Tokai Shin-ei Electronic Industry Double-Sided Circuit Board
We offer a variety of products to meet the diverse needs of our customers.
It is a substrate with copper foil on both sides of a glass epoxy insulating board.
- Company：東海神栄電子工業
- Price：Other
substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
substrate Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
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- 三和電子サーキット Osaka//Electronic Components and Semiconductors
- 4 null/null
- 5 モリマーエスエスピー Osaka//Resin/Plastic 本社
substrate Product ranking
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
- Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
- Aluminum foil etched circuit board
- Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
- 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
- 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
substrate Product List
631～645 item / All 675 items
Displayed results
Tōkai Shin'eidenshi Kōgyō FPV Circuit Board
It will be possible to design a board equipped with a BGA with a 0.65 pitch.
FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.
- Company：東海神栄電子工業
- Price：Other
Daichang Electronics Module Circuit Board
We aim to be a company where everyone can thrive and enjoy their work.
The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.
- Company：大昌電子
- Price：Other
Metal matrix composite substrate Baseplate
High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.
AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.
- Company：豊港 半導体材料事業部
- Price：Other
Impedance control board
Impedance control board
We will design to match the necessary impedance values and ensure compatibility during the circuit board manufacturing process.
- Company：アーセルデザイン
- Price：Other
IVH substrate
IVH substrate
In prototype boards, the IVH method may be cheaper and have shorter lead times than build boards. We can provide a proposal in the quotation materials.
- Company：アーセルデザイン
- Price：Other
Thick copper foil substrate
Thick copper foil substrate
We have a track record of accommodating copper foil thicknesses from 70μ to 210μ.
- Company：アーセルデザイン
- Price：Other
Electrode growth substrate
Electrode growth substrate
It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.
- Company：アーセルデザイン
- Price：Other
Copper inlay substrate
Copper inlay substrate
By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.
- Company：アーセルデザイン
- Price：Other
Aluminum substrate
Aluminum substrate
You can achieve a significant heat dissipation effect. We can provide a quote including manufacturing.
- Company：アーセルデザイン
- Price：Other
Tester board (performance/probe/semiconductor evaluation)
Tester board (performance/probe/semiconductor evaluation)
We have a track record of various custom boards for semiconductor testers.
- Company：アーセルデザイン
- Price：Other
Ultra-low transmission loss substrate (MEGTRON6)
Ultra-Low Transmission Loss Substrate (MEGTRON6)
Design will be conducted using high-frequency substrates and high-speed transmission substrates.
- Company：アーセルデザイン
- Price：Other
Copper foil cutting substrate
Simplified prototyping of the circuit board! If the conditions are limited, such as a prototype of a prototype and specific verification items, this method is also possible!
The substrate is created by cutting copper foil. There are constraints on pattern width and insulation distance to omit circuit formation in the general printing process, and it is mainly for prototyping purposes. It is effective for shortening delivery times and cost reduction until completion.
- Company：クレバー産業
- Price：Other
