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substrate×アイン 本社工場 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Substrate "Copper Base Wiring Board with Posts"

Substrate "Copper Base Wiring Board with Posts"

Direct heat conduction to the base material!

The "Copper Base Wiring Board with Posts" is a thermally excellent heat dissipation substrate that forms posts on a copper base and connects directly to the surface pattern. It can also be multilayered and is used for high-density mounting substrates for LEDs. 【Features】 ■ High thermal conductivity ■ Short delivery time available ■ Special specifications can be discussed *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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DPC substrate

DPC substrate

High heat resistance and high strength! Ceramic wiring board using DPC plating method.

The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Functional Product Tree Diagram

Functional Product Tree Diagram

Introducing products by function such as high frequency, high thermal conductivity, and dimensional stability in a tree diagram!

This document introduces the products of Ain Co., Ltd., which engages in the design, manufacturing, and sales of printed circuit boards, categorized by function. It features various types of multilayer circuit boards (resin, metal, ceramics), including thick film printed circuit boards and inner layer thick copper circuit boards (with busbars). We respond to diverse needs such as high frequency, high thermal conductivity, and dimensional stability. 【Contents】 ■ High Frequency ■ High Thermal Conductivity ■ Dimensional Stability (Low Expansion) ■ High Heat Resistance ■ High Current *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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[JPCA Exhibition] We will propose wiring boards tailored to your needs!

[JPCA Exhibition] We will propose wiring boards tailored to your needs!

We will showcase various achievements at the exhibition. We will propose wiring boards that meet our customers' requirements using suitable materials and structures!

Ain Corporation will exhibit at the "JPCA Show 2023" held at Tokyo Big Sight. We plan to showcase our "DPC substrate," which is a wiring board formed by plating using ceramics as the base material, and the "AMB substrate," a thick copper ceramic substrate that excels in insulation, heat dissipation, and reliability. We will propose wiring boards that meet our customers' requirements with suitable materials and structures. 【Various Wiring Boards】 ■ Thermal Management: Ceramics, Metal ■ High Current: Ceramics, Metal ■ High Frequency: Resin ■ General Purpose: Resin We sincerely look forward to your visit. 【Event Overview】 ■ Dates: May 31 (Wed) - June 2 (Fri), 2023, 10:00 AM - 5:00 PM (tentative) ■ Venue: Tokyo Big Sight, East Exhibition Hall ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Exhibition Zone/Booth Number: Printed Circuit Board Technology Exhibition/6F-11 ■ Admission Fee: 1,000 yen (tax included) *Free for web registrants *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Ain Corporation "Business Introduction"

Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

  • Other electronic parts

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Metal base wiring board

Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts

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Printed Circuit Board Assembly

Printed Circuit Board Assembly

We accept orders regardless of quantity! Comprehensive support from design to implementation of printed circuit boards!

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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AMB substrate

AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board

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Thick copper wiring board

Thick copper wiring board

A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

Heat countermeasures, from proposal and design of metal-based special substrates to implementation, all in one go. Introducing our track record of adoption!

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

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  • Circuit board design and manufacturing

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Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Compatible with various materials including fluororesin circuit boards, alumina, and high dielectric ceramics.

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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  • Circuit board design and manufacturing

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Metal core printed circuit board

Metal core printed circuit board

We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!

The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Design and manufacturing of high-frequency substrates capable of heat management.

Design and manufacturing of high-frequency substrates capable of heat management.

For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Circuit board design and manufacturing

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*Technical materials are being presented! Gain knowledge! 'AMB PCB Design Rules'*

*Technical materials are being presented! Gain knowledge! 'AMB PCB Design Rules'*

Essential for acquiring knowledge in substrate design! Clearly presented with diagrams and tables, including ceramic types and thickness, product flatness (warpage), and pattern dimension accuracy!

This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Notice of participation in the "JPCA Show 2024"

Notice of participation in the "JPCA Show 2024"

We will exhibit at a trade show that contributes to the development of the entire electronic circuit industry and related industries!

Ain Co., Ltd. will exhibit at the 'JPCA Show 2024' held at Tokyo Big Sight. This exhibition will showcase electronic circuits and mounting technologies used in various electronic, information communication, and control devices, as well as new content and solutions. We plan to display our thick copper ceramic substrate "AMB substrate" for power devices and our ceramic wiring substrate "DPC substrate" using a plating method. We sincerely look forward to your visit. 【Exhibition Information】 ■ Dates: June 12 (Wed) to June 14 (Fri), 2024, from 10:00 AM to 5:00 PM (tentative) ■ Venue: Tokyo Big Sight, East Exhibition Hall ■ Booth Number: 6G-02 ■ Exhibition Zone: Printed Circuit Board Technology Exhibition ■ Address: 3-10-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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