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substrate Product List and Ranking from 580 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

substrate Product List

1291～1320 item / All 1960 items

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Build-up PWB

Build-up PWB

Significantly improved circuit density! A substrate that enables more three-dimensional and high-density configurations.

"Build-Up PWB" mounts components on the connection via pads. Due to fewer restrictions on through holes, it significantly increases circuit density. By combining our unique machining technology, we have achieved a more three-dimensional and high-density configuration. Filled vias with copper plating are also available (subject to separate consultation). 【Features】 ■ Components mounted on connection via pads ■ Fewer restrictions on through holes ■ Significantly increases circuit density ■ Three-dimensional and high-density configuration *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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PWB for LED

PWB for LED

Manufacturing high-brightness, high-heat-dissipation PWB for LEDs by combining high-precision processing technology with substrates and plating!

Our company manufactures high-brightness, high-heat-dissipation "PWB for LEDs" by combining high-precision processing technology with substrates, resist, plating, and more. We are capable of high-precision slit processing using routers, as well as slit processing with special presses and reflector-shaped hole processing. Additionally, by tenting one side of the through-hole with solder resist or copper foil, we prevent mold resin from flowing onto the backside during bulk molding after assembly. We create substrates with high heat dissipation structures by attaching thick copper foil or copper plates, or by processing copper plates using our high-precision machining technology. 【Features】 - Compatible with 0.1mm thick substrates and thin materials of 50 microns thickness - Gold plating, silver plating, and dual-color gold-silver plating available - Prevents mold resin overflow - Processes copper plates with high-precision cavity formation technology - High heat dissipation structure *For more details, please refer to our catalog or feel free to contact us.

  • LED Module
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Double-sided multi-layer PWB

Double-sided multi-layer PWB

High-density and high-reliability multilayer boards can be manufactured!

"Double-sided and multilayer PWB" is a double-sided and multilayer substrate required in various fields. By adopting our unique technology, we can manufacture high-density and highly reliable substrates. By filling through-holes with resin and applying a cover plating on top, it is possible to form pads on the through-holes as well. It is also possible to create semi-cut through-holes in the product outline, enabling miniaturization of the product. Additionally, our unique pin insertion technology allows for the insertion and fixation of lead pins into the substrate. 【Features】 ■ High density and high reliability ■ Pads can be formed on through-holes ■ Enables miniaturization of products ■ Selection of materials with high rigidity, low dielectric, high heat resistance, and halogen-free options ■ Allows for the insertion and fixation of lead pins into the substrate *For more details, please refer to the catalog or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Flat pushback technology

Flat pushback technology

A flat push-back board that achieves a flat finish for improved efficiency during assembly.

The "Flat Pushback Technology" provides a superior substrate during component mounting by suppressing the curvature of the sheet through advanced mold technology and our unique flat pushback sheet shape. It ensures the necessary holding force during component mounting while also being easy to separate after installation. Additionally, defective products within the sheet can be removed and replaced with good ones. 【Features】 ■ Flat shape that suppresses curvature ■ Advantageous during component mounting ■ Processing of half-cut through holes in the pushback area is also possible *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • substrate

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Advanced dam technology

Advanced dam technology

A technology capable of forming high dams of approximately 0.1 to 0.6 mm through a unique special printing method.

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using its unique metal sheet bonding technology. By bonding rigid substrates with sealing frames and rigid substrates with copper foil, it is possible to create package structures that are difficult to achieve with conventional multilayer designs. It is easy to form dams of varying heights and dimensions within the same product, and high dams of approximately 0.1 to 0.6 mm, which cannot be formed with conventional printing inks, can be created using our unique special printing method. Additionally, it eliminates gaps on the bonding surfaces that are likely to occur with adhesive-type sealing frames, allowing for batch processing unlike dispensers. 【Features】 ■ Gaps on bonding surfaces can be eliminated ■ Batch processing is possible ■ High dams can be formed using a special printing method ■ It is easy to form dams of varying heights and dimensions within the same product *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts
  • substrate

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Ceramic substrate for LED packages

Ceramic substrate for LED packages

In recent years, with the miniaturization, lightweight design, and high performance of electronic devices, the importance of heat dissipation measures due to high-density mounting of electronic components has been increasing.

In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.

  • Printed Circuit Board
  • Fine Ceramics
  • substrate

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High reflectivity ceramic substrate

High reflectivity ceramic substrate

We can provide high-reflectivity ceramic substrates made from alumina ceramics as the base material.

Ceramic substrate with high reflectivity characteristics We can provide high reflectivity ceramic substrates made from alumina ceramics as the base material. Since no special additives or coatings are used in the manufacturing process, there is no concern about contamination in subsequent processes. It is possible to accommodate mass production equivalent to existing products, as equipment for conventional alumina substrates can be shared. Additionally, because it is composed of existing raw material groups, it does not contain any substances regulated by environmental regulations.

  • Printed Circuit Board
  • Fine Ceramics
  • substrate

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Porous ceramic substrate

Porous ceramic substrate

Promotion of binder removal and improvement of sintering efficiency through multi-layer stacking in the sintering process of ferrite and metal powder injection molding (MIM) products.

Porous ceramics are ceramics that have countless pores (porosity) inside. The presence of porosity reduces thermal conductivity and makes the material lightweight. Due to their extremely high permeability, they are used as setters in the firing process, resulting in excellent firing quality. Our porous ceramic substrates have a proven track record in processes such as "binder removal promotion" and "improvement of firing efficiency through multi-layer stacking" in the firing of ceramic products like ferrite substrates and metal injection molding (MIM) products.

  • Printed Circuit Board
  • Fine Ceramics
  • substrate

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Proposal to increase the number of shelf levels for firing setter ceramic substrates and firing jigs.

Proposal to increase the number of shelf levels for firing setter ceramic substrates and firing jigs.

Setter ceramic substrates optimized for the firing process, diverse ceramic technologies, and technology development that meets customer applications.

■Background We have developed a ceramic substrate optimized for "firing setters" by leveraging the characteristics of porous ceramics and utilizing our in-house integrated processes, such as printing on fired ceramic substrates, to meet the increasingly diverse needs of customers utilizing firing processes. Recommended for those who want to "fire more at once!" ■Usage Improving production efficiency in "batch vacuum furnaces" used in firing processes is a significant challenge. We often hear requests to "fit as many works as possible into a single firing process." By utilizing the "manufacturing technology for thin ceramic substrates" that we have cultivated, it is possible to increase the number of setter layers. This allows for an increase in the number of works that can be fired in a single process. In cases where there are space constraints in a firing furnace as illustrated, replacing conventional ceramic plates (7mm thick) with "our ceramic substrates for firing setters (1mm thick)" enables an increase in the number of shelf layers from 16 to 18, resulting in a 12% improvement in firing loading efficiency. Additionally, even with the same number of works, "thicker works" can be fired, allowing for a wider range of applications for the firing furnace.

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  • Ceramics
  • substrate

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Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

Formation of fine electronic circuits on ceramic thin plates 500mm x 500mm (MAX)

From business card size to A4 size, forming thick film circuits in desired sizes and materials. From forming electronic circuits with ceramic materials to applications for firing setters.

Notice from Kyoritsu Elex - - - - - - - - - - - - - - - - - - - - - - - - - JPCA Show 2025 (Printed Circuit Board Technology Exhibition) Location: (Tokyo Big Sight) June 4 (Wednesday) to June 6 (Friday), 2025, for 3 days - - - - - - - - - - - - - - - - - - - - - - - - - We look forward to seeing you. Our company offers circuit formation for electronic component applications using the technology of printed circuit formation on ceramics substrates manufactured in-house, all through a consistent in-house process. By utilizing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they achieve stable performance and high reliability. The printed materials are not limited to wiring materials (metal paste) but also include insulating glass materials and ceramics, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, so we look forward to your inquiries.

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  • KZ3_print.jpg
  • alumina_print.jpg
  • L35_S35_Au_Plate.jpg
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  • Other electronic parts
  • substrate

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Ceramic substrate for firing setters

Ceramic substrate for firing setters

Non-stick, does not hinder contraction, no need for powder treatment, significantly improved efficiency!

The "ceramic substrate for firing setters" is a developed product that prevents adhesion between the workpiece and the setter. Our company shapes convex dimples on the surface, eliminating the need to apply release powder. In addition to the porous pore section, the product has space on the bottom surface, resulting in good debinding efficiency. Furthermore, due to point contact, there is no sticking during removal, allowing for smooth extraction. 【Features】 ■ Good debinding efficiency due to the porous pore section and space on the bottom surface of the product ■ Reduced obstruction during shrinkage due to point contact of the product support (improved finishing accuracy) ■ No sticking due to point contact, allowing for smooth removal (increased work efficiency) ■ Both sides can be convexly manufactured, and design changes are possible *For more details, please download the PDF or feel free to contact us.

  • Ceramics
  • substrate

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Sanwa Electronics Circuit Co., Ltd. Business Introduction

Sanwa Electronics Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was established in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently engaged in the production of printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004, marking a new beginning as Sanwa Electronic Circuit Co., Ltd. Through this integration, we have consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory. This has allowed us to build a flexible production system capable of accommodating a wide range of product specifications and lot sizes, from small to large. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • substrate

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Device substrate (LED substrate, sensor substrate)

Device substrate (LED substrate, sensor substrate)

We can accommodate a substrate thickness of 0.04mm! We respond widely to our customers' needs.

The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond widely to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board "double-sided board"

Printed circuit board "double-sided board"

The substrate mainly uses FR-4 and CEM-3 materials! We provide circuit boards tailored to your needs.

A "double-sided board" is a printed circuit board that forms circuits on both sides of the substrate and connects the circuits on both sides through plated through holes. Our company offers various substrates tailored to applications, including high-density boards for miniaturization and increased component placement flexibility, thin boards, COH boards, edge-plated through-hole boards, and thick copper boards for high current applications. We can also accommodate requests for short delivery times, and we mainly use FR-4 and CEM-3 materials as the substrate. 【Features】 ■ Mainly uses FR-4 and CEM-3 materials as the substrate ■ Can accommodate requests for substrates with high heat resistance and other specifications ■ Can respond to requests for short delivery times *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Printed circuit board "Single-sided board"

Printed circuit board "Single-sided board"

We accommodate requests for short delivery times! We provide circuit boards tailored to various applications.

A "single-sided board" is a printed circuit board that has circuits formed only on one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards for miniaturization and increased component mounting density, as well as power boards that can handle high currents. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The base materials primarily used are FR-4, CEM-3, and FR-1. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various inter-layer connections through laser and drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various inter-layer connections through laser and drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Various substrate materials available for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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IVH substrate

IVH substrate

By using various VIA structures, we provide substrates tailored to your needs!

We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Supports various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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End face through-hole substrate

End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole Boards" that we handle. They enable high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for the miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored for various applications that require heat dissipation, with aluminum thickness options of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications requiring heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole designs as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

High Thermal Conductivity Substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." One of its features is that it has flexibility similar to that of a flexible circuit while being able to maintain a bent shape, which is a significant advantage. It also possesses heat dissipation properties as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Also possesses heat dissipation properties *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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High-speed signal and high-density substrate "IVH substrate"

High-speed signal and high-density substrate "IVH substrate"

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate," which we handle. By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when you need assistance. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can also accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Bonding substrate

Bonding substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing custom-designed printed circuit boards (PCBs) that meet your specific requirements, thanks to our special three-layer substrates and the bonding structures of materials and copper foils. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or other materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and individual product implementations. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or other materials *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the ends of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edges of the substrate through contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide burr-free edge through holes.

We would like to introduce our "Narrow Pitch Edge Through-Hole Circuit Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter circuit boards ■ Module circuit boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! The board thickness can be accommodated from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut-through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Resistor hole filling board

Resistor hole filling board

By embedding solder resist ink in the through-hole section, it is possible to cover it!

We would like to introduce our "Solder Mask Plugging Board." By embedding solder mask ink into the through-hole areas, it is possible to cover them. This prevents flux and solder from creeping up to the surface during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Silicone printed circuit board

Silicone printed circuit board

Support for metal-based substrates is also possible! Suitable for applications such as heat resistance and UV equipment.

We would like to introduce our "Silicone Printed Circuit Board." Our silicone ink has high weather resistance against heat and the recently noted UV-C, as well as a high reflectivity. Although it is prone to bleeding, requiring a larger clearance with the circuit, we can provide silicone ink-coated boards with a minimum clearance of 0.2mm from the edges of the mounted circuit, thanks to our unique technology. [Applications] ■ Heat-resistant, UV equipment-related, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flexible circuit board

Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

In the era of IoT, we propose the use of copper inlay substrates and metal-based substrates for heat dissipation solutions, as well as ultra-thin substrates to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related issues with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the heat generation of components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate specific shapes. 【Products Offered】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for double-sided boards to be affixed with heat dissipation sheets. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be shaped by bending. - The use of flexible resins and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

  • Printed Circuit Board
  • substrate

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