substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

High current substrate

With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!

The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.

Company：大陽工業プリント回路カンパニー
Price：Other

Printed Circuit Board

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Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

Company：大陽工業プリント回路カンパニー
Price：Other

Printed Circuit Board

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High-precision, high-heat-dissipation device substrate / ultra-thin glass cloth multilayer substrate

The cup angle and bottom size can be freely selected! After implementation, the height of the board can be kept low.

This product is a "high-precision device substrate" that allows for a low profile of the board after mounting by installing an IC in the seat groove. It is designed for LED light reflectors, and the cup angle and bottom surface size can be freely selected. In addition, we also offer "high heat dissipation device substrates" and "ultra-thin glass cloth multilayer substrates." 【Features】 <High-Precision Device Substrate> ■ Enables a low profile of the board after mounting ■ Cup angle and bottom surface size can be freely selected <High Heat Dissipation Device Substrate> ■ Combines various heat dissipation technologies to meet advanced requirements ■ Copper pillars do not damage through-hole plating as they are not press-fitted *For more details, please refer to the PDF materials or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board

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Heat-dissipating substrate "Thick Copper Special Substrate"

A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.

We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Other electronic parts

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High Heat Dissipation Substrate "High Precision Heat Dissipation Via"

We meet advanced requirements through the combination of high-precision machining and high heat dissipation structures!

Our company handles the heat dissipation substrate "High Precision Heat Dissipation Via." The applicable substrate methods include general through-hole TH, BVH, IVH, and build-up methods. The finishing plating options include electroless NiAu, bonding NiAu, and other impedance control solutions. By combining high-precision machining with a high heat dissipation structure, we meet advanced requirements. 【Features】 ■ Applicable substrate methods: Compatible with general through-hole TH, BVH, IVH, and build-up methods ■ Finishing plating: Electroless NiAu, bonding NiAu 　　　　　　　　Other impedance control compatible ■ Resin dam structure compatible with both high and low standards *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Circuit board design and manufacturing

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Heat dissipation substrate "Heat dissipation Via"

Multilayering of thick copper substrates is also possible! We can handle filling of blind vias and vacuum filling in-house.

Our company handles the heat dissipation substrate "Heat Dissipation Via." With the increasing heat generation due to the high performance and miniaturization of electronic components, there is a growing need for heat dissipation pathways that allow the heat generated by components to escape from the space to the pattern, in order to maintain the performance of electronic devices and extend their lifespan. We propose solutions to these issues as heat dissipation measures. It is also possible to create multilayer thick copper substrates, allowing for the development of new applications that have not been seen before. 【Features】 ■ Thick copper substrate with copper foil thickness of 210μm ■ Copper paste VIA hole filling (thermal conductivity 0.58–7.8W/mk) - Small diameter VIA φ 0.15 is supported, - Bottom-filled VIA hole filling can also be handled in-house with vacuum filling. *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board

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Special processing for substrates used in high-precision devices.

Special processing such as ZAGRI processing, laser processing, and high-precision processing for pattern alignment is possible!

Our company handles special processing of "high-precision substrates for high-precision devices." The accuracy of the counterbore processing is ±20μm, the high-precision outer diameter processing by laser is ±10μm, and the high-precision processing for pattern alignment is ±50μm. By installing ICs in the counterbore section, it is possible to keep the height of the substrate low after mounting. 【High-Precision Processing】 ■ Counterbore processing accuracy: ±20μm ■ High-precision outer diameter processing by laser: ±10μm ■ High-precision processing for pattern alignment: ±50μm *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board
Other electronic parts
converter

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Metal base substrate

A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.

A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.

Company：モリマーエスエスピー本社
Price：Other

High frequency/microwave parts

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Stretchable circuit board

Follows uneven surfaces and curves! A circuit board that serves as electrodes for various sensors and maintains conductivity even when stretched.

The "stretchable circuit board" conforms to uneven surfaces and curves, maintaining conductivity even during stretching. It allows for circuit formation on any material depending on the application, while ensuring elasticity. As a stretchable pressure sensor, it can be utilized in various applications such as monitoring beds and shoe insoles, and it does not break even under load. Additionally, the stretchable biosensor detects weak biological signals using Ag/AgCl electrodes. 【Features】 ■ Conforms to uneven surfaces and curves ■ Maintains conductivity during stretching ■ Supports various batch sizes ■ Can serve as electrodes for various sensors ■ Does not break under load *For more details, please refer to the PDF materials or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board

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High-frequency compatible substrate

Hybrid structure of PTFE material and general-purpose materials achieves both performance and cost! Introduction of composite material substrates.

When focusing on cost and availability, FR4 becomes a material with significant losses at high frequencies, while PTFE, which has issues with cost, is highlighted when considering high-frequency characteristics. Additionally, the reality is that high-frequency material substrates are often difficult to obtain, and it is not easy to find manufacturers that can accommodate small-scale prototypes. The "composite material substrate" uses PTFE material for the layers that form high-frequency circuits. General circuits and power circuits are constructed with FR-4 or high Tg materials, providing multilayer substrates that are compatible with high frequencies while keeping total costs down. 【Composite Material Substrate Features】 ■ PTFE + General-purpose materials ■ PTFE material is used for the layers that form high-frequency circuits ■ General circuits and power circuits are constructed with FR-4 or high Tg materials ■ Multilayer substrates compatible with high frequencies that keep total costs down *For more details, please refer to the PDF document or feel free to contact us.

Company：モリマーエスエスピー本社
Price：Other

Printed Circuit Board

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Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]

The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! This contributes to lower costs and shorter delivery times. Please feel free to consult with us.

Our company handles heat sinks (base plates). Thanks to precision progressive dies, the dimensional accuracy of the outer shape and hole pitch has greatly improved, resulting in significantly enhanced finish quality on both the edge and shear surfaces. The coil material can be continuously processed up to a thickness of 5mm due to the adoption of progressive dies, contributing to lower costs and shorter delivery times. We utilize UV printing. In addition to micron-level flatness and specified warp processing, we also support resist baked printing. 【Features】 ■ High dimensional accuracy of the outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil material up to a thickness of 5mm through the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

Company：三昌製作所
Price：Other

Processing Contract

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Aluminum foil etching processing and circuit board

It is possible to reduce costs compared to copper foil etched circuit boards.

We will form circuits using composite materials such as aluminum foil and PET film through etching processing. Our unique aluminum foil etching method enables the formation of precise circuits for applications such as aluminum heater products, antennas, or sensors using aluminum foil.

Company：ヒートラボ
Price：Other

aluminum
Sensors
Aluminum heater

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High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

Company：HNS
Price：Other

others
Printed Circuit Board

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Printed circuit board "Silicone-based substrate (Silicone)"

Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!

The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.

Company：HNS
Price：Other

others
Printed Circuit Board

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Analog Sensor Board "TypeWEST"

You can create an analog sensor board that is resistant to damage from the start bar sensor!

The "TypeWEST" is an analog sensor board equipped with 2 analog sensors, 5 digital sensors, and 1 start bar detector. It features a structure that is resistant to damage for the start bar sensor, and also includes a ceramic capacitor for noise countermeasures. 【Specifications】 ■ Distance between analog sensors: 42mm ■ Reinforced fixation for Φ3mm infrared LED for digital sensors ■ Power supply voltage: 5.0V ■ Weight: approximately 10g *For more details, please download the PDF or contact us.

Company：ロボテナ
Price：Other

Printed Circuit Board

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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

substrate Manufacturer, Suppliers and Company Rankings

substrate Product ranking