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substrate Product List and Ranking from 561 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社 和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社 和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1291~1320 item / All 1884 items

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Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]

In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.

Our company is a specialized manufacturer of printed circuit boards, actively challenging complex processing and difficult requests, with a wealth of experience and trust. We cater to a wide range of needs, from general circuit boards to special boards aimed at solving challenges related to assembly and product commercialization. Your development concerns, on-site work improvements, and issues related to enhancing product value may be resolved with our printed circuit boards. 【Are you facing any of these issues?】 ■ I want to make the product smaller. ■ I want to use a cavity structure to reduce the height of the product. ■ I am looking for alternatives to FPC. ■ I want to bend FR-4 or aluminum boards for use inside equipment. ■ I want to eliminate copper burrs on side electrodes. ■ I want to eliminate glass cloth or resin debris from the edge of the board. ■ I want to suppress heat generation from components using the board. ■ I want to use boards that are cost-effective and suitable for high-frequency applications. We will work together to address your challenges, supporting your product development with a consistent system from the design stage to prototyping and mass production. No matter how trivial the matter may seem, please feel free to contact us with your ideas or concerns!

  • Printed Circuit Board
  • substrate

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Temperature Dependence of Discoloration in Wafer-Type Ceramic (Sapphire Substrate)

In Ar plasma, the color difference is small, while in O2 plasma, there is a tendency for the color difference to become larger.

We would like to introduce the temperature dependence of discoloration in wafer-type ceramic (sapphire substrate) technical data. When the wafer-type ceramic was heated to 400°C and subjected to plasma treatment, a tendency for the color difference to decrease was observed with Ar plasma, while an increase in color difference was observed with O2 plasma. Although there is a temperature dependence on discoloration, it was confirmed that it can still be used as an indicator even at 400°C. 【Overview of Ar/O2 Plasma Treatment】 ■ Method: CCP (RF) ■ Initial Vacuum Level: 5.0×10^-4 Pa ■ RF Power: 50 W ■ Gas Flow Rate: 40 sccm ■ Treatment Gas Pressure: 10 Pa ■ Treatment Time: 10 minutes *For more details, please refer to the related links or feel free to contact us. *The first image shows Ar plasma treatment, and the second image shows O2 plasma treatment.

  • Other inspection equipment and devices
  • substrate

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Original DPGA (for high brightness and high heat dissipation LEDs)

Introducing a high thermal conductivity substrate that connects the LED heat dissipation pad and copper base through a copper bump.

The "Original DPGA (for high-brightness, high-heat-dissipation LEDs)" is a high-heat-dissipation substrate that connects the LED's heat dissipation pad to a copper base via copper bumps. Thanks to the high thermal conductivity of copper, it is possible to efficiently release the heat from high-brightness LEDs. The significant difference between aluminum substrates, CEM3 substrates, and DPGA substrates is that they connect directly to the LED heat dissipation pad, allowing for efficient heat dissipation. 【Features】 ■ Efficiently releases heat from high-brightness LEDs ■ High thermal conductivity of copper ■ Enables efficient heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • substrate

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Custom-made item: "Assembled product, ceramics"

The cold cathode tube components and assemblies are combinations of multiple products.

The assembled products consist of cold cathode tube components and assemblies that combine multiple products. (Excluding double pins and pins with shafts) Ceramic products can be made in small lots. The materials used are alumina, zirconia, steatite, and forsterite. 【Usage Examples】 ○ Temperature sensor components → Used in temperature sensor components for preventing overheating in gas ranges → Composed of multiple parts ○ Ceramics → Used for earring pins → Ceramics are used to prevent metal allergies For more details, please contact us or download the catalog.

  • Other machine elements
  • substrate

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Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Thin FPC "Low Resilience FPC"

Custom softness! We offer variations to meet low-rebound needs.

"Low-Rebound FPC" is a solution that addresses the challenges of making devices thinner and smaller. We have refreshed the lineup of our flagship thin FPC brand, the "MK Series," to offer variations that meet low-rebound needs. 【Features】 ■ In-house developed products ■ Customizable softness ■ Thinner and smaller devices ■ High flexibility and low recovery rate *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other electronic parts
  • others
  • substrate

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FPC "Double-sided FPC"

It is possible to achieve conductivity on both sides through through-hole plating!

"Double-sided FPC" is a printed circuit board with a base film (insulating substrate) at its center and conductor patterns on both sides. It is mainly used in products such as cameras and mobile LCDs, and it is possible to achieve conductivity on both sides through through-hole plating. [Features] - Conductor patterns on both sides - Capability for conductivity on both sides *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Other Machine Parts
  • substrate

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Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

  • Other metal materials
  • substrate

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Residue-free low-temperature drying masking ink 'Peeelink MF'

Newly developed masking ink! It leaves no residue and is less likely to leave peeling marks. It is halogen-free!

Peeelink MF" is a low-temperature drying masking ink that leaves no residue on the protected object after peeling. It can be applied through various methods such as screen printing, spray application, dispenser application, and brush application, making it suitable for processing shapes regardless of curvature. It is ideal for protecting electronic device displays and for paint masking. It complies with RoHS and REACH regulations, and does not produce contaminants even under environmental testing, ensuring safe use from an environmental perspective. 【Features】 ■ Film formation possible at low temperature in a short time (70℃/10min) ■ Easy to peel off with tape ■ Ideal for preventing scratches during shipping and processing ■ Halogen-free *For detailed information, please request through "Contact Us.

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  • sub2.JPG
  • paint
  • substrate

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Apollo Seiko Co., Ltd. Soldering Equipment Comprehensive Catalog

Comprehensive catalog of soldering equipment. Featuring devices characterized by high quality, high efficiency, and ease of use.

The "Soldering Equipment Comprehensive Catalog" from Apollo Seiko Co., Ltd., handled by Keitecno Co., Ltd., features the next-generation robot "L-CAT NEO," which is equipped with all the necessary functions for soldering, as well as various high-quality, high-efficiency, and user-friendly soldering robots and equipment. The soldering equipment from Apollo Seiko Co., Ltd. includes features such as "solder tip exchange," "solder ball scattering prevention mechanism," and "accumulated technological expertise." [Contents] - Automatic soldering robots - Soldering units - Manual soldering equipment - Soldering-related devices - Soldering options and consumables For more details, please contact us or download the catalog.

  • Soldering Equipment
  • Other industrial robots
  • substrate

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Retrofit ▶ Electronic Circuit Board

We will analyze and investigate the old circuit diagrams or device operations of devices and circuit boards that have become difficult to manufacture due to the discontinuation of parts, and we will redesign and manufacture them.

Our company will renew devices and circuit boards that can no longer be updated due to reasons such as "past design and manufacturing, or the person in charge has left," or because the subcontractor we previously commissioned for development has gone out of business. As a feature of electronic circuit board retrofitting, we also produce software to be embedded in the circuit boards. Additionally, we have a track record of using various devices and development environments. 【Features】 ■ Analyze and investigate old circuit diagrams or device operations, then redesign and manufacture ■ Renew devices and circuit boards that can no longer be updated ■ Produce software to be embedded in the circuit boards ■ Track record of using various devices and development environments *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Circuit board design and assembly, enclosures and peripheral accessories.

Sheet metal processing, painting, silk printing, etc.! We can help you reduce costs.

Our company not only designs and manufactures electronic circuits but also simultaneously designs and manufactures surrounding accessories such as enclosures and components. We can accommodate additional engraving and silk printing on existing molded products, as well as surrounding parts and printed molding of panel sheets. Furthermore, these processed products can be accepted individually, helping to reduce costs. 【Service Contents】 ■ Sheet metal processing and painting silk printing ■ Additional engraving and silk printing on existing molded products ■ Surrounding parts ■ Printed molding of panel sheets ■ Processed products *For more details, please refer to the related links or feel free to contact us.

  • Other contract services
  • substrate

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Quality Policy: Traceability System

Process management to maintain quality

In our quality assurance process, we inspect all products after assembly using an inspection sheet. We confirm the quality that has already been integrated into the standardized work processes at each stage. ★Manufacturing Number Management System★ A manufacturing number is assigned for each order. All work records, including process communication documents, are managed by the manufacturing number. In the unlikely event of a defect in market products, we can instantly identify the manufacturing period. ★Parts Information Tracking★ We centrally manage inventory data and parts receipt and dispatch that are always linked to the bill of materials for the circuit board in our inventory management system. Anyone can track parts information for each project. Any changes to parts are recorded in the bill of materials and stored for ten years. ★Shipping History Records★ We record the shipping method for each order. In the case of delivery, we import the tracking number and shipping information into our internal system, allowing for past tracking. When products are shipped, we notify customers with a shipping completion email. *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • substrate

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Overseas manufactured printed circuit boards / domestically inspected products

Leave the Chinese manufacturer's printed circuit boards to us! We also handle re-inspections at domestic inspection companies.

Sasu Sanwa Co., Ltd. is engaged in the sale of printed circuit boards from Chinese manufacturers. Our company mainly handles manufacturers from Jiangxi Province, China, and we offer products at a lower price range than domestic products under our quality control. Additionally, we can accommodate re-inspections at domestic inspection companies according to customer needs. 【Products】 ■ Single-sided printed circuit boards ■ Double-sided through-hole boards ■ Multi-layer printed circuit boards (2L-20L) ■ HID (1+N+1/2+N+2/3+N+3/Any Layer) ■ Flexible boards ■ Rigid-flex boards *For more details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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5G Electronic Materials PTFE FPC Fluororesin Substrate

Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.

We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.

  • Other electronic parts
  • substrate

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Uekatsu Industrial's Electronics Division

Achieving high processing precision and advanced quality control cultivated over many years. Supporting the digital revolution.

We would like to introduce the "Electronic Division" of Uekatsu Industries. We are engaged in the development, manufacturing, and sales of aluminum HD substrates (aluminum grind substrates), which are one of the main components incorporated into HDDs. Our substrates are produced using unique lathe processing technology and precision polishing techniques, based on development that anticipates market demand characteristics, manufacturing technology that takes productivity into account, and robust quality control from the source. This approach supports the improvement of evolving memory density in terms of both surface characteristics and quality. 【Features】 ■ Thorough quality control ■ Utilization of unique cutting and polishing technologies ■ A balance of high processing precision and advanced quality control developed over many years ■ Provision of high-quality substrates (substrates) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • substrate

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Wire Cut Repair Service

Urethane roller replacement, ceramic roller regrinding, guide cleaning.

【Urethane Roller Replacement】 Urethane rollers develop wire grooves in the urethane part over time, which can lead to wire slippage and other issues. By replacing the urethane, the roller can be restored to like-new condition and reused. 【Ceramic Roller Regrinding】 Ceramic rollers develop wire grooves on the surface of the ceramic part over time, which can lead to wire slippage and other issues. By regrinding until the wire grooves are eliminated, the roller can be reused. 【Guide Cleaning】 When brass chips and sludge from the wire accumulate inside the die guide used in electrical discharge machining, it can adversely affect machining accuracy and automatic wire connection rates. By removing these foreign substances, the guide can demonstrate its original performance.

  • Other consumables
  • substrate

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Introduction to Color Filter Substrates

Capable of supporting colorization for EL and electronic paper! Flexible glass color filter substrate.

Kiso Komamicro Co., Ltd. began mass production of color filters (CF) for liquid crystal displays (LCD) in 1993, following the completion of the Micro Technology Research Institute and Kiso Komagata Factory. In 2000, in response to the colorization of mobile phones, we adapted to mass production of reflective CF. Additionally, we can mass-produce bendable glass CF with high precision and complete barrier properties, known as aimic-CF. Aimic-CF features glass that is made as thin as possible, bonded to a film as a support, allowing it to accommodate curved surfaces. We are also capable of partial mass production and prototyping of thin film metal patterning, such as ITO. 【Color Filter Substrates】 ■ Color filters for liquid crystal displays ■ Bendable glass (aimic) color filters ■ Film-based color filters (PET, PEN, etc.) under development ■ Thin film patterning technology *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Equipment Introduction] Surface Mounting Machine 'M2 MOUNTING CENTER'

Flexible and quick setup changes! High-performance chip mounter.

The "M2 MOUNTING CENTER" is a surface mount machine manufactured by iPulse that can accommodate the assembly of small quantities of various types of circuit boards. As a medium-sized machine that combines the high speed of a chip shooter with the versatility of a multifunctional mounter, it is capable of handling the assembly of most small quantities of various circuit boards with just one unit. In addition, we also have the YAMAHA "M20 Hybrid Modular." 【Features】 ■ Equipped with a feeder set miss prevention function ■ A medium-sized machine that combines the high speed of a chip shooter with the versatility of a multifunctional mounter ■ Capable of handling the assembly of most small quantities of various circuit boards with just one unit *For more details, please refer to the PDF materials or feel free to contact us.

  • Other mounting machines
  • substrate

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Integrated drive control board for stepping motors.

It can be mounted on a motor and used as an integrated unit! It is a control board with a built-in microcontroller.

We handle the "Integrated Drive Control Board for Stepping Motors." This product can boost the input from 5V to 24V. It allows for adjustments to the motor drive voltage and motor drive current. Additionally, by simply connecting a sensor and power supply, it can autonomously drive the stepping motor. 【Features】 ■ Stepping motor drive ■ Built-in microcontroller ■ Integrated motor ■ Boosts input from 5V to 24V ■ 2-channel sensor connection *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Substrate "Knight Frogs WINE"

ECC support! A high-grade board equipped with 10Gb Ethernet and an extended temperature range.

Gofeltec's "Knight Frogs WINE" is a compact, high-grade COM Express module equipped with Intel's third-generation 64-bit SoC Intel Xeon/Pentium processors. The main memory is DDR4 SO-DIMM, supporting up to 8GB and ECC. In addition to the standard I/O of COM Express Type 6, the carrier board can be equipped with 2 channels of 10G Ethernet. 【Features】 ■ 10Gb Ethernet equipped ■ ECC support ■ Extended temperature range (-5℃ to 70℃) ■ Available in Basic Module Size (125×95mm) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Memory
  • substrate

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[Case Study] Customers for Public Terminals

Significantly contributes to securing your development resources! We can make proposals utilizing our know-how in custom solutions.

We would like to introduce a case study of our public terminal proposal. There are many manufacturers whose current products have reached EOL and cannot supply alternatives, resulting in the existing design assets not being able to be reflected in the next-generation devices, leading to challenges with development timelines. With Tekunart's video conversion board, we were able to absorb the specification differences on the LCD side and propose solutions using the existing system without changing the customer's input signals or connectors. 【Case Overview】 ■Challenge - We want to shorten the development lead time for the next-generation device. ■Effect - By adopting Tekunart, it has become possible to develop equivalent products that follow the interface of the display section. *For more details, please refer to the PDF document or feel free to contact us.

  • Other FA equipment
  • substrate

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Film substrate "FCM-101"

Thorough pursuit of growth, quality, and cost in the digital market! Highly adhesive substrate film.

FCM Corporation's "FCM-101" is a stable film substrate that allows for cost reduction in applications that do not require reflow heat resistance by using PET and PEN films, and enables consideration for optical applications that require transparency. 【Features】 ■ By combining shielding and antennas, it only captures radio waves in the direction of the antenna. ■ The shield has a mesh pattern and is treated for blackening, making it transparent and invisible. ■ The antenna circuit is tin-plated, making it resistant to discoloration and migration. ■ Using FCM-101 allows for high adhesion and fine circuit design. *For more details, please refer to the catalog or feel free to contact us.

  • Company:FCM
  • Price:Other
  • Printed Circuit Board
  • substrate

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Support substrate for wafer bonding

A support substrate for wafer bonding with high thermal conductivity, close to the thermal expansion coefficient of semiconductor materials!

We handle "support substrates for wafer bonding." Starting with "pure Mo," which is suitable for power applications requiring high output and high reliability, we also offer "Cu-Mo," which is easy to roll and press, and "Cu-W," which combines the low thermal expansion of W with the high thermal conductivity of Cu. It boasts a thermal expansion coefficient close to that of semiconductor materials and high thermal conductivity. 【Features】 ■ For wafer bonding ■ High thermal conductivity ■ Close to the thermal expansion coefficient of semiconductor materials *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • substrate

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Ogata Manufacturing Co., Ltd. Business Introduction

We will utilize our know-how based on experience and achievements to create products that are "kind to people and nature."

At Ogata Manufacturing Co., Ltd., we engage in the mounting of electronic components on printed circuit boards, assembly of various printed circuit boards, manufacturing and assembly of various electronic devices, processing of molded parts (related company), and processing of film sheets, among other activities. We have established a system to meet the diverse needs of our customers. Utilizing our know-how based on past experiences and achievements, we deliver reliable products to our customers. 【Business Activities】 - Mounting and assembly of electronic components on various printed circuit boards - Manufacturing and assembly of various electronic devices (unit assembly and finished product assembly) - Processing of film sheets (cutting, laminating, half-cutting) - Dispatch of specific workers For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Other electronic parts
  • Processing Contract
  • substrate

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FPC - Flexible Printed Circuit Board (Flexible Substrate)

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

Please leave it to us for everything from small-scale prototypes (for research and development purposes) to mass production. 'FPC (Flexible Printed Circuit)' is a type of printed circuit board that is based on flexible and thin insulating materials such as polyimide, allowing for flexible bending. Taiyo Kogyo has extensive experience and achievements, enabling us to manufacture FPCs tailored to various needs. They are used in digital cameras, smartphones, laptops, robots, automobiles, car navigation systems, medical devices, aerospace, and more. Additionally, we also offer halogen-free types, and please feel free to consult us regarding combinations of various types and thicknesses. [Features] - A type of printed circuit board - Good flexibility with materials like polyimide - Based on thin insulating materials - Flexibly bendable - Halogen-free types are also available *For more details, please refer to the PDF materials or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other electronic parts
  • substrate

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High-frequency compatible FPC (fluoropolymer composite material specification) flexible printed circuit board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (Fluoropolymer Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluoropolymer composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss for stable high-speed, high-capacity communication. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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  • Other electronic parts
  • substrate

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Bump FPC

A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. It is optimal for testing fine-pitch insertion terminals and display lighting tests when combined with our contact clips and hand presses. *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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  • Other electronic parts
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MR cylindrical mirror polishing machine retrofit and overhaul (mirror grinding machine)

[TAIYO] The MR cylindrical mirror polishing machine, used for a long time, can be renewed and have additional functions added!

The cylindrical mirror polishing machine made by Mirak is highly durable and has been proven for long-term operation, but timely overhauls and retrofits are possible. Existing users are encouraged to consult with us. 【About the MR Cylindrical Mirror Polishing Machine】 We would like to introduce representative models of the MR cylindrical mirror polishing machine made by Mirak. The main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for various material rolling (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless rolls * Carbide and ceramic rubber rolls Detailed specifications of the products will be provided based on your requests. Please feel free to contact us first.

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