resin Product List and Ranking from 453 Manufacturers, Suppliers and Companies

Water-washable partition (aluminum frame) hard polyurethane

You can splash water on it and wash it thoroughly! Made of PP, it can also be wiped and used when dirt or moisture adheres to it.

We would like to introduce a washable partition made of rigid urethane (aluminum frame). As a measure against virus droplets, it can be washed with water. The surface is made of resin board, and the frame is made of aluminum. The size is 750mm x 1800mm x 24mm (maximum size), and the partition color is milky white. For heights exceeding 1800mm and other colors, separate consultations are available. 【Features】 ■ Made of rigid polyurethane, lightweight ■ Made of PP, can be wiped clean when dirt or moisture adheres ■ Can be kept clean by wiping with a disinfectant spray ■ Partition color is milky white *For more details, please refer to the PDF document or feel free to contact us.

Company：多田プラスチック工業
Price：Other

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High-strength wear-resistant polyurethane resin 'P-821'

Polyurethane resin suitable for large mold making of automotive parts and various prototype cast products.

"P-821" is a high-strength, wear-resistant urethane resin with significantly improved durability. It has excellent wear resistance. Additionally, it does not contain solvents, making it environmentally friendly. 【Product Overview】 ■ Color of the cured material: Yellow-brown ■ Features: Tough and wear-resistant *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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High transparency non-yellowing type urethane resin 'PROCRYSTAL 385'

High transparency non-yellowing type polyurethane resin with thixotropic properties.

"PROCRYSTAL 385" is a high transparency, non-yellowing type of urethane resin that does not contain solvents, making it environmentally friendly. It provides excellent transparency in the cured urethane material. Please feel free to contact us if you have any inquiries. 【Product Overview】 ■ Color of the cured material: Transparent ■ Features: Hardness is at a level where pressing with a nail leaves a mark *For more details, please download the PDF or feel free to contact us.

Company：テムコファイン
Price：Other

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Biomass resin compatible with the reduction of 12 items of disposable plastic.

Response to the 12 items to be reduced based on the Plastic Resource Circulation Promotion Act, corn-derived biomass-based resin materials.

The biomass material developed in-house by VASU Corporation (a Hong Kong capital enterprise) is a resin material derived from biomass (corn starch) for which it holds a patent. Yashima Denso is a technical trading company that serves as the official domestic agent for VASU, providing support from resin materials to mass production delivery of molds and molded products. *Mold design and quality are supported by dedicated technical staff. In Japan, much of the biomass resin is often used for flexible packaging and bottles, and there are challenges such as coloring, odor, and strength in biomass resins for injection molding. VASU's materials offer grades suitable for injection molding, featuring excellent moldability, coloring performance, strength, cost, and reduced CO2 emissions during combustion based on actual measurements. Among the 12 targeted items, some samples are available for provision: Forks, spoons, straws, hairbrushes, toothbrushes, hangers, knives, stirrers, combs, razors, shower caps, clothing covers. ☆Environmental Standards RoHS, REACH, FDA, DIN EN 13432 (biodegradable), compliance with Ministry of Health, Labour and Welfare Notification No. 370, JORA Biomass Mark The above items have been addressed or are planned to be addressed.

Company：八洲電装本社
Price：Other

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High thermal conductivity epoxy resin TE-7163 (2Wm/k)

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

TE-7163 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, low viscosity Applications: Heat dissipation insulation sealing for electronic devices such as industrial motors, coils, transformers, and capacitors ■Mixing viscosity: 25℃ 12,500 / 60℃ 2,000 (mPa·s) ■Thermal conductivity: 2.0 (W/mK) ■Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from the bottom or feel free to contact us.

Company：寺田
Price：Other

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High thermal conductivity epoxy resin TE-7127 (4 W/m·K)

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

TE-7127 Two-component heating curing epoxy resin Features: High thermal conductivity, short curing time, environmentally friendly (non-lead, non-halogen), low thermal expansion The linear expansion coefficient is low at 14, making it less prone to cracking. Applications: Used in general electronic components where both insulation and high thermal conductivity are required, such as casting agents, sealing materials, and surface protectants. ■ Mixing viscosity: 60℃ 15,000 (mPa·s) ■ Thermal conductivity: 4.0 (W/mK) ■ Flame retardancy: Equivalent to V-0 ■ Recommended curing conditions: 120℃ x 1h + 150℃ x 1h *For more details, please download the PDF from below or feel free to contact us.

Company：寺田
Price：Other

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General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

Company：寺田
Price：Other

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General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

Company：寺田
Price：Other

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UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

Company：寺田
Price：Other

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Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

Company：寺田
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Inspection jigs and model epoxy resin Teradite

These are epoxy resin products that can be used for inspection jigs and models. They include gel coats, backing, casting, laminating, workable resins, release agents, and more.

This is a list of our company's brand epoxy resin "Teradite" for two-component mixed epoxy resin used for tooling. It is usually in stock, so you can purchase it in small quantities. *Contents of the document* ■ For vacuum, pressure, and RIM molding surface gel coat ■ For heat-resistant laminating and heat-resistant backing ■ For general casting for pattern models and jigs ■ For gel coat for precision inspection jigs ■ For sand backing and laminating (available for summer and winter) ■ Workable resin for master models ■ Release agent (MO-7) For more details, please check the "PDF Download" at the bottom.

Company：寺田
Price：Other

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High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

Company：寺田
Price：Other

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Araldite Urethane System 22BF (22B derivative)

Huntsman manufactured potting polyurethane resin. Based on low hardness and elasticity of 22B, it features low viscosity and reduced curing time. In stock at our company. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 22BF features a low viscosity and shortened curing time based on the elasticity and low hardness of 22B. For more details, please check the property table below or contact us. Main agent: Polyol 3018BF Curing agent: Isocyanate 2023

Company：寺田
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Araldite Urethane System 66B (Low Hardness)

Huntsman manufactured polyurethane resin for potting. It has a Shore A hardness of 30, which is very low hardness. In stock at our company. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 66B is characterized by its elasticity and low hardness. For details, please check the property table below or contact us. Main agent: Polyol 3618B Hardener: Isocyanate 2023

Company：寺田
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Araldite Urethane System 3002SB/2056 (Medium Hardness)

Huntsman manufactured polyurethane resin for potting. It is a well-balanced product in terms of usable time, curing time, hardness, and elongation. TDS and SDS are available for distribution.

This is a potting and casting polyurethane resin from the global chemical manufacturer HUNTSMAN. 3002SB/2056 is characterized by its balanced performance. For details, please check the properties table below or contact us. Main agent: Polyol 3022SB Hardener: Isocyanate 2056

Company：寺田
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[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

Company：寺田
Price：Other

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

Company：寺田
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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

Company：寺田
Price：Other

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

Company：寺田
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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

Company：寺田
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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

Company：寺田
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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-5014K4

One-component × high strength × high thixotropy! An epoxy resin suitable for structural bonding. With a Tg of 130°C and a shear adhesive strength of 24 MPa, it is a highly reliable structural adhesive.

The "TE-5014K4" is a one-component, heat-curing epoxy resin developed for applications that require prevention of liquid dripping. It is easy to handle as no mixing is required. This product exhibits a shear adhesive strength of 24 MPa (SUS/SUS, 25°C). It shows a Shore D hardness of 85 and a volume resistivity of 1×10^15 Ω·cm or higher, designed to combine strength and insulation properties. The curing conditions are simple at 120°C for 2 hours, making it suitable for mass production processes. 【Features】 ■ One-component heat-curing epoxy resin ■ High heat resistance with Tg of 130°C ■ High strength adhesion (shear adhesive strength of 24 MPa) ■ High thixotropy for good workability ■ High hardness (Shore D 85), high insulation (volume resistivity > 1×10^15 Ω·cm) *For more details, the product's characteristic table is available, and you can download the PDF from below or contact us. *Samples are also available, so please contact us if needed.

Company：寺田
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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

Company：寺田
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TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

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High Thermal Conductivity Epoxy Resin TE-7900 for Semiconductors

Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.

In the semiconductor industry, effective heat dissipation measures are essential due to the increasing density and performance of devices. The rise in heat generation can lead to performance degradation and a shorter lifespan of devices, making it necessary to efficiently dissipate heat. TE-7900 enhances the heat dissipation of semiconductor devices due to its high thermal conductivity, contributing to improved reliability. 【Usage Scenarios】 - Heat dissipation insulation sealing for CPUs, GPUs, power semiconductors, etc. - Heat dissipation for high-power LEDs - Potting for various electronic components 【Benefits of Implementation】 - Suppression of device temperature rise - Extension of product lifespan - Assurance of high reliability

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High Thermal Conductivity Epoxy Resin TE-7900 for Automotive Applications

Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.

In the automotive industry, as the miniaturization and high performance of electronic devices progress, heat dissipation measures have become an important issue. In particular, electronic components such as Engine Control Units (ECUs) and power semiconductors require reliability under high-temperature conditions. TE-7900 achieves both high thermal conductivity and low viscosity, addressing these challenges. This enhances the heat dissipation of electronic components and contributes to the longevity and performance maintenance of products. 【Application Scenarios】 - ECU (Engine Control Unit) - Power Semiconductors - Onboard Motors 【Benefits of Implementation】 - Improved heat dissipation of electronic components - Enhanced product reliability - Extended product lifespan - Support for miniaturization and high performance

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Single-component heat-curing epoxy resin for home appliances TE-7901K

One-liquid type × high thermal conductivity! Contributes to improving the durability of home appliances.

In the home appliance industry, long-term reliability and safety of products are required. Particularly for appliances exposed to temperature changes and vibrations, the protection of internal components and heat dissipation measures are crucial factors that influence the durability of the product. Inadequate heat dissipation can lead to component failure or performance degradation, potentially shortening the product's lifespan. The TE-7901K achieves a balance of high thermal conductivity and insulation, contributing to the durability of home appliances. 【Application Scenarios】 - Motors - Power devices - Coils 【Benefits of Implementation】 - Extended product lifespan due to improved heat dissipation - Enhanced safety through flame retardancy equivalent to UL94 V-0 - Improved workability due to one-component formulation

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[For Robots] TE-7901K

One-liquid type × high thermal conductivity! Heat-dissipating insulating epoxy resin that supports the precise movements of robots.

In the robotics industry, the reliability of electronic components is crucial for high-precision operation and longevity. In particular, temperature management of components that generate heat, such as motors and sensors, is a key factor that influences the performance of robots. Deterioration of components due to heat can lead to malfunctions and failures, potentially reducing the overall operational rate of the robot. The TE-7901K achieves a balance of high thermal conductivity and excellent insulation, protecting the electronic components inside the robot from heat. [Usage Scenarios] - Motors of precision robots - Heat dissipation measures for sensors - Insulation sealing for high-density mounted circuit boards [Effects of Implementation] - Extended lifespan of components - Stable operation of robots - Reduction in maintenance costs

Company：寺田
Price：Other

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TE-7814V for semiconductor packaging

Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

Company：寺田
Price：Other

Other polymer materials
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TE-7814V for Robot Precision Equipment

Improving the reliability of robotic precision equipment with high thermal conductivity and high Tg.

In the robot precision equipment industry, high operational accuracy and long lifespan are required. In particular, precise electronic components face the risk of performance degradation and failure due to heat generation. The TE-7814V addresses these issues with its high thermal conductivity, enhancing the reliability of the equipment. 【Application Scenarios】 - Electronic circuit boards for precision robots - Sensor modules - Actuators 【Benefits of Implementation】 - Suppression of malfunction due to thermal runaway - Extension of equipment lifespan - Achievement of stable operation

Company：寺田
Price：Other

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