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process Product List and Ranking from 78 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

process Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  2. Daiwa Fine Chemicals Co., Ltd. Hyogo//Other manufacturing
  3. ネツレン 高周波熱錬株式会社 Tokyo//Machine elements and parts
  4. 4 null/null
  5. 4 昭栄産業 Ishikawa//Service Industry

process Product ranking

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. Mild carburizing process ネツレン 高周波熱錬株式会社
  2. Non-cyan silver plating process Dain Silver GPE process Daiwa Fine Chemicals Co., Ltd.
  3. Electroless copper plating process for glass substrates for TGV surface treatment 奥野製薬工業 大阪・放出、東京、名古屋など
  4. 4 Aluminum casting and aluminum die casting dyeing: Top ADD process 奥野製薬工業 大阪・放出、東京、名古屋など
  5. 4 Kogakuin University, a school corporation

process Product List

121~135 item / All 137 items

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Materials and Processes for Advanced Semiconductor Packaging 2024-2034

Significant advancements in semiconductor packaging.

This research report provides a detailed investigation and analysis of advanced semiconductor packaging technologies, development trends, major applications, and the ecosystem. [Contents] Advanced Semiconductor Packaging: Correlation with Performance Evaluation, Manufacturing Processes, and Materials 3D Die Stacking using Cu-Cu Hybrid Bonding Technology Report details https://www.dri.co.jp/auto/report/idt/230628-materials-and-processing.html

  • Other semiconductors

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[Research Material] The Global Market for Carbon Fiber Recycling

Global Market for Carbon Fiber Recycling: Chemical Processes, Physical Processes, Aerospace, Sporting Goods, Automotive, Industrial, and Others

This research report (Global Carbon Fiber Recycling Market) investigates and analyzes the current state and outlook for the global carbon fiber recycling market over the next five years. It includes information on the overview of the global carbon fiber recycling market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the carbon fiber recycling market focus on chemical processes and physical processes, while the segments by application cover aerospace, sporting goods, automotive, industrial, and others. The regional segments calculate the market size for carbon fiber recycling by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in carbon fiber recycling, product and business overviews, and sales performance.

  • Other services

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Super Micron-Level Sensor Assembly Process

We conduct assembly of magnetic sensors and sensitivity tests! Let us introduce our assembly process.

Our company understands the complexities involved in products that require intricate assembly and possesses the expertise necessary to maintain high quality. By supporting the research and development team with structural design and various specifications, we achieve early market entry and strengthen competitiveness for our products. Our ultra-micron-level sensor assembly process includes multi-coil soldering, stacking, and nesting technologies. 【Features】 ■ Assembly of multiple coils, magnetic sensors at various angles and forms ■ Multi-coil soldering ■ Stacking ■ Nesting technology *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors

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Ozone-based resist stripping process "SicOzone Strip"

Ozone water for resist stripping! Significant reduction of water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

The peeling of ozone resist has been researched and developed for over 20 years, but the challenge of using ozone, which easily decomposes and diffuses, in the process is high, and the currently practical methods require dedicated ozone process equipment. At Siconnex, we enable the ozone resist peeling process using our unique BATCHSPRAY technology, allowing it to be performed with the same equipment used for other wet processes such as etching and cleaning. This means that multiple processes can be carried out with a single machine, providing a space-saving and process-integrated solution. 【Features】 - Resist peeling is possible with only ozone and water. - No special specifications are required since it is not high-concentration ozone water. - Integration with other wet processes such as etching allows multiple processing steps to be performed without moving the wafers. - Reduces running costs by not using chemicals other than ozone. - Lowers waste disposal costs due to the easy decomposition of ozone. - Can be enhanced with the addition of inorganic chemicals if removal becomes difficult due to resist alteration. - Installation area is less than 2m². - Chambers for 25 or 50 wafers are available. *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Ozone Wafer Cleaning Process "SicOzone CLEAN"

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

Our semi-automatic device stands out for its high performance, efficient chemical recirculation, minimal installation area, and optimized space efficiency. 【Features】 - Reduces chemical costs by using ozone instead of hydrogen peroxide for conventional RCA cleaning. - No special specifications are required as it does not use high-concentration ozone water. - Integrates with other wet processes such as etching and resist stripping, allowing multiple processing steps to be carried out without moving the wafers. - Ozone decomposes easily, reducing waste disposal costs. - Installation area of less than 2m². - Capable of using chambers for 25 or 50 wafers. *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment

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Issues on-site with compact chlorine reactors and safe chlorination processes.

Suppressing leaks during operation! The design point is a fail-safe operation prepared for emergencies.

We will introduce the issues faced on-site regarding small chlorine furnaces (compatible with Cl2/HCl) and explain why the chlorination process can be operated safely. It is possible to remove trace impurities in oxides/metals as volatile chlorides, enabling de-metalization and de-oxygenation through halogen cleaning, as well as surface cleaning. Additionally, our unique design includes corrosion-resistant structures that suppress material degradation even at high temperatures with Cl2/HCl, ensuring safety and reproducibility. 【Common Issues】 ■ Wet acid treatment has heavy waste liquid disposal and energy costs, and we want to replace it with dry methods. ■ Since the product is water-sensitive, we want to remove metal contaminants without wetting it. ■ We want to selectively remove only metal impurities in a dry atmosphere. ■ We want to scale up from CI2 tests in tubular furnaces more safely. *For more details, please download the PDF or feel free to contact us.

  • Industrial Furnace

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DK Cryo Process <Significantly Reduced Exchange Frequency>

Suppressing dimensional changes within a tolerance range of ±0.01mm! Flexibility that does not depend on processing timing.

The "DK Cryo Process" enables high-precision dimensional control with a tolerance range of ±0.01mm. It addresses concerns such as "the frequency of replacing expensive tools and mold components is too high, putting pressure on costs and labor on-site." We will guide you to solve that issue without replacing tools or molds. 【Features】 ■ Compatible with parts that have been tempered, are in use, or are coated ■ Significant extension of lifespan ■ High-precision dimensional support *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Other contract services

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Improving resin adhesion to the shibo surface! Thin film surface treatment nano process.

A ultra-thin film coating process with excellent precision, visible light transmittance, and release properties!

The "Nano Process TC-10S" enables ultra-thin functional coatings of less than 100μm, achieving precision, visible light transmittance, and release properties. It can maintain optical characteristics with minimal dimensional changes, making it possible to process "precision parts" and in fields that require high dimensional and surface accuracy, where fluororesin coatings have been difficult until now. <Application Examples> - Sealing and water-repellent treatment for electronic devices and components - Water-repellent treatment for optical lenses - Oil diffusion prevention for bearing components - Oil sludge prevention for sealing components, etc. <Features of Each Series> ■ TLS Series Excellent non-stick properties against adhesive materials like tape ■ NCFPC Series Excellent liquid repellency for water and oil ■ HP Series Excellent hydrophilicity Currently, we are offering technical materials summarizing the details of each series. If you are interested in more details or are facing challenges with surface treatment in precision fields, please download the materials or contact us directly.

  • Other semiconductors

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Semiconductor Process & Device Simulator "NovaTCAD"

Crosslight's TCAD, which integrates 2D/3D process simulators and device simulators. Free trial available!

<Main Features> ■ General-purpose 2D/3D finite element analysis and design software for semiconductor devices "APSYS" ■ "CSUPREM," a version of SUPREM developed by Stanford University, uniquely enhanced by Crosslight ■ Mask editing tool (GDSII compatible) ■ Input and editing tool for device cross-sectional structures ■ Graphical display of simulation results <Diverse Physical Models and Functions for Device Simulation> ■ Current-voltage (I-V) characteristics ■ Two-dimensional distribution of potential, electric field, and current ■ Two-dimensional distribution of hot carrier temperature in fluid dynamics models ■ Two-dimensional distribution of lattice temperature used in thermal transport models ■ Band diagrams under various bias conditions ■ Results of AC small-signal response analysis at arbitrary frequency ranges ■ Subbands of quantum wells using a heavy-hole mixing model ■ Two-dimensional distribution of impurity occupancy and density trapped at deep levels in semiconductors ■ Two-dimensional optical field distribution of optical devices such as photodetectors ■ Current dependence of the self-emission spectrum of LEDs ■ For other features and details, please download the catalog or contact us. ■ To apply for a trial version, please use the "Trial Version Application Form."

  • simulator

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ODU Technology Testing Process

Measurement, testing, understanding, management. The highest class of quality produced by a comprehensive testing system.

Let me introduce you to the ODU testing process. "Functionality," "reliability," "quality," and "safety" are key concepts in connectors and their systems. Achieving these requires a deep understanding of fundamental physical phenomena. Additionally, it is crucial to continuously confirm and verify the mechanical and electrical properties of products through various certification tests in the development and design process, as well as thorough quality control in the manufacturing process. ODU's in-house Technical Testing Center (T2C) is responsible for both the verification of standard values according to applications and the development and application of various testing methods. This dual function of the T2C establishes a knowledge base that is essential for further technological development of connectors and connector systems. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Circular Connectors
  • Other Connectors
  • Contract manufacturing

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Process of Introducing Biomass Boilers

From business plan formulation and basic design to construction and handover! A detailed explanation of the implementation process.

We would like to introduce our "Process for Introducing Biomass Boilers." There are many processes involved from the time a customer considers the introduction of a biomass boiler until its actual implementation. Particularly, the design phase requires careful attention as it involves know-how that differs from fossil fuels. If you consult with us from the conceptual stage, we will take full responsibility for the process, from business plan formulation and basic design to construction and handover. 【Details of the Introduction Process】 ■STEP 1: Conceptual Stage ■STEP 2: Basic Design and Business Plan Formulation ■STEP 3: Construction and Handover ■STEP 4: Operation *For more details, please refer to the PDF document or feel free to contact us.

  • Boiler

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Marketing-related glossary "AISAS"

Introducing the customer purchasing process, including attention, interest, search, action, and information sharing!

AISAS refers to a model that represents the customer purchasing process, consisting of the initials of "Attention," "Interest," "Search," "Action," and "Share." It describes the steps where a customer pays attention to a product or service, develops interest, searches for information, ultimately takes action (such as making a purchase), and then shares information afterward. *For detailed information on the glossary, please refer to the related links. Feel free to contact us for more details.*

  • others

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Summary of the "5" Steps of Marketing in MMP

If there is a discrepancy in the marketing strategy, it is difficult to achieve remarkable results!

In this article, we explain marketing theories and concepts not as isolated elements but as a continuous flow, referred to as a "line." Essentially, there are five steps in total, and this series of marketing processes is called "MMP (Marketing Management Process)." We hope this serves as a helpful hint for implementing marketing in an appropriate flow after grasping the basic terminology. [Contents (Excerpt)] ■ What is MMP (Marketing Management Process)? - Research (Market Research and Analysis) = Marketing Research - STP Analysis (Segmentation/Targeting/Positioning) - MM (Marketing Mix) - Implementation - Control (Evaluation and Feedback) *For more detailed information, please refer to the related links. *For further details, please check the PDF materials or feel free to contact us.

  • others

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Initial Examination Process for Formulation Development 'ASD-HIPROS'

Initial examination process of formulation for amorphous solids and dispersions using spray-drying technology.

"ASD-HIPROS" is an initial evaluation service using spray-drying technology for poorly soluble drugs. It is designed to assess the feasibility of spray-drying and reduce formulation choices based on performance and stability comparisons. This maximizes the opportunity to identify successful formulations. Please feel free to contact us if you have any inquiries. 【Deliverables】 ■ Evaluation: Clarification and assessment of formulation compositions ■ Ranking: Ranking of process analysis results and SD prototypes ■ Formulation Composition: Identification of suitable and promising formulation compositions *For more details, please download the PDF or feel free to contact us.

  • Other contract services

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Overview of the Data Analysis Process! A Thorough Explanation of the Mechanism

An explanation of what the data analysis process entails from multiple perspectives in a column!

With the development of an information-oriented society, the tools for connecting to the internet have diversified. As a result, companies have begun to handle a vast amount of various information. To find useful information for business from such big data, some companies are utilizing data analysis. When conducting data analysis, it is important to understand the process involved. Therefore, let's explain what the data analysis process entails from multiple perspectives. *For more detailed content of the column, please refer to the related links. For further inquiries, feel free to contact us.*

  • SFA/Sales Support System

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