Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
646～660 item / All 675 items
Cool down the substrate!
In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.
The era is 【SPECIAL PCB!】
Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855
Report on the Patent Technology Trends of 5G and Electronic Circuit Boards
You can view patent information categorized by the following technical classifications: - Perspective of electronic components - Perspective of antenna components - Improvement of high-frequency characteristics - Reduction of dielectric loss - Perspective of electronic devices - Other related technologies
