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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

661～675 item / All 1843 items

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Manual Exposure Device for Experimental and Research Equipment 'MA-1000 Series'

Manual Exposure Device for Experimental and Research Equipment 'MA-1000 Series'

Unique gap mechanism and high-speed image processing! Multi-layer exposure is possible with the auto-alignment system.

The "MA-1000 series" is a manual exposure device suitable for small-lot production of various types and for experiments and research. It can adopt soft contact exposure and proximity exposure. Additionally, we prepare optical systems that combine ultra-high-pressure mercury lamps, various mirrors, and special lenses appropriately according to the application and substrate size. 【Features】 ■ Capable of soft contact exposure and proximity exposure ■ In-plane uniform illumination using a unique mirror and lens optical system ■ Multi-layer exposure is possible *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines

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Germanium substrate

Germanium substrate

Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!

We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Flexible circuit board / Rigid-flexible circuit board

Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

  • Board to Board Connectors
  • Printed Circuit Board

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Printed circuit board

Printed circuit board

We provide total coordination from circuit board design to product completion!

Our company provides total coordination from CAD design of printed circuit boards to board manufacturing, assembly, sheet metal processing, resin processing, cable processing, and assembly inspection. Since there is a close connection between each process, we streamline manufacturing to reduce time and labor costs while providing high-quality products at lower costs. Please feel free to contact us if you have any requests. *For more details, please do not hesitate to inquire.

  • Contract manufacturing
  • Circuit board design and manufacturing

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Printed circuit board

Printed circuit board

From the manufacturing of printed circuit boards to pattern design and component mounting.

Our company is a specialized manufacturer of printed circuit boards located in Kawaguchi City, Saitama Prefecture. We manufacture using small films, allowing for the production of prototypes and small lots with a variety of products. Additionally, we actively manufacture using films retrieved from defunct circuit board companies, which others tend to avoid. 【Our Features】 ■ Low initial costs ■ Partial modifications are possible ■ Production from other companies' films is also possible ■ We propose more cost-effective manufacturing methods ■ Management period for films and plates is a minimum of 5 years *Please feel free to contact us for more details.

  • Printed Circuit Board

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Printed circuit board

Printed circuit board

Leave everything related to the design, manufacturing, assembly, and procurement of printed circuit boards to us!

Our company provides 24-hour support for the design, manufacturing, assembly, and procurement of printed circuit boards with ultra-short delivery times. We leverage our network across various industries both domestically and internationally to manage and procure semiconductors and electronic components in-house. Additionally, we offer flexible responses from small lot production to mass production and prototype assembly, enabling us to achieve short delivery times and high-quality production that is challenging for overseas manufacturing. 【Features】 ■ Same-day shipping for single-sided boards at the shortest level ■ Initial time reduction system ■ Capable of handling sizes from 0603 ■ Support for large boards (LL) ■ We can produce boards starting from just one piece *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Contract manufacturing

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Multilayer substrate

Multilayer substrate

The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.

Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.

  • Processing Contract
  • Circuit board design and manufacturing

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4-layer high-density wiring circuit board

4-layer high-density wiring circuit board

4-layer high-density wiring circuit board

Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM

  • Circuit board design and manufacturing

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8-layer rigid-flexible printed circuit board

8-layer rigid-flexible printed circuit board

It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.

Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens

  • Circuit board design and manufacturing

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4-layer high-density multilayer substrate

4-layer high-density multilayer substrate

Generally, high multi-layer lamination technology is adopted in manufacturing.

Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ

  • Circuit board design and manufacturing

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Tokunaga Manufacturing Co., Ltd. Business Introduction

Tokunaga Manufacturing Co., Ltd. Business Introduction

Visualizing temperature and humidity within the factory to address static electricity! Capable of small-lot production with diverse manufacturing equipment.

TokuNaga Manufacturing Co., Ltd. is a company that assembles printed circuit boards for electronic devices and various electrical components, as well as assembling molded products and metal parts. Within the factory, temperature and humidity are visualized, and at the headquarters, measures are taken to improve low humidity environments using a dry fog humidifier, as well as wearing conductive work clothing, conductive shoes, and grounding bands to address static electricity issues. Additionally, certified personnel are engaged in in-process inspections and soldering work, and to aim for higher skills, education and qualification acquisition are promoted. 【Business Activities】 ■ Printed circuit boards for oil heating devices, power supply equipment, control devices, etc. ■ Assembly of operation panels, power boxes, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing

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Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.

Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.

We also have detailed materials explaining mold (potting) and coating that can implement measures for waterproofing, humidity resistance, and earthquake resistance of the implementation substrate.

If the printed circuit board is used as is, it often leads to malfunctioning of the board, damage to components or the board itself, and a reduction in the lifespan of the board. Therefore, for printed circuit boards in harsh environments, measures such as waterproofing, moisture-proofing, vibration-proofing, dust-proofing, and explosion-proofing become necessary. As a countermeasure, resin molding (resin potting) can be used to inject urethane resin into cases, which can shut out dust, dirt, water, and vibrations. Additionally, since the board is fixed in place, it can be protected from vibrations. *Consideration for implementation is possible even without a case. Furthermore, by coating the surface of the board, it is possible to protect the board from dust, dirt, and moisture. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent

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Resin potting that contributes to the vibration resistance and long life of substrates.

Resin potting that contributes to the vibration resistance and long life of substrates.

By injecting urethane resin into cases, dust, dirt, and water are shut out! This processing technology contributes to the waterproofing, dustproofing, and seismic resistance of printed circuit boards.

Resin potting is a processing technology that allows for the injection of urethane resin into cases, effectively shutting out dust, dirt, and water. Since the circuit board is fixed in place, it can be protected from vibrations. This contributes to the waterproofing, long life, and earthquake resistance of the mounted circuit board. 【Advantages of Resin Potting】 - No worries about dust or dirt adhering to the circuit board - Excellent waterproofing and moisture resistance - Strong against vibrations and impacts as the case can be filled and fixed with resin - Can extend the component replacement cycle, proving effective for products aimed at overseas markets - Prototyping is possible We will carry out work according to your requirements, so please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Coating Agent

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Printed circuit board

Printed circuit board

We specialize in the manufacturing of "single-sided printed circuit boards" and "double-sided printed circuit boards"!

Our company specializes in the manufacturing of printed circuit boards up to "30mm round or 30mm square" and "50mm round or 50mm square" among wiring boards. We are also skilled in small lot production, working with copper-clad laminates ranging from 1 to about 30 sheets as the work size, cutting materials into panels (boards) sized from 255mm square to 340mm square, with our preferred lot size being the production of 10 to 300 panels (boards) per lot. Additionally, we focus on the rare production of "paper phenolic resin boards" in Japan, achieving stable supply. 【Our Features】 ■ Preferred board sizes are small items (compact and small sizes) ■ Preferred lot sizes are small quantities ■ Resist using thermosetting inks and UV-cured inks ■ Basic production involves "repeat production" with press processing ■ Specializing in rigid boards with "single-sided and double-sided" options *Please feel free to contact us for more details.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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