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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

991～1020 item / All 1904 items

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SMAP Series Mirror Polishing Machine

SMAP Series Mirror Polishing Machine

Numerous achievements in simplifying polishing work with various materials. A device that allows anyone to easily perform artisan polishing.

The "SMAP" is a mirror shot machine developed with the aim of performing complex three-dimensional irregular shape mirror finishing and micro-burr removal in fine processing, which have been traditionally required needs. The abrasive media of the projected material is completely different from conventional ones; it consists of fine abrasive grains layered around a core material that has elasticity and stickiness, and can be reused through regeneration, contributing to cost reduction. 【Features】 ■ No post-cleaning required due to dry polishing ■ No jigs needed, allowing for immediate polishing ■ Large amounts of polishing material can be ejected from the nozzle, drastically reducing polishing time ■ Minimal shape change of the workpiece due to elastic polishing material, enabling uniform polishing ■ Thin workpieces can be processed without thermal changes *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Processing Contract
  • substrate

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Mirror Polishing Machine "SMAP-IV Type"

Mirror Polishing Machine "SMAP-IV Type"

Shortening processing time with overwhelming projection power! Capable of handling large workpieces that other models cannot.

The "SMAP-IV type" is a mirror shot machine designed for large workpieces. Compared to the "SMAP-II type," the working space and projection volume are more than four times greater. It can handle large workpieces that other models cannot. Please feel free to contact us when you need assistance. 【Specifications (excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air inlet/usage: Φ6 150L/min (0.6MPa) ■ Body dimensions (excluding side door): W1200×H1900×D1125 (mm) ■ Weight: 270kg ■ Power: Main motor 2.2kW, elevator motor 60W, dust collector 0.4kW ■ Media usage: 12L *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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Mirror Polishing Machine "SMAP-W Type"

Mirror Polishing Machine "SMAP-W Type"

Successfully developed a movable nozzle that leverages the characteristics of SMAP media! It accommodates polishing for sizes that cannot be held by hand.

The "SMAP-W Type" is a mirror shot machine designed for heavy workpieces. By combining it with a rotating platform on casters, it is possible to polish while also moving the workpiece. We have successfully developed a movable nozzle that takes advantage of the characteristics of SMAP media. Please feel free to contact us when you need assistance. 【Specifications (Excerpt)】 ■ Input power supply: Three-phase 200V 50/60Hz 15A ■ Air outlet/usage: Φ6 10L/min (0.6MPa) ■ Main body dimensions (excluding side door): W1060×H1850×D990 (mm) ■ Weight: 280kg ■ Power: Main motor 2.2kW, elevator motor 60W (conveyor motor) ■ Media usage: 15L *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • substrate

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Orientation CNT substrate

Orientation CNT substrate

Vertically oriented CNTs are produced by depositing a catalyst on a heat-resistant substrate such as metal or ceramics and heating the substrate to 650-800°C in a carbon source CVD gas.

We offer samples of vertically aligned CNT substrates (for a fee) and can also prototype samples that grow vertically aligned CNTs on your desired substrate. We can grow on various three-dimensional shapes, not just flat substrates, but also meshes, fibers, and more. Additionally, we respond to various requests such as selective growth of CNTs on mask patterns and the fabrication of honeycomb CNT films.

  • Other polymer materials
  • substrate

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AlN slice substrate

AlN slice substrate

Various types of metallization are possible! Introducing AlN substrates with unique firing and processing technologies.

We would like to introduce the "AlN Slice Substrate" handled by Furukawa Electric. It has high electrical insulation properties and supports various metallizations. It has a thermal expansion coefficient that matches silicon, making it resistant to thermal shock and capable of withstanding rapid heating and cooling. 【Features】 ■ High thermal conductivity and emissivity, providing excellent heat dissipation ■ Thermal expansion coefficient that matches silicon ■ Resistant to thermal shock and capable of withstanding rapid heating and cooling ■ High electrical insulation properties ■ Supports various metallizations *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

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厚銅基板　大電流基板

厚銅基板　大電流基板

大電流への対応を可能とした厚銅基板

一般的なプリント基板の回路厚が35μmであるのに対し、2000μmまでの厚銅による回路を実現することにより、大電流への対応を可能とした厚銅基板です。 通常のエッチング工程による回路形成の場合、回路断面は“台型”をしていますが、弊社の大電流基板は“そろばん型”をしているのを特徴としており、 設計値に対してトップ寸法と断面積をより広く確保できます。

  • Printed Circuit Board
  • substrate

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Printed circuit board, metal substrate

Printed circuit board, metal substrate

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

  • Printed Circuit Board
  • substrate

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EL light-emitting display technology

EL light-emitting display technology

EL light-emitting display technology

【Features】 This is a light-emitting display substrate directly formed with inorganic EL elements (Electro Luminescence) on a substrate. The thickness of the display section is formed to be less than 0.1mm, achieving an ultra-thin design by making the printed circuit board thinner. While the brightness is not particularly high, it allows for soft lighting information in dark places. It can convey various messages without disrupting the mood in places like movie theaters and bars. 【Applications】 ● Blinking animations ● Mood clocks ● Dot matrix displays ● 7-segment displays 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

  • Printed Circuit Board
  • substrate

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Glass substrate

Glass substrate

Glass substrate

【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓

  • Printed Circuit Board
  • substrate

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3D metal substrate, flexible heat dissipation substrate

3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board
  • substrate

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Insulated substrate

Insulated substrate

This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.

Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.

  • Printed Circuit Board
  • substrate

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Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"

A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!

The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Special Printed Wiring Board "Mirror Cavity Substrate"

Special Printed Wiring Board "Mirror Cavity Substrate"

We will solve all the problems related to the decrease in reflectivity due to aging degradation and countermeasures against sulfide!

The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Special Printed Wiring Board "Iron Base Substrate"

Special Printed Wiring Board "Iron Base Substrate"

Low thermal expansion iron-based substrates can be manufactured! We support everything from quick-turn prototypes to mass production.

The "iron-based substrate" is an optimal substrate for preventing solder cracks in ceramic packages and other applications due to its low thermal expansion. Iron-based substrates with low thermal expansion can be manufactured. The metal part features an 8μ high thermal conductivity resin coating on both sides, significantly improving voltage resistance and rust prevention. We can accommodate everything from short lead-time prototypes to mass production, so please feel free to contact us. 【Features】 ■ Iron-based substrates with low thermal expansion can be manufactured ■ Insulation layer: Thermal conductivity 2W/mk ■ Base metal: Iron PCM (pre-coated metal) adopted ■ Ideal for preventing solder cracks in ceramic packages and other applications ■ Support from short lead-time prototypes to mass production *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

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Flat Cable Checker "KE8001"

Flat Cable Checker "KE8001"

Simple Cable Checker: A checker specialized for testing crimp-type flat cables. *Focused only on necessary functions to achieve a low price.

A cable checker that simplifies inspections such as checking the connections of pressure-welded cables and harnesses. We keep the price down by narrowing down the compatible connectors. It is intended for use as a simple harness checker. Existing harness checkers are multifunctional but expensive, and many responsible individuals may find it troublesome to purchase due to unnecessary connectors or functions. In such cases, this harness checker allows for efficient checks with only the minimum necessary functions. *The types of connectors can be changed according to your preferences, so please feel free to contact us. *This product is not RoHS compliant.

  • サブ写真.JPG
  • cable
  • Testing Equipment and Devices
  • Image Processing Equipment
  • substrate

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Introduction of high-performance FPC made in China

Introduction of high-performance FPC made in China

Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.

Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝

  • Other semiconductors
  • substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP01/02

Printed circuit board (for DIY amplifiers, etc.) T-AMP01/02

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a little gain is lacking" or "wanting to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these demands. ○ Four types of lineup according to application: ・T-AMP01/T-AMP01B Typical amplifier circuit board using a single OPAMP stage. ・T-AMP02/T-AMP02B Typical amplifier circuit board using a two-stage OPAMP. ○ Custom-made options are also available.

  • Printed Circuit Board
  • substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP03/04/05

Printed circuit board (for DIY amplifiers, etc.) T-AMP03/04/05

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a bit more gain is needed" or "want to convert impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Three types of lineup according to application: [T-AMP03] Amplifier circuit board with output buffer for output current enhancement. [T-AMP04] OPAMP single-stage amplifier circuit, dual-channel board. [T-AMP05] Amplifier circuit board with input buffer for increased input resistance and reduced noise. ○ Board dimensions: 74×43×1.6mm ○ Mounting holes: φ3.4×6 ○ Mounting hole pitch: 54×33mm ○ Custom-made options are also available.

  • Printed Circuit Board
  • substrate

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Printed circuit board (for DIY amplifiers, etc.) T-AMP08/T-AMP-PS

Printed circuit board (for DIY amplifiers, etc.) T-AMP08/T-AMP-PS

This is a convenient printed circuit board! (Can be used for DIY amplifiers, etc.)

○ Ideal for situations such as "a little gain is lacking" or "I want to change the impedance due to equipment constraints" in the production of measurement and control devices and systems. High-performance operational amplifiers that meet these requirements. ○ Two types available according to application: [T-AMP08] 12dB or 18dB/OCT LPF or HPF board [T-AMP-PS] Power supply board ○ Board dimensions: 90 (or 74) × 43 × 1.6 mm Mounting holes: Φ3.2 × 6 Mounting hole pitch: 54 × 33 mm, etc. ○ Custom-made options are also available.

  • Printed Circuit Board
  • substrate

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Would you like to start in-house production of implementation jigs?

Would you like to start in-house production of implementation jigs?

Easily, quickly, and at low cost, anyone can create implementation jigs! Strongly supports reducing manufacturing costs and shortening delivery times.

"Meister" is a manufacturing system for assembly jigs that strongly supports the reduction of lead times and costs in the jig creation process. By collaborating with "MeisterCAM," it enables in-house production of high-precision jigs with easy operation. It achieves in-house production of jig manufacturing, which is required for high precision, ease of operation, and applicability in production sites, while reducing assembly costs. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ In-house production of assembly jigs and parts ■ Abundant processing materials ■ High safety and clean environment ■ Quick creation of processing data *For more details, please refer to the PDF materials or feel free to contact us.

  • Assembly Jig
  • Processing Jig
  • Other mounting machines
  • substrate

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Component Mounting Data Creation Support System 'PC-MountCAM'

Component Mounting Data Creation Support System 'PC-MountCAM'

Subscription plan has also started! Available with support for the latest version for 3 months or 1 year.

★We have launched a subscription plan! With support included, you can use the latest version for 3 months or 1 year. You can reduce initial costs, and managing the increase or decrease of licenses is also easy. 'PC-MountCAM' is a system that streamlines component mounting operations. By inputting CAD information (Gerber data, component placement coordinates, bill of materials) output in various formats, information can be quickly disseminated to mounters, manual assembly, inspection processes, and more. In particular, it can significantly shorten the setup man-hours for component mounting drawings and specifications. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Examples of features included】 ■ Conversion of mounting data and bill of materials ■ Creation of mounting quick reference tables ■ Creation of mounting drawings ■ Component mounting guides ■ Creation of mounting data ■ Support for component inspection *For more details, please refer to the PDF materials or feel free to contact us.

  • Other CAM related software
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  • substrate

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"Total support for setup work at the implementation site" PC-MountCAM

"Total support for setup work at the implementation site" PC-MountCAM

Achieving a dramatic improvement in work efficiency! Introduction of a component mounting data creation support system.

"PC-MountCAM" is a component mounting data creation support system that provides total support for setup tasks at the assembly site. It is a new concept platform centered around component mounting data, achieving significant reductions in setup time, suitable work support for on-site workers, and digitization of data, leading to remarkable improvements in work efficiency. Work instructions for each process directed at on-site workers can be created in a short time, and the created work instructions can be displayed on tablets or monitors using a dedicated viewer. Additionally, we will be exhibiting at the 38th "Internepcon Japan Electronics Manufacturing and Assembly Exhibition" held at Tokyo Big Sight. We sincerely look forward to your visit. 【Features】 ■ Board image display function ■ Mounting data and Bill of Materials (BOM) conversion function ■ Assembly drawing creation function ■ Component expert library *For more details, please refer to the PDF materials or feel free to contact us.

  • Other production management systems
  • substrate

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Bidirectional isolation converter board

Bidirectional isolation converter board

It is a rack-mountable size with an built-in isolation transformer.

The bidirectional insulated converter board is designed to accommodate rack mounting and includes an integrated isolation transformer. Additionally, various customizations in shape and other specifications are possible. We can support everything from circuit and mechanical design of power electronics products to component design, such as copper bars, and the final completion of the product. For more details, please download the catalog.

  • converter
  • substrate

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Foresight Various Glass Substrates

Foresight Various Glass Substrates

We have a variety of glass available.

We accommodate various sizes and processing methods such as cutting, rounding, single-sided polishing, double-sided polishing, drilling, film formation, chemical etching, and frosting, according to your requests.

  • Touch Panel
  • substrate

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Electrode substrate for FPD (Flat Panel Display)

Electrode substrate for FPD (Flat Panel Display)

High-precision pattern processing of various metal films.

■High-precision pattern processing of various metal films such as ITO, Cr, Al, Ti, Mo, Ni, Ag, etc. ■Pattern processing on color filters. ■Processing up to insulating films and ribs. →Please contact us if you are considering mass production. We will provide detailed materials and information.

  • Other processing machines
  • substrate

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Foresight Inc. FPC Product Catalog

Foresight Inc. FPC Product Catalog

A wide range of FPC products available!

This catalog features FPC products from a company that develops businesses related to components and materials for FPD, as well as equipment-related businesses. It includes a wide range of products such as "single-sided FPC," which is ideal for applications like the drive units of inkjet printers and RFID antennas, as well as "double-sided FPC" and "multi-layer (MULTI)" options. [Contents] ■Flexible Printed Circuit Board ■Basic Specifications *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • substrate

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FPC "Multi-layer (MULTI)"

FPC "Multi-layer (MULTI)"

It's perfect for Mobile Connector and more!

This product is a multi-layer Multi specification FPC suitable for recent trends in high density, high functionality, and lightweight design. We offer two types in our lineup: "4 Layer" and "5 Layer," tailored to various applications. Additionally, our company provides high-quality and cost-effective components and materials required for electronic displays, including LCDs, OLEDs, and touch panels, both domestically and internationally, including automotive applications. Please feel free to contact us for inquiries. 【Features】 ■ Supports high density, high functionality, and lightweight design ■ Multi-layer Multi specification *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • substrate

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FPC『RIGID FPCB』

FPC『RIGID FPCB』

FPC with a structure that has both Rigid and Flexible properties!

"RIGID FPCB" is a type of FPC that combines the characteristics of Rigid (hard) and Flexible (soft), making it easy to implement SMD (Surface Mount Device) components. It is suitable for applications requiring high connection reliability between circuit boards. Additionally, we offer two types of lineups to suit different applications. Please feel free to contact us. 【Features】 ■ Combines Rigid (hard) and Flexible (soft) characteristics ■ Ideal for inter-board connection applications *For more details, please contact us or download the catalog.

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  • Electronic Components
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Window substrate for laser optics

Window substrate for laser optics

Laser quality window substrate

We supply high-performance windows for high-power lasers. Substrate material: UV-grade fused silica, BK7 Effective diameter: 85% of the center Surface accuracy: Scratch dig: 10-5 Surface flatness: λ/10 @ 633nm within effective diameter Diameter tolerance: +0.00/0.25mm Thickness tolerance: ±0.25mm Bevel: <0.5mm @ 45° representative value Wedge: less than 5 minutes standard parallel plane, parallel plane less than 10 seconds, wedge plane 30±5 minutes These windows are polished on both sides and are applied in high-power lasers. AR (anti-reflective) coating can be applied on both sides or one side. They are used in plate beam splitters, dichroic filters, and partial reflectors.

  • Laser marker
  • substrate

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