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substrate Product List and Ranking from 579 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

substrate Product List

901~930 item / All 1956 items

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New feature "IPH" added to Selective Flow (such as Tacrolimus).

Solve the long-awaited issue of insufficient through-hole ups! Effectively heat the necessary areas for soldering.

The "IPH (Induction Heating Preheat Function)" is based on proven heating nitrogen (N2) and point flow methods, and combined with induction heating (IH) preheating, it can efficiently heat and solder patterns and electrodes with large thermal capacities. With heated N2, through-hole ups that typically take time can be completed in a short period. It avoids insufficient heating, reduces solder temperature bath temperatures, and allows for transition to small-diameter nozzles. 【Features】 ■ Heats (generates heat) the patterns or electrode leads that need to be heated ■ IPH On/Off settings and On time can be configured for each step ■ Significantly reduces thermal stress on surrounding components *For more details, please refer to the PDF materials or feel free to contact us.

  • Soldering Equipment
  • substrate

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Recording and playing back soldering videos of defective substrates Soldering EYE

Data search with a barcode! Record and play back soldering videos of defective circuit boards.

We would like to introduce our product, "Soldering EYE." All soldering images are recorded and saved to a NAS. Production management data can be searched using barcodes, allowing for visual selection by clicking on the desired area. Please feel free to contact us when you need assistance. 【Features】 ■ Video recording of each step with a camera ■ Data searchable by barcode ■ Click on defective areas to play the video ■ Image data is saved to NAS *For more details, please download the PDF or feel free to contact us.

  • Other image-related equipment
  • substrate

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Large size printed circuit board manufacturing / Work size up to 1M x 1.2M

Are you having trouble with large-sized PCB manufacturing for small roads?

Our company specializes in the manufacturing of large-sized printed circuit boards.

  • Printed Circuit Board
  • substrate

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Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Electronic circuit board

Thin film and thick film circuit substrates. Formation of conductors, dielectrics, resistors, and phosphor circuits.

For non-printed circuit boards, please leave it to Toyo Seimitsu Kogyo. We will propose the optimal board according to your specified requirements.

  • Printed Circuit Board
  • Organic Natural Materials
  • Ceramics
  • substrate

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Substrate, submount substrate

Substrate, submount substrate

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

  • Other semiconductors
  • Printed Circuit Board
  • Ceramics
  • substrate

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[Circuit Board Manufacturing Example] Small Submount Board for High-Density Mounting

This is an introduction to a case where side patterning technology for substrates has been established.

We will introduce examples of manufacturing substrates for implementing semiconductor devices such as optical modules for optical devices (DVD/CD recorders, optical communication), semiconductor laser diodes, and semiconductor photodiodes. With the trend towards miniaturization and thinness of devices, the demand for implementing multiple elements in a low area and high density is increasing. Therefore, we have established side patterning technology for substrates. It is possible to form circuits on one to four sides of high heat dissipation ceramic substrates such as alumina and aluminum nitride. 【Case Overview】 ■ Base Material: Alumina, Aluminum Nitride, etc. ■ Conductor Film Composition (Au-based wiring, Cu-based wiring *Pt barrier film compatible) ■ Resistance Film Composition (TaN, NiCr), Solder Flow Prevention Film (Cr, Solder Resist) ■ Implementation Support: Wire/Ribbon Bond, Bump, Various Soldering Specifications Available ■ Testing/Reliability: Compatible with MIL specifications and other customer-specified specifications *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • substrate

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【Circuit Board Manufacturing Example】Side Metallization Process

Alumina and aluminum nitride, etc.! Circuit formation is possible on one to four surfaces of high thermal conductivity ceramic substrates.

This is an introduction to a manufacturing case that involves patterning processing on the sides of substrates to enable high-density implementation. It is possible to form circuits on one to four sides of high thermal conductivity ceramic substrates such as alumina and aluminum nitride. Please feel free to consult us when needed. 【Case Overview】 ■ Material: Alumina, Aluminum Nitride ■ Conductor Film: Ti/Pt/Au ■ Chip Size: 1.72mm × 1.1mm × 0.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • substrate

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Coin mech and bill validator control board for vending machines.

You can create a vending machine on a PC.

The upper control allows for the selection of a fishing calculable mode and a full control mode. Full control RS mode EZ-RS mode with change calculation capability EZ-RS_1938 mode with change calculation capability in 5 yen increments

  • Other FA equipment
  • Other PCs and OA equipment
  • substrate

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LAN-compatible coin mech I/O control board [SX-1209A]

Billing control and I/O control using LAN is possible.

This is a convenient control board for implementing billing control over a LAN. It allows for easy creation of billing devices using I/O control and coin mechanisms. It has scalability, such as combining I/O control with billing using a LAN. It can also control a medal vending machine from a PC.

  • Other process controls
  • substrate

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