substrate Product List and Ranking from 580 Manufacturers, Suppliers and Companies

"K2 Printed Circuit Board Manufacturing" Same-day delivery available

Equipped with the necessary facilities for substrate manufacturing, we provide integrated production in-house. "All types of substrates" delivered in a short lead time.

Our company possesses a wide range of equipment necessary for circuit board manufacturing, including "copper plating," "gold plating," "impedance measuring instruments," "impedance simulation software," and "resin filling machines." We can produce all types of circuit boards in-house and, through thorough delivery management, we are capable of offering "same-day delivery" for short lead times. 【Features】 ■ Capable of handling medium lot sizes ■ Significant lead time reduction for flexible circuit boards ■ Quick response for repeat orders ■ Capable of handling special circuit boards *For more details, please refer to the materials. Feel free to contact us as well.

Company：ケイツー
Price：Other

Printed Circuit Board
substrate

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Have you ever struggled with short delivery times in circuit board manufacturing?

Free express delivery! We can respond to short delivery times through in-house integrated production and thorough deadline management.

Our company is fully equipped with all the necessary facilities for substrate manufacturing, including copper plating and gold plating, allowing us to respond to short delivery times through in-house integrated production. Furthermore, with our unique in-house production management system, we ensure thorough deadline management, eliminating any gaps in the process and ensuring that all products are completed on time. Additionally, as a prototype substrate manufacturer, we have a large production line capacity, enabling us to complete medium lot products in a short timeframe. [Reasons for Achieving Short Delivery Times] ■ All equipment is in-house ■ Operations on Saturdays ■ Quick repeat orders *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイツー
Price：Other

Other electronic parts
Other services
substrate

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Are you paying unnecessary initial costs in substrate manufacturing?

Significant cost reductions are possible in small lot production of flexible printed circuit boards! We also support medium lot production.

Our company has achieved coverlay processing and contour processing of flexible substrates using lasers with our unique know-how. As a result, we can significantly shorten the manufacturing lead time for flexible substrates and reduce initial costs substantially by offering "mold costs free of charge." It is also possible to make corrections for each substrate, ensuring very high processing precision. [Overview] ■ Significant cost reduction through laser processing ■ Supports medium lot production of flexible substrates *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイツー
Price：Other

Other services
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Have you ever been betrayed by the quality in circuit board manufacturing?

We prevent troubles before they occur with our manufacturing know-how through in-house integrated production!

Our company has all manufacturing lines in-house, so our experienced staff are well-versed in each piece of equipment. High quality is essential to achieve short delivery times and special substrates. By conducting daily inspections and maintenance on each piece of equipment, we can prevent problems before they occur. Additionally, thorough intermediate inspections, such as pattern inspections using AOI (Automated Optical Inspection) and continuity checks with flying checkers, allow us to detect issues early in the process, preventing the outflow of defective products and delays in delivery. 【Quality Improvement Equipment】 ■ DI (Direct Imaging) ■ AOI (Automated Optical Inspection) ■ Flying Checker *For more details, please refer to the PDF document or feel free to contact us.

Company：ケイツー
Price：Other

Other contract services
substrate

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Extensive track record! Meiko soldering dedicated robot LETHER series.

A breakthrough in the difficult implementation that had given up on reducing manpower and automation! Development of a soldering robot. Achieving both tact and quality!

Generally, commercially available soldering robots are not specifically designed for soldering from scratch. In contrast, Meiko established expertise in soldering with robots over 30 years ago and developed dedicated robots specialized for soldering through unique hardware and software development.

Company：KYONI CO.,LTD. tokyo,kanawgawa,chib,gunma,yamagata,nagoya,shanghai
Price：1 million yen-5 million yen

Soldering Equipment
SCARA Robot
Printed Circuit Board
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A lineup of "Rework Systems" that covers everything from large substrates to extremely small components.

【Parts Repair/Repair/Reimplementation】Rework System "Covers all SMT components with one machine," "Supports large PCBs," "Easy setup," and other diverse features.

For rework systems, choose Denon equipment. Our company offers a range of "rework systems" for SMT components such as BGA, CSP, QFN, connectors, and sockets. We have a variety of models equipped with diverse functions that can cover all SMT components with a single unit, products that support ultra-small components (0402/0603 size), and products that can heat evenly from both the top and bottom with high-efficiency heaters. We support QFN, CSP, BGA, SMT, and 0402! We are currently offering a free product catalog for rework equipment. 【Product Lineup】 ■ "RD-500V" that covers various SMT components with one unit ■ "RD-500SV" that allows advanced profile settings with just one click ■ "RD-500 III" that supports large boards of 500×600mm ■ "RD-500S III" that uses a high-efficiency high-power heater 【Applications】 - Tablets - Computer boards - Mobile phones - Smartphones - Wearables - BGA, CSP, POP, QFN, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：デンオン機器
Price：Other

Circuit board processing machine
Other processing machines
substrate

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Shinko Photo Service - Introduction to Business Activities - Printed Circuit Boards

It is a high-quality product that has gained trust from major electrical manufacturers.

We manufacture a wide variety of printed circuit boards, including single-sided boards, double-sided boards, flexible boards, and multilayer boards. With a wealth of experience in printed circuit board manufacturing and high technology, we produce them quickly. We also accept orders for printed circuit board pattern design (digital, analog, high frequency) and assembly (QFP, QFN, BGA). Orders can be placed for either design or assembly, starting from just one piece. One of the features of Shinko Photo Service Co., Ltd. is the abundance of materials we handle for printed circuit boards. We always keep stock on hand and respond quickly to orders. Of course, we can also procure materials upon request. Shinko Photo Service Co., Ltd. manufactures various types of printed circuit boards, including high-frequency boards and fine pattern boards. In addition to what is introduced, we also provide processing tailored to customer requests. We are equipped with machinery capable of handling everything from design to manufacturing of printed circuit boards, including high-frequency boards and thin boards. With our extensive facilities and experienced technicians, we produce high-quality printed circuit boards. For more details, please contact us.

Company：伸光写真サービス
Price：Other

Printed Circuit Board
substrate

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Precision Sheet Metal and Press Processing Case Study 2 *Production Case Collection Currently Available

We are releasing examples of precision sheet metal and press processing! A collection of processing examples such as cutting, bending, and welding of ferrous and non-ferrous metals is available as a gift.

A collection of processing examples for steel and non-ferrous metals, including cutting, bending, and welding, is available as a gift. ■ Processing Example 2 Enclosure for program timer SECC t1.0, painted (laser satin), silk screen printing ■ Processing Details NCT, laser, bending, degreasing, painting, silk screen *For more details, please download the PDF.

Company：横手製作所
Price：Other

Processing Contract
substrate

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Prototyping of electronics application boards and devices is fast!

We can provide services such as design and parts procurement in-house!

We offer design services (circuit development, board design, software development, mechanical and structural design, packaging design), parts procurement (procurement routes from over 200 domestic and international companies, abundant stock of general electronic components and semiconductors), and manufacturing services (in-house board assembly equipment, a consistent line from device assembly to finished products, and a flexible line for small lot prototypes to mass production). We also provide various resin coatings, fillings, and sealings for electronics boards that are essential for outdoor use and water-related applications, including moisture-proofing, vibration-proofing, dust-proofing, and rust-proofing. For more details, please contact us or refer to our catalog.

Company：アール・ティー・シー
Price：Other

Circuit board design and manufacturing
substrate

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VME BUS clock generation board

Provides the host computer with accurate time without any time lag.

Microsemi's Truetime TTM-635 and Spectracom's Bancomm bc635VME board are compatible with the above two discontinued products. For details, please refer to the catalog.

Company：Solid Solutions Inc.
Price：Other

Other electronic parts
substrate

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Servo-type Powder Molding Machine Core Type

High-speed, high-precision, clean molding machine

We provide high-speed, high-precision, and clean molding machines manufactured in Taiwan at a reduced cost to our customers.

Company：歐帝雅科技
Price：5 million yen-10 million yen

Powder Molding Machine
Inductor Coil
substrate

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Introduction of the porous product lineup *Available for short delivery times!

Introducing porous products such as glass film suction plates, precision floating tables, and precision porous chucks!

This is an introduction to the "porous products" handled by P.D.W. Starting with the "precision floating table," which can process and transport glass substrates and films with high precision and non-contact, we also offer products such as the "circular precision porous chuck," which maintains suction fixation without shifting the workpiece even during cutting operations. Our company challenges the limits of precision with high-quality natural stone, responding to precision requirements of 1/1000 millimeter units. 【Product Lineup】 ■ Precision Floating Table ■ Precision Chuck Table ■ Precision Porous Chuck ■ Glass Substrate Suction Plate ■ Circular Precision Porous Chuck 【Our Features】 - We always keep stock of stones in the 5000×3000 class, enabling us to respond to short delivery times through integrated production from cutting to product completion. - We guarantee flatness, parallelism, and perpendicularity precision values that meet customer needs. - We provide modifications, repairs, and maintenance for stone products. *For more details, please refer to the PDF materials or feel free to contact us.

Company：ピー・ヂー・ダブリュー
Price：Other

Other semiconductor manufacturing equipment
Other processing machines
Other conveying machines
substrate

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Precision porous chuck *Partial adsorption (fixing) is possible

No need to replace the chuck to fit the work size! Adopts a porous ceramic plate with uniform pores. Proven performance of 2000 × 1000 as well.

We sell precision porous chucks that achieve stable adsorption by using porous ceramics. They have high wear resistance and heat resistance, and there is no dust generation from the porous ceramics. Additionally, with a pore diameter of 2μm, they have partial adsorption capability and can uniformly adsorb thin glass and films without deformation. There is no need to replace the chuck for each workpiece size. This product can be manufactured in the required size. Please feel free to contact us. 【Features】 ■ Uses a porous ceramic plate with uniform pores ■ High wear resistance and heat resistance, with no dust generation from the porous ceramics ■ Partial adsorption capability with a pore diameter of 2μm ■ Uniform adsorption of thin glass and films without deformation ■ Partial adsorption is possible / one adsorption plate is sufficient ■ Can be manufactured in the desired size *For more details, please refer to the PDF document or feel free to contact us.

Company：ピー・ヂー・ダブリュー
Price：Other

Other processing machines
Contract manufacturing
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PDW Corporation General Catalog

High-precision products created by the craftsmanship of skilled artisans. We provide a clear introduction using numerous photos.

This catalog is a comprehensive catalog of our company, which engages in the development, design, and manufacturing of system equipment, as well as the manufacturing and sales of precision stone products such as granite slabs, stone jigs, stone machine bases, and precision stone sliders, along with precision transport. It includes information on machining, lapping processing, inspection, and precision porous chucks. We challenge the limits of precision and respond to demands for accuracy at the 1/1000 millimeter level. If you are interested, please feel free to consult with us. [Contents (excerpt)] ■ Machining ■ Lapping processing and inspection ■ Assembly ■ Precision contract processing ■ Precision porous chucks *For more details, please refer to the PDF document or feel free to contact us.

Company：ピー・ヂー・ダブリュー
Price：Other

Processing Contract
Contract manufacturing
Other contract services
substrate

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Printed Circuit Boards for LEDs Achieving High Brightness and High Heat Dissipation

High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. We offer a lineup that includes "high heat dissipation metal printed circuit boards," "high brightness and high heat dissipation reflector printed circuit boards," "high heat dissipation multilayer printed circuit boards," and "high heat dissipation thick copper printed circuit boards." [Required Technical Elements] - We propose high-reflective solder resist and reflector processing techniques to achieve high brightness. - We offer high reflection rate Au and Ag plating techniques unique to companies that have emerged from plating. - For heat dissipation technology, we propose heat dissipation CEM3 and heat dissipation FR4 starting from metal printed circuit boards. For more details, please contact us or download the catalog.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Frequently Asked Questions about Printed Circuit Boards

Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.

At Sato-sen Co., Ltd., we provide high-quality printed circuit boards that meet the increasing demands for high functionality and high precision. We offer solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Here are some frequently asked questions regarding printed circuit boards: 【Production Related】 - Design: Supports DXF, DWG, and COB++, compatible with OrCAD Capture and BSchl. - Delivery Time: Can accommodate short delivery courses and can also shorten delivery times after ordering. - Quantity: Capable of producing even a single board. - Cost: Can reduce initial costs as we can handle everything from prototypes to mass production. - UL: UL compliant as we are a UL certified factory. For more details, please contact us.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Technical Introduction: "Circuit Formation (High-Density and Fine Processing Technology)"

Introducing circuit formation technology! A method to improve the positional accuracy of patterns on both sides.

Sato-sen Co., Ltd. offers multilayer printed circuit boards with high density, IVH, BVH, and buildup, providing design flexibility. We ensure improved hole position accuracy with ultra-high-speed micro-diameter drill machines, high-density circuit formation (L/S = 30/30) using LDI (Laser Direct Imaging), and stable quality multilayer printed circuit boards through X-ray reference hole drilling and X-ray length measurement. 【Features】 - Flat plugs (pad on via) allow for mounting on through holes. - Landless through holes enable support for narrow pitch patterns. - CCD technology enhances the precision of pressing, routing, and V-cut to match the pattern position (±75). - Ultra-fine printing is possible (1 character measuring 0.28mm vertically x 0.15mm horizontally). Please contact us for more details.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Technical Introduction: "Bonding Silver Plating (High Brightness and Heat Dissipation Technology)"

Introducing bonding silver plating technology! Electroless silver plating is possible.

Sato-sen Co., Ltd. is capable of performing silver plating that can be deposited without electrolysis. We offer optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, which can reduce discoloration due to thermal degradation during assembly and use. We provide reflector processing for high brightness and optimal surface treatment for LED wavelengths. We also propose various heat dissipation measures to lower the junction temperature of the chips. 【Features】 - Outline processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation is possible with heat sink pins inserted into through-holes. For more details, please contact us.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Technical Introduction: "Miniaturization (Miniaturization and Slimming Technology)"

Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.

At Sato-Sen Co., Ltd., we offer integrated rigid-flex printed circuit boards that utilize flexible substrates for multilayer boards, enabling miniaturization and cost reduction, including assembly. By adopting rigid-flex technology, we can reduce the number of printed circuit boards, leading to smaller finished products, and eliminate the soldering process for flexible printed circuit boards, thereby reducing assembly space. This also helps to minimize noise caused by antenna effects in flexible sections and reflections at connection points, as seen in traditional designs. **Features of Miniaturization with Rigid-Flex Printed Circuit Boards:** - Pins are inserted into through-holes and soldered, enhancing strength. - The flexible connection between rigid boards is embedded in the inner layers, providing noise prevention benefits. - Flexible materials are incorporated into the inner layers, eliminating the need for soldering and streamlining the process. For more details, please contact us.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Introducing dust prevention technology for printed circuit boards! There are mass production results for optical systems thanks to dust collection technology.

At Sato-Sen Co., Ltd., we generally recommend dust-free router processing for the outer shape processing of optical devices that are sensitive to dust. Sato-Sen Co., Ltd. has a proven track record in mass production for optical systems through the optimization of router programs and dust collection technology during and after processing. 【Dust Prevention Technology】 - High-precision punching equipment and mold processing - Special mold heat treatment and surface treatment - High-precision assembly technology ⇒ Achieving finishes that closely rival traditional press molds with router processing. For more details, please contact us.

Company：サトーセン
Price：Other

Printed Circuit Board
substrate

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Paper substrate *Circuit formed with silver paste

Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!

We would like to introduce the "Paper Substrate" handled by Sato-Sen Co., Ltd. It uses a special paper with high heat resistance and can be bent/folded. The line spacing is 200/200, and circuits are formed using silver paste. It offers good cost performance and is suitable for disposable applications. Please feel free to contact us when you need it. 【Features】 - Uses a special paper with high heat resistance - Can be bent/folded - Line spacing is 200/200 - Circuits are formed using silver paste - Good cost performance *For more details, please refer to the PDF document or feel free to contact us.