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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

451～465 item / All 673 items

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Flexible circuit board

Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

In the era of IoT, we propose the use of copper inlay substrates and metal-based substrates for heat dissipation solutions, as well as ultra-thin substrates to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related issues with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the heat generation of components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate specific shapes. 【Products Offered】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for double-sided boards to be affixed with heat dissipation sheets. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be shaped by bending. - The use of flexible resins and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

  • Printed Circuit Board

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Retrofit ▶ Electronic Circuit Board

Retrofit ▶ Electronic Circuit Board

We will analyze and investigate the old circuit diagrams or device operations of devices and circuit boards that have become difficult to manufacture due to the discontinuation of parts, and we will redesign and manufacture them.

Our company will renew devices and circuit boards that can no longer be updated due to reasons such as "past design and manufacturing, or the person in charge has left," or because the subcontractor we previously commissioned for development has gone out of business. As a feature of electronic circuit board retrofitting, we also produce software to be embedded in the circuit boards. Additionally, we have a track record of using various devices and development environments. 【Features】 ■ Analyze and investigate old circuit diagrams or device operations, then redesign and manufacture ■ Renew devices and circuit boards that can no longer be updated ■ Produce software to be embedded in the circuit boards ■ Track record of using various devices and development environments *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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5G Electronic Materials PTFE FPC Fluororesin Substrate

5G Electronic Materials PTFE FPC Fluororesin Substrate

Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.

We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.

  • Other electronic parts

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Integrated drive control board for stepping motors.

Integrated drive control board for stepping motors.

It can be mounted on a motor and used as an integrated unit! It is a control board with a built-in microcontroller.

We handle the "Integrated Drive Control Board for Stepping Motors." This product can boost the input from 5V to 24V. It allows for adjustments to the motor drive voltage and motor drive current. Additionally, by simply connecting a sensor and power supply, it can autonomously drive the stepping motor. 【Features】 ■ Stepping motor drive ■ Built-in microcontroller ■ Integrated motor ■ Boosts input from 5V to 24V ■ 2-channel sensor connection *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Substrate "Knight Frogs WINE"

Substrate "Knight Frogs WINE"

ECC support! A high-grade board equipped with 10Gb Ethernet and an extended temperature range.

Gofeltec's "Knight Frogs WINE" is a compact, high-grade COM Express module equipped with Intel's third-generation 64-bit SoC Intel Xeon/Pentium processors. The main memory is DDR4 SO-DIMM, supporting up to 8GB and ECC. In addition to the standard I/O of COM Express Type 6, the carrier board can be equipped with 2 channels of 10G Ethernet. 【Features】 ■ 10Gb Ethernet equipped ■ ECC support ■ Extended temperature range (-5℃ to 70℃) ■ Available in Basic Module Size (125×95mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Memory

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Film substrate "FCM-101"

Film substrate "FCM-101"

Thorough pursuit of growth, quality, and cost in the digital market! Highly adhesive substrate film.

FCM Corporation's "FCM-101" is a stable film substrate that allows for cost reduction in applications that do not require reflow heat resistance by using PET and PEN films, and enables consideration for optical applications that require transparency. 【Features】 ■ By combining shielding and antennas, it only captures radio waves in the direction of the antenna. ■ The shield has a mesh pattern and is treated for blackening, making it transparent and invisible. ■ The antenna circuit is tin-plated, making it resistant to discoloration and migration. ■ Using FCM-101 allows for high adhesion and fine circuit design. *For more details, please refer to the catalog or feel free to contact us.

  • Company：FCM
  • Price：Other
  • Printed Circuit Board

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Support substrate for wafer bonding

Support substrate for wafer bonding

A support substrate for wafer bonding with high thermal conductivity, close to the thermal expansion coefficient of semiconductor materials!

We handle "support substrates for wafer bonding." Starting with "pure Mo," which is suitable for power applications requiring high output and high reliability, we also offer "Cu-Mo," which is easy to roll and press, and "Cu-W," which combines the low thermal expansion of W with the high thermal conductivity of Cu. It boasts a thermal expansion coefficient close to that of semiconductor materials and high thermal conductivity. 【Features】 ■ For wafer bonding ■ High thermal conductivity ■ Close to the thermal expansion coefficient of semiconductor materials *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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High thermal conductivity metal substrate "Denka Hit Plate"

High thermal conductivity metal substrate "Denka Hit Plate"

High thermal conductivity metal substrate that achieves thermal resistance equal to or lower than alumina substrates.

The "Denka Hit Plate" is a high thermal conductivity metal base substrate formed from an epoxy-based insulating layer filled with high thermal conductivity inorganic fillers on an aluminum base, achieving thermal resistance equivalent to or lower than that of alumina ceramic substrates. It is used in a wide range of fields such as air conditioner inverters, automotive components, motorcycle electrical parts, and power supplies for communication devices, and has received high praise from the market. 【Features】 ■ High thermal conductivity (up to 10W/mK available) ■ High reliability (withstand voltage, heat resistance, thermal shock resistance, durability) *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts

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High thermal conductivity ceramic substrate "Denka AN Plate"

High thermal conductivity ceramic substrate "Denka AN Plate"

High thermal conductivity ceramic plate realized through high reliability and technology.

The "Denka AN Plate" is a high thermal conductivity ceramic substrate made from aluminum nitride, which has a thermal conductivity approximately seven times that of alumina. It is primarily used as a ceramic circuit board for power modules that require high thermal conductivity and high voltage resistance characteristics. In addition to the standard type (150W/mK), we offer various grades including a high thermal conductivity type (180W/mK), a high reliability type with excellent heat cycle resistance, and a thick plate type for even higher voltage resistance. 【Features】 ■ High thermal conductivity: About seven times that of alumina ■ High insulation: Low dielectric constant with excellent electrical properties comparable to alumina ■ Mechanical properties: High strength equivalent to alumina ■ Low thermal expansion rate: Thermal expansion rate close to that of silicon *For more details, please download the PDF or feel free to contact us.

  • Ceramics

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Flexible printed circuit board

Flexible printed circuit board

Providing the highest quality to our customers is our company's top priority.

‧Laptop ‧Mobile phone ‧Digital camera ‧LCD module ‧Hard disk ‧CD-ROM ‧Printer ‧Touch panel ‧Backlight ‧Battery ‧Consumer products ‧Other electronic devices

  • Other semiconductors
  • LCD display
  • Dedicated IC

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