business process

Semiconductor fabless business process

Providing and supporting the construction of semiconductor business processes through a fabless model! It is possible to strengthen your own development process!

Due to significant advancements in horizontal division of labor, there has been an increase in cases where set manufacturers (BtoC) directly control design houses and manufacturing contractors (FAB) for semiconductor development, manufacturing, and quality production management without going through semiconductor manufacturers or turnkey companies. In response to such demands, our company provides consulting services to support the establishment of semiconductor business processes based on a fabless model. 【Features】 ■ Composed with "stable mass production (= securing stable profits)" as the final output ■ Quick setup is possible by introducing our unique set of tools ■ We can introduce multiple partner companies for design houses, manufacturing contractors (wafer, package, test), and other related companies *For more details, please request materials or view the PDF data available for download.

  • Other contract services

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If you are considering requesting video production, here is the process you should know until delivery.

If you are considering requesting video production, here is the process you should know until delivery.

Explaining the process of video production! An introduction to the preparations before making a request and the general flow of video production.

When outsourcing video production, it's important to know what information to prepare before making a request, as well as the process for delivery after the request is made. Since video production is custom-made, there are various steps involved before delivery. By understanding the necessary flow of video production, you can ensure smooth communication with the production company when outsourcing, and it is crucial to prepare thoroughly in order to create a video that meets your objectives. This article will introduce what you should know when requesting video production from a production company, including preparations before making a request and the general flow of video production. *For detailed content of the column, please refer to the related links. For more information, feel free to contact us.*

  • Other services

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Innovative manufacturing process brought by the micro-joint automatic removal device.

Innovative manufacturing process brought by the micro-joint automatic removal device.

An automatic micro-joint removal device that opens up future production technologies. An innovative manufacturing solution that achieves efficiency improvements, cost reduction, and quality enhancement!

In recent years, improving efficiency and ensuring quality have become important in the production technology of steel furniture and office furniture. The "Micro Joint Automatic Removal Device" can automatically remove micro joints that occur during the sheet metal and pressing processes, making it an effective manufacturing tool, especially for companies that excel in mass production. Traditionally, the removal of micro joints was done manually, but with the introduction of the automatic removal device, these tasks are now performed by machines. As a result, the work that was previously done by one or two people a day has been fully automated, significantly reducing labor hours. Furthermore, the variation in quality due to the skill level of workers has been eliminated, leading to a more uniform product quality. Companies that have adopted this technology have expressed positive feedback, stating, "Removing micro joints is tough, but if it can be automated, we are grateful." By automatically handling critical processes such as deburring and polishing, both productivity improvements and a reduction in employee labor burden are being achieved simultaneously, establishing a new standard in the manufacturing industry. *For more details, please refer to the PDF document or feel free to contact us.*

  • Other industrial robots
  • joint

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Materials and Processes for Advanced Semiconductor Packaging 2024-2034

Materials and Processes for Advanced Semiconductor Packaging 2024-2034

Significant advancements in semiconductor packaging.

This research report provides a detailed investigation and analysis of advanced semiconductor packaging technologies, development trends, major applications, and the ecosystem. [Contents] Advanced Semiconductor Packaging: Correlation with Performance Evaluation, Manufacturing Processes, and Materials 3D Die Stacking using Cu-Cu Hybrid Bonding Technology Report details https://www.dri.co.jp/auto/report/idt/230628-materials-and-processing.html

  • Other semiconductors

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[Research Material] The Global Market for Carbon Fiber Recycling

[Research Material] The Global Market for Carbon Fiber Recycling

Global Market for Carbon Fiber Recycling: Chemical Processes, Physical Processes, Aerospace, Sporting Goods, Automotive, Industrial, and Others

This research report (Global Carbon Fiber Recycling Market) investigates and analyzes the current state and outlook for the global carbon fiber recycling market over the next five years. It includes information on the overview of the global carbon fiber recycling market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the carbon fiber recycling market focus on chemical processes and physical processes, while the segments by application cover aerospace, sporting goods, automotive, industrial, and others. The regional segments calculate the market size for carbon fiber recycling by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in carbon fiber recycling, product and business overviews, and sales performance.

  • Other services

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Super Micron-Level Sensor Assembly Process

Super Micron-Level Sensor Assembly Process

We conduct assembly of magnetic sensors and sensitivity tests! Let us introduce our assembly process.

Our company understands the complexities involved in products that require intricate assembly and possesses the expertise necessary to maintain high quality. By supporting the research and development team with structural design and various specifications, we achieve early market entry and strengthen competitiveness for our products. Our ultra-micron-level sensor assembly process includes multi-coil soldering, stacking, and nesting technologies. 【Features】 ■ Assembly of multiple coils, magnetic sensors at various angles and forms ■ Multi-coil soldering ■ Stacking ■ Nesting technology *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors

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