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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1231～1260 item / All 1904 items

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Package printed circuit board (PCB) / Chip-on-Board (COB)

Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

  • Printed Circuit Board
  • substrate

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Package printed circuit board

Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • substrate

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High thermal conductivity printed circuit board

High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board
  • substrate

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Frequently Asked Questions about Printed Circuit Boards

Frequently Asked Questions about Printed Circuit Boards

Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.

At Sato-sen Co., Ltd., we provide high-quality printed circuit boards that meet the increasing demands for high functionality and high precision. We offer solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Here are some frequently asked questions regarding printed circuit boards: 【Production Related】 - Design: Supports DXF, DWG, and COB++, compatible with OrCAD Capture and BSchl. - Delivery Time: Can accommodate short delivery courses and can also shorten delivery times after ordering. - Quantity: Capable of producing even a single board. - Cost: Can reduce initial costs as we can handle everything from prototypes to mass production. - UL: UL compliant as we are a UL certified factory. For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Introducing circuit formation technology! A method to improve the positional accuracy of patterns on both sides.

Sato-sen Co., Ltd. offers multilayer printed circuit boards with high density, IVH, BVH, and buildup, providing design flexibility. We ensure improved hole position accuracy with ultra-high-speed micro-diameter drill machines, high-density circuit formation (L/S = 30/30) using LDI (Laser Direct Imaging), and stable quality multilayer printed circuit boards through X-ray reference hole drilling and X-ray length measurement. 【Features】 - Flat plugs (pad on via) allow for mounting on through holes. - Landless through holes enable support for narrow pitch patterns. - CCD technology enhances the precision of pressing, routing, and V-cut to match the pattern position (±75). - Ultra-fine printing is possible (1 character measuring 0.28mm vertically x 0.15mm horizontally). Please contact us for more details.

  • Printed Circuit Board
  • substrate

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Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Introducing bonding silver plating technology! Electroless silver plating is possible.

Sato-sen Co., Ltd. is capable of performing silver plating that can be deposited without electrolysis. We offer optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, which can reduce discoloration due to thermal degradation during assembly and use. We provide reflector processing for high brightness and optimal surface treatment for LED wavelengths. We also propose various heat dissipation measures to lower the junction temperature of the chips. 【Features】 - Outline processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation is possible with heat sink pins inserted into through-holes. For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.

At Sato-Sen Co., Ltd., we offer integrated rigid-flex printed circuit boards that utilize flexible substrates for multilayer boards, enabling miniaturization and cost reduction, including assembly. By adopting rigid-flex technology, we can reduce the number of printed circuit boards, leading to smaller finished products, and eliminate the soldering process for flexible printed circuit boards, thereby reducing assembly space. This also helps to minimize noise caused by antenna effects in flexible sections and reflections at connection points, as seen in traditional designs. **Features of Miniaturization with Rigid-Flex Printed Circuit Boards:** - Pins are inserted into through-holes and soldered, enhancing strength. - The flexible connection between rigid boards is embedded in the inner layers, providing noise prevention benefits. - Flexible materials are incorporated into the inner layers, eliminating the need for soldering and streamlining the process. For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Introducing dust prevention technology for printed circuit boards! There are mass production results for optical systems thanks to dust collection technology.

At Sato-Sen Co., Ltd., we generally recommend dust-free router processing for the outer shape processing of optical devices that are sensitive to dust. Sato-Sen Co., Ltd. has a proven track record in mass production for optical systems through the optimization of router programs and dust collection technology during and after processing. 【Dust Prevention Technology】 - High-precision punching equipment and mold processing - Special mold heat treatment and surface treatment - High-precision assembly technology ⇒ Achieving finishes that closely rival traditional press molds with router processing. For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Paper substrate *Circuit formed with silver paste

Paper substrate *Circuit formed with silver paste

Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!

We would like to introduce the "Paper Substrate" handled by Sato-Sen Co., Ltd. It uses a special paper with high heat resistance and can be bent/folded. The line spacing is 200/200, and circuits are formed using silver paste. It offers good cost performance and is suitable for disposable applications. Please feel free to contact us when you need it. 【Features】 - Uses a special paper with high heat resistance - Can be bent/folded - Line spacing is 200/200 - Circuits are formed using silver paste - Good cost performance *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Paper and pulp products
  • substrate

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Double-sided flexible printed circuit board (double-sided FPC)

Double-sided flexible printed circuit board (double-sided FPC)

Double-sided type that allows for complex wiring.

This is an FPC with conductor patterns on both sides, allowing for complex wiring.

  • Printed Circuit Board
  • substrate

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Multilayer flexible printed circuit board (multilayer FPC)

Multilayer flexible printed circuit board (multilayer FPC)

High through-hole connectivity

This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.

  • Printed Circuit Board
  • substrate

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Pre-punched flexible printed circuit board (pre-punched FPC)

Pre-punched flexible printed circuit board (pre-punched FPC)

Flying lead structure

It is an FPC that can make electrical contact from both sides.

  • Printed Circuit Board
  • substrate

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Rigid Flexible Circuit Board (Rigid FPC)

Rigid Flexible Circuit Board (Rigid FPC)

Rigid substrates and flexible printed circuit boards are integrated.

It is an FPC that combines a rigid substrate and a flexible printed circuit board.

  • Printed Circuit Board
  • substrate

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Double Access Flexible Circuit Board (Double Access FPC)

Double Access Flexible Circuit Board (Double Access FPC)

The copper foil itself is the base without polyimide.

The copper foil itself is the base material of the FPC.

  • Printed Circuit Board
  • substrate

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Shielded Flexible Printed Circuit Board (Shielded FPC)

Shielded Flexible Printed Circuit Board (Shielded FPC)

Noise countermeasure structure

This is an FPC with a shield structure that is effective for noise countermeasures.

  • Printed Circuit Board
  • substrate

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Impedance control flexible substrate

Impedance control flexible substrate

Achieving high-frequency and high-speed transmission by matching the characteristic impedance.

This is an FPC that matches characteristic impedance and achieves high-frequency, high-speed transmission.

  • Printed Circuit Board
  • substrate

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Circuit board repair business matching site 'Circuit Board Repair Dot Com'

Circuit board repair business matching site 'Circuit Board Repair Dot Com'

A matching platform for connecting people who want their circuit boards repaired with those who can repair circuit boards.

Circuit Board Repair Dot Com is a matching platform that connects "clients who want to repair circuit boards" with "repairers who can fix circuit boards." We help resolve concerns such as, "Where should I request repairs?", "How long will the repairs take?", and "What will the repair costs be?" 【Clients】 Based on the estimated quotes received for their requests, clients can search for a suitable contractor. 【Repairers】 Repairers can efficiently search for projects that utilize their specialized knowledge and skills, gaining business opportunities.

  • Other electronic parts
  • Printed Circuit Board
  • substrate

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Function-Enhanced Semi-Automatic Observation Device TREMY plus

Function-Enhanced Semi-Automatic Observation Device TREMY plus

The camera automatically moves and displays enlarged images, supporting the visual inspection of difficult printed circuit boards.

The camera moves automatically or manually over the surface of the printed circuit board (PCB), allowing for imaging of the board and confirmation of enlarged images on the monitor. It enables visual inspection without missing any areas of the target work, including the entire surface and specific locations. It also supports the observation of circular workpieces, efficiently assisting on-site operations. The device is equipped with image storage and a simple measurement function. 【Features】 ■ Structure that does not require a computer ■ Touch panel that anyone can easily operate → Icons are simple and easy to understand ■ Supports visual inspection with features like overall inspection mode For more details, please contact us or download the catalog.

  • Defect Inspection Equipment
  • Circuit Board Inspection Equipment
  • Visual Inspection Equipment
  • substrate

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SHC-9600 series Hall Analyzer

SHC-9600 series Hall Analyzer

Perfect for verifying hole position accuracy!

Features 1. High-speed and high-precision inspection of hole diameter and hole position 2. Analysis of hole diameter and hole position is possible 3. Optimized for not only fully drilled substrates but also fully plated substrates!

  • NC unit
  • substrate

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Automated Device for Horizontal Conveying Equipment ACSys

Automated Device for Horizontal Conveying Equipment ACSys

Automated device for horizontal conveying equipment

Features 1. No teaching work required! Variety switching with only pad adjustment 2. Easy settings with dedicated touch panel operation 3. Compatible with everything from individual pieces to work sizes by switching the suction hand

  • Transport and handling robots
  • substrate

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Tank air vent foreign matter prevention filter

Tank air vent foreign matter prevention filter

We can provide proposals tailored to your site! If you are interested in foreign object countermeasures, please feel free to consult with us.

We would like to introduce our filter designed to prevent foreign substances from entering the air vent of tanks. We received inquiries from customers expressing concerns that "invisible foreign substances may be entering through the tank's air vent," which led us to design and manufacture this product. It successfully prevents the entry of fine powders. While there are products that use wire mesh to prevent insects from entering the tank's air vent, there are very few that can effectively block fine powders. As a result, this original product has received positive feedback from customers who handle fine powders. We can propose solutions tailored to your specific site, so if you are interested in measures against foreign substances, please feel free to consult with us. 【Features】 ■ Effectively prevents foreign substances, including fine powders ■ The main body is made of PVC and the filter is made of PP, making it lightweight and easy to install ■ Customizable proposals based on the customer's site *For more details, please refer to the PDF document or feel free to contact us.

  • filter
  • Other filters
  • substrate

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Tokai Electric and Electronic Design .COM

Tokai Electric and Electronic Design .COM

This is a website that serves as a bible for designing electronic circuit boards. It is filled with useful information for improving quality and reducing costs from the design stage.

If you are looking for development, design, and implementation of electronic circuit boards, please leave it to our homepage! We provide one-stop support for everything from development and circuit design to enclosure design, component procurement, implementation, assembly, and inspection. We cater to both analog and digital needs. In particular, we are especially confident in designing high-frequency analog circuits, which are essential for product development related to wireless and IP communication. Additionally, besides undertaking our own development, we also introduce excellent design and manufacturing companies with outstanding technology. Our services cover a wide range, including functional design, software design, hardware design, circuit board design, antenna design, simulation, circuit board implementation, assembly, circuit board manufacturing, harness processing, precision sheet metal processing, programming, and counterpoise verification, among others.

  • Circuit board design and manufacturing
  • EMS
  • substrate

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SAMBA head printing control board USB 3.0 communication specification version

SAMBA head printing control board USB 3.0 communication specification version

Printing control board for FujiFilm Dimatix's SAMBA head G3L. Ultra-fast USB 3.0 communication specification version.

Printing control board for FujiFilm-Dimatix SAMBA Head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Print speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second print data transfer when connecting one board to USB. * Print memory: 1GB equipped. Next print data can be transferred during printing. - Maximum ejection cycle: 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Configurable as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Printing control software that makes system construction easy is also provided. * User application DLLs can be supplied. - Ink circulation pump available for SAMBA head.

  • Other process controls
  • substrate

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Ricoh GEN6 head drive control USB 3.0 communication (up to 200MB)

Ricoh GEN6 head drive control USB 3.0 communication (up to 200MB)

Printing control board for Ricoh GEN6 head. Control data communication USB 3.0 (up to 200 MB). Capable of handling different print data at 10 sheets per second.

Printing control board for Ricoh GEN6 head and CMYK color printing control software. Control data communication via USB 3.0 (up to 200 MB). Capable of receiving the next printing data during printing. Can handle different printing data at 10 sheets per second for each print. Even if the "address, product name, name," etc. differ for each print, a printing speed of 60 m/min is possible. Basic Information: 1. The head control and drive AMP for GEN6 consist of two boards. * The connection between the head control board and the drive AMP board can be extended. * Head temperature and board temperature can be measured. 2. Full specification control and drive of GEN6 is possible. 3. Printing data and control use USB 3.0 (up to 200 MB). * As of 2020, this is the fastest in the industry. * Capable of receiving the next printing data during printing. * Can handle different printing data at 10 sheets per second for each print. ⇒ Different printing data is possible even at a printing speed of 60 m/min. * Data communication speed varies depending on the number of computers or boards. 4. Maximum ejection cycle of 50 kHz. Can be synchronized with the transport system encoder. 5. Printing data can use BITMAP data. 6. There is software for generating head drive waveforms.

  • Other FA equipment
  • substrate

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Low Noise Amplifier

Low Noise Amplifier

With abundant knowledge and experience, along with the technical capabilities of a connector manufacturer, we will meet our customers' demands!

At Stack Electronics, we manufacture all customer-specific "Low Noise Amplifiers" (LNA). The electrical performance is based on extensive knowledge and experience, while the shape and structure maximize the technical capabilities of connector manufacturers. We provide products that match our customers' requirements. 【Features】 ■ Electrical performance and connectors can be customized (TNC/N/SMA) ■ Compatible from VHS to SHF ■ Structure can include dust and water resistance measures ■ Power supply can be applied to the power terminal or superimposed on the input/output signal lines *For more details, please refer to the PDF materials or feel free to contact us.

  • Other network tools
  • Other image-related equipment
  • substrate

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Composite Material MMC for Solar Cell Manufacturing Equipment

Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials
  • substrate

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High-quality alumina substrate

High-quality alumina substrate

Birth of a substrate utilizing new materials.

■Low surface roughness ■High bending strength ■Low dielectric loss ■Dense

  • Printed Circuit Board
  • substrate

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts
  • substrate

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[Useful Information] Alumina Alternative Composite Material SA701

[Useful Information] Alumina Alternative Composite Material SA701

To customers struggling with large alumina parts - that problem can be solved with ceramic composite materials.

With the expansion of the semiconductor manufacturing equipment market, procurement issues related to ceramics have arisen. In particular, large alumina components have limited suppliers, and extended lead times are impacting equipment development schedules. The ceramic-metal composite material SA701 has slightly lower Young's modulus and bending strength compared to alumina, but it has high fracture toughness and is less prone to cracking, making it easy to handle. Its density is about 3/4 that of alumina, and it can be machined for direct threading, eliminating the need for metal bushings and enabling weight reduction. We encourage you to consider the adoption of metal-ceramic composite materials, which excel in producing larger components compared to alumina. *For more details, please refer to the materials available for download via the PDF button. We also welcome any questions or inquiries through the contact button.*

  • Other metal materials
  • Ceramics
  • Fine Ceramics
  • substrate

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[Design Examples and Technical Introduction] High-Frequency Solutions

[Design Examples and Technical Introduction] High-Frequency Solutions

Providing circuit boards with high simulation reproducibility by combining low dielectric loss alumina substrate manufacturing technology, high-precision patterning technology, and design and evaluation techniques.

In the millimeter wave and terahertz wave regions used in Beyond 5G (6G), low-loss substrate characteristics and fine patterning technology are required. In addition to the manufacturing technology of low dielectric loss ceramic substrates that we have cultivated over many years, high-precision patterning technology, and design technology that meets customer requests, we have also become capable of simulation and measurement at high frequencies. As a result, we can provide high-frequency circuit substrates with high reproducibility in simulations. Please feel free to consult us with any requests or questions, such as "I want this kind of passive component." We will solve problems with our technological development capabilities and comprehensive strength that only a substrate manufacturer can provide.

  • High frequency/microwave parts
  • substrate

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