Substrate "High Heat Resistance and High Thermal Conductivity Insulating Resin Substrate"
A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!
The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.
- Company:TSS
- Price:Other