We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1021～1050 item / All 1904 items

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Substrate for SAW devices, roughened backside

Substrate for SAW devices, roughened backside

Ultra-precise blasting processing for wafers! Easy operation, effective as a noise countermeasure from the backside.

We would like to introduce our product, "Backside Roughening Substrate for SAW Devices." It supports wafer sizes of Φ4 and 6 inches and uses fine grinding materials of approximately #1000. The processing is fully automated by simply setting the workpiece at the front of the main unit. The roughness can be specified within the range of Ra0.1 to 1μm. This product addresses issues such as the tendency to crack and break, long processing times on grinding machines, and high running costs. 【Features】 ■ Supports wafer sizes of Φ4 and 6 inches ■ Uses fine grinding materials of approximately #1000 ■ Fully automated processing with easy operation by simply setting the workpiece at the front of the main unit ■ Roughness can be specified within the range of Ra0.1 to 1μm

  • Other processing machines
  • Processing Contract
  • substrate

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Maruichi High-Tech Co., Ltd. Business Introduction

Maruichi High-Tech Co., Ltd. Business Introduction

Leave your printed circuit board needs to us!

Maruichi High-Tech Co., Ltd. is engaged in the manufacturing of printed circuit boards. We have established a production line that can meet delivery deadlines by stabilizing quality and product precision, maintaining excellent cost performance through automation, and reducing changeover time by streamlining the setup process. Primarily focusing on single-sided and double-sided boards, we offer a wide range of multilayer boards and metal boards tailored to our customers' diverse needs. 【Products Offered】 ■ Single-sided boards ■ Double-sided boards ■ Multilayer boards ■ Aluminum boards ■ PCB assembly *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Contract manufacturing
  • Processing Contract
  • substrate

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Universal LCD LED backlight power supply board

Universal LCD LED backlight power supply board

Kenik System original LED backlight power supply board

The "KSLBC-3" is an LED backlight power supply board that supports up to 6 strings. 【Features】 - It can simultaneously light up and dim up to 6 strings of LEDs. - ON/OFF and brightness adjustments can be easily set using a general-purpose microcontroller. - It uses devices with built-in overvoltage protection, so even if an LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Kyocera high-brightness LED LCD backlight power supply board

Kyocera high-brightness LED LCD backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-3(K2)" is an LED backlight power supply board for high-brightness LCDs manufactured by Kyocera. 【Features】 - It can be easily configured using a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Densitron SVGA LCD LED backlight power supply board

Densitron SVGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-3(D1)" is an LED backlight power supply board for SVGA LCDs made by Densitron. 【Features】 - It can be easily configured using a general-purpose microcontroller for ON/OFF and brightness adjustments. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Densitron SVGA, VGA LCD LED backlight power supply board

Densitron SVGA, VGA LCD LED backlight power supply board

This is the original LED backlight power supply board from Kenik System.

The "KSLBC-4(D4)" is an LED backlight power supply board for SVGA and VGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses devices with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.

  • controller
  • substrate

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Flexible Printed Circuit (FPC) Catalog

Flexible Printed Circuit (FPC) Catalog

A wide range of products including single-sided FPC, double-sided FPC, and flex-rigid are featured.

The "Flexible Printed Circuit (FPC) Catalog" is a catalog that widely introduces high-quality FPC products nurtured by Okiden Cable in a clean environment. The feature of Okiden Cable's Roll to Roll (RtoR) line is its ability to handle both single-sided and double-sided FPCs. All equipment is installed in a clean room with management considerations for dust prevention. [Contents] ■ Okiden Cable's FPC Product Concept ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • substrate

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Multilayer Flexible Printed Circuit (Multilayer FPC) "Ultra-thin Flexible Multilayer FPC"

Multilayer Flexible Printed Circuit (Multilayer FPC) "Ultra-thin Flexible Multilayer FPC"

Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.

The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Flexible Printed Circuit (FPC) "Transparent FPC"

Flexible Printed Circuit (FPC) "Transparent FPC"

Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!

"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Printed Circuit Board Manufacturing - Build-Up Boards

Printed Circuit Board Manufacturing - Build-Up Boards

We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

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  • Printed Circuit Board
  • substrate

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Kyoden Co., Ltd. Business Introduction

Kyoden Co., Ltd. Business Introduction

Kyoden Group that "shapes ideas."

At Kyoden Group, we solve various product development challenges faced by our customers through a fully in-house integrated approach. By providing consistent support from the development stage for custom parts that make up products such as circuit boards, enclosures, and mechanical components, we pursue added value for products and offer a "fully in-house one-stop solution" that is unmatched by other companies. For more details, please contact us or download the catalog.

  • Other electronic measuring instruments
  • substrate

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FPGA board development and manufacturing solutions

FPGA board development and manufacturing solutions

Support for the development and manufacturing of various boards utilizing FPGAs! Supporting each development phase.

Our company supports various development phases such as circuit design, AW, SI/PI, component procurement, and enclosure design. Utilizing our own PCB manufacturing and assembly factories, we can provide total support, including the production phase. 【Features】 ■ Proposals aimed at improving reliability - Adoption of back drilling methods - Utilization of test coupons ■ Integrated production at our own factories *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

Verification of 0603/0402 capacitor mounting on lead-free leveler substrate.

By setting the appropriate pad dimensions, it is possible to support small-sized chip mounting!

Multilayer ceramic capacitors (MLCCs) are facing a challenging situation in procurement due to increased demand from smartphones and a rapid rise in automotive demand. In this tight supply-demand environment, MLCC manufacturers are promoting a shift from larger sizes (1608 and above) to smaller sizes (0603 and 0402) to increase supply capacity. This document introduces the "Verification of 0603/0402 Capacitor Mounting on Lead-Free Leveler Boards." We encourage you to read it! *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate

Corresponding to the 'density' of components! High-frequency build-up substrate.

What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.

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  • Printed Circuit Board
  • substrate

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We undertake everything from printed circuit board production and prototyping to mass production!

We undertake everything from printed circuit board production and prototyping to mass production!

Quality is our top priority!

Before the factory shipment of printed circuit boards, we conduct pre-shipment inspections of all printed circuit boards at Core System Co. to ensure high and stable quality of the products delivered to customers.

  • Contract manufacturing
  • substrate

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Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Electroless copper plating equipment for semiconductor and printed circuit board horizontal manufacturing.

Supports everything from single-sided substrates to flexible substrates using Roll to Roll!

This is a machine for electroless copper plating for substrate manufacturing. With optimal spray configuration, uniform plating can be achieved even inside blind vias and high aspect ratio through holes. Since it operates with horizontal transport, automation is possible from input to output. 【Features】 ◆ Plating is possible without the need for electrical conductivity, even on non-conductive materials. ◆ When combined with our various products, circuit widths can be minimized to 25μm. = For more details, please contact us =

  • Other surface treatment equipment
  • Other machine tools
  • substrate

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Mounting Machine "RX-8" (SMT Surface Mount Machine)

Mounting Machine "RX-8" (SMT Surface Mount Machine)

A high-speed modular mounter that achieves a throughput of 100,000 CPH! It offers top-class area productivity with a dual-head mounter!

The SMT (Surface Mount Technology) high-speed compact modular mounter 'RX-8' boasts a maximum throughput of 100,000 CPH and features a compact design of 998mm. Equipped with a high-precision planet head, it is perfect for the production of ultra-small chip components and small ICs, as well as products that require high-density mounting and precision, such as LED edge lights. 【Features】 - The 998mm compact design achieves high-efficiency production with class-leading area efficiency. - Compatible with 0201 chips and flexible substrates. - Capable of detecting front-and-back inversion, chip standing inspection, and component presence detection. - Automatic suction position correction function automatically adjusts and corrects the suction position of components. *For more details, please refer to the PDF document or feel free to contact us.

  • Mounter
  • substrate

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High-frequency substrate "Caflon"

High-frequency substrate "Caflon"

A super low loss of 0.00045 can be achieved at 18GHz.

Polifron Corporation has developed high-frequency substrates that utilize the properties of PTFE through its unique technology. This high electrical characteristic cannot be achieved with other substrates. By using high-purity PTFE with a dielectric constant of "2.1" as the dielectric material, an ultra-low loss of 0.00045 at 18GHz can be realized. 【Features】 ○ Ultra Low Loss ○ Very Low Dk ○ Isotropic Properties For more details, please contact us or download the catalog. *This catalog is in English.

  • Printed Circuit Board
  • substrate

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Control board Input/Output Universal IHP/04011ASS

Control board Input/Output Universal IHP/04011ASS

A universal card is provided so that you can freely create circuits and conduct experiments.

Create and experiment with circuits freely! Universal prototype board equipped with a 3.3V power circuit. ■□■Features■□■ ■ The onboard 3.3V power supply allows you to immediately configure 3.3V circuits. ■ Compact card size (50mm x 30mm) *excluding connectors ■ General-purpose 2.54mm pitch 0.8mm through-holes (18 columns, 9 rows) ■ 5V input → equipped with a 3.3V power circuit ■ Adopts Mi II wiring system * A crimping punch is required for connections with this product. ■ For other functions and details, please download the catalog or contact us.

  • Printed Circuit Board
  • substrate

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Printed circuit board

Printed circuit board

For high-frequency applications, from design to manufacturing and component assembly of printed circuit boards. High-speed FPGA boards ensure stable operation.

If you are experiencing issues such as instability caused by the printed circuit board, please feel free to consult us. So far, all designs from our company have been operating stably.

  • Circuit board design and manufacturing
  • substrate

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

One-stop support for miniaturization and modularization of circuit boards using bare chip mounting, from concept to mass production!

We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. 　Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.

  • Circuit board design and manufacturing
  • substrate

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PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit

PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit

A flexible fabric ribbon sensor incorporates "piezoelectric sensors" and "capacitive sensors." Dual sensing enhances detection accuracy and creates added value.

The "PICLIA Piezo Cable Sensor" and "Capacitive Sensor" are integrated into a single fabric-like ribbon. This flexible and soft ribbon sensor offers high durability and can perform dual sensing with two types of sensor outputs. It can be utilized in applications for monitoring and health monitoring in areas such as "wearable devices, medical and nursing care, automotive, toilets, railways and aircraft, cinemas and amusement facilities." 【Features】 ◆ Flexible and soft "fabric-like ribbon sensor" ⇒ Provides a comfortable touch even when directly contacted, while maintaining high durability in actual use. ◆ Built-in "piezoelectric sensor" and "capacitive sensor" ⇒ Enhanced detection accuracy through composite sensing and creation of added value. ◆ "Piezoelectric sensor"… detects biological information (heart rate, respiration, body movement), etc. ⇒ Vital sensing is possible even through clothing, with a differential response (responds only when "changes" occur). ◆ "Capacitive sensor"… detects the presence of objects through changes in capacitance. ⇒ Capable of distinguishing between people and objects. ◆ No power supply needed for the sensors, as they generate power through self-generation ⇒ low power consumption.

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  • Sensors
  • Piezoelectric Devices
  • substrate

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Introduction from circuit and software design to board design and board manufacturing.

Introduction from circuit and software design to board design and board manufacturing.

We will respond with a consistent system from upstream circuits and software design to circuit board manufacturing!

Nihon Circuit Co., Ltd. will assist you from the development of prototype products to mass production design and manufacturing. Depending on your requirements, we can develop system design, circuit design, PCB design, PCB manufacturing, mechanical, structural, and enclosure design and manufacturing, embedded software and applications, FPGA programming, as well as evaluation and inspection all in-house. Additionally, even in the absence of specifications, we can consider product specifications based on images (such as block diagrams or sketches). 【Features】 ■ Capable of mixed design of digital and analog circuits ■ A consistent system that covers everything from upstream circuit and software design to PCB manufacturing ■ Experience in designing high-frequency (tens of GHz) PCBs ■ Able to accommodate various PCB specifications and production quantities from a single prototype design and manufacturing to mass production design and manufacturing ■ We can also handle partial requests such as development (HW, SW), PCB design, and manufacturing only *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • substrate

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Taclum Plus board for MMIC implementation

Taclum Plus board for MMIC implementation

Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.

Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.

  • Other semiconductors
  • substrate

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Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.

  • Printed Circuit Board
  • substrate

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Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

High quality, short delivery time, low cost

Specialized in hole drilling with drills, contour processing with routers, and fine hole processing with lasers.

  • Processing Contract
  • substrate

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[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

Lens diffusion plates can be manufactured using various methods! Introducing a variety of manufacturing techniques!

Lens diffusion plates can be manufactured using various methods, but the most common method is the "roll-to-roll" process. This method offers many advantages such as uniform film thickness, high-precision transfer, and high-speed processing, making it stable and cost-effective. We introduce various manufacturing methods, starting with the "roll-to-roll" process. Please take a moment to read through it. [Contents] ■ Lens diffusion plates: Manufacturing methods and types of substrates for LSD *For more details, please refer to the PDF document or feel free to contact us.

  • lens
  • substrate

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