Build-up multilayer printed circuit board
In-house complete VIA plating line! Introduction of build-up multilayer printed circuit boards.
We would like to introduce the "Build-Up Multilayer Printed Circuit Boards" handled by our technology research institute. We offer a lineup of "1+4+1 Structure Build-Up Multilayer Printed Circuit Boards" that allows for pad on VIA, and "2+4+2 Structure Build-Up Multilayer Printed Circuit Boards" that can also accommodate stacked VIA specifications. Our company is equipped with an in-house VIA plating line, allowing us to handle even small quantities. 【Features of 1+4+1 Structure Build-Up Multilayer Printed Circuit Boards】 ■ Direct laser processing ■ VIA plating processing (without resin filling process) ■ Pad on VIA is also possible *For more details, please refer to the PDF document or feel free to contact us.
- Company:ちの技研
- Price:Other