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substrate - メーカー・企業31社の製品一覧とランキング

更新日： 集計期間:Jul 16, 2025～Aug 12, 2025
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substrateのメーカー・企業ランキング

更新日： 集計期間:Jul 16, 2025～Aug 12, 2025
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  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
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  5. 5 モリマーエスエスピー Osaka//Resin/Plastic 本社
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substrateの製品ランキング

更新日： 集計期間:Jul 16, 2025～Aug 12, 2025
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  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrateの製品一覧

526～540 件を表示 ／ 全 676 件

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High Thermal Conductivity Substrate "FGHP"

High Thermal Conductivity Substrate "FGHP"

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.

  • Board to Board Connectors

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Single-sided board / Double-sided board

Single-sided board / Double-sided board

Used in a wide range of fields as a general-purpose substrate! The interlayer connection of the double-sided board is formed by TH.

We would like to introduce the "single-sided and double-sided PCBs" handled by Matsuwa Sangyo Co., Ltd. These printed circuit boards have conductor patterns formed on one or both sides of an insulating board. They are widely used in various fields as general-purpose substrates, and the interlayer connections of double-sided boards are formed by TH (through-hole) technology. We offer materials such as FR-4, CEM-3, FR-1, halogen-free materials, high heat-resistant materials, aluminum materials, and low dielectric constant materials, with board thicknesses ranging from t0.1mm to t3.2mm. We also accommodate various copper foil thicknesses from 9μm to 175μm. 【Fastest Delivery Record】 ■ 1 layer ⇒ 1 day (data by 8 AM ⇒ same-day shipment) ■ 2 layers ⇒ 1.05 days (data by 8 PM ⇒ shipment the next day) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Multilayer substrate

Multilayer substrate

We have a manufacturing record of up to 22 layers, and we can accommodate various specifications for board thickness and copper foil thickness!

We would like to introduce the "multilayer circuit boards" handled by Matsuwa Sangyo Co., Ltd. These are formed by stacking multiple layers of insulation and conductor layers, resulting in printed circuit boards with three or more conductor patterns. The interlayer connections are formed by through-holes (TH) just like in double-sided boards, and we offer a variety of substrates including FR-4, halogen-free materials, high heat-resistant materials, and low dielectric materials. 【Shortest Delivery Record】 ■ 4 to 10 layers ⇒ Shipped on the 1.05th day (data by 8 PM ⇒ shipped the next day) ■ 12 to 14 layers ⇒ Shipped on the 1.1th working day (data by 4 PM ⇒ shipped the next day) ■ 16 to 18 layers ⇒ Shipped on the 2.1th working day (data by 4 PM ⇒ shipped the day after next) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Build-up substrate

Build-up substrate

Multi-stage builds, stackable vias, filled vias plating, all handled with in-house integrated manufacturing!

We would like to introduce the "Build-Up Substrate" handled by Matsuwa Sangyo Co., Ltd. After forming the core layer (2-layer through to multi-layer through), we sequentially laminate insulation layers and conductor layers one by one from the core layer to the surface layer, and perform interlayer connections using lasers to create a multilayer printed circuit board. By using laser vias (non-through vias) for interlayer connections, flexible wiring design is possible, and in recent years, the demand and applications for this have been increasingly expanding. 【Shortest Delivery Record】 ■ 4 layers (1-2-1) ⇒ Shipped on the 3rd day ■ 6 layers (2-2-2) ⇒ Shipped on the 4th day *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Impedance control compatible board

Impedance control compatible board

We propose appropriate line widths, clearances, and layer configurations during pattern design!

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Thick copper substrate

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Copper inlay substrate

Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Copper bump substrate

Copper bump substrate

Effective when it is required to make contact between the substrate pad and mounted components at a high position!

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Power assist control board and motor drive board

Power assist control board and motor drive board

Delivery examples

Delivery examples

  • Other process controls
  • Prototype Services
  • Circuit board design and manufacturing

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Printed circuit board

Printed circuit board

Leave your printed circuit board needs to us.

Our company produces a wide variety of printed circuit boards. We handle double-sided printed wiring boards, which are formed by applying conductor layers (copper foil) to both sides of an insulating material and etching the conductor layers to create circuits. We also produce multilayer printed wiring boards, where conductor patterns (circuits) are formed on copper-clad laminates using insulating materials such as prepreg made of glass epoxy resin, and these are laminated and bonded together to create a single board. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Double-sided printed wiring boards ■ Single-sided printed wiring boards ■ Multilayer printed wiring boards ■ Insect-resistant printed wiring boards *For more details, please contact us.

  • Printed Circuit Board

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Brewing wine aging substrate

Brewing wine aging substrate

It accelerates the aging of sake and wine in 5 to 10 minutes.

This is a brewing alcohol aging substrate for machine embedding. It emits special electromagnetic waves that act on liquids.

  • Printed Circuit Board

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3D Printed Circuit Board (Raw Substrate) Surface Inspection Device 'ATHENA'

3D Printed Circuit Board (Raw Substrate) Surface Inspection Device 'ATHENA'

For 3D measurement of various substrates. Inspections that eliminate errors caused by shadows are possible! We are also providing materials that introduce features and examples of defects detected from actual inspections.

"ATHENA" is a 3D printed circuit board surface inspection device that achieves high-precision detection of dents, bubbles, foreign objects, and more by rendering 3D images through moiré pattern projection. The new head type has been upgraded from the existing head using technology accumulated over several decades to enable the rendering of real images. By utilizing 12-way and 16-way projectors, in addition to the existing 8-way projector, inspections can be performed on various shapes of circuit boards without errors caused by shadows. You can view a document detailing various performance features, characteristics, and case studies available for PDF download. 【Features】 ■ Spacious design and convenient maintenance ■ Simple assembly and setup ■ 3D formation of high-density components and components in narrow spaces ■ 3D formation identical to real images ■ Improved repeatability accuracy *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit Board Inspection Equipment

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Communication equipment and circuit boards

Communication equipment and circuit boards

Supporting the realization of an IoT society with the capability to cover a wide communication range.

Our company handles communication devices and circuit boards. Leveraging wireless communication technology developed through mobile phones and other devices as our core technology, we support the realization of an IoT society with our capability to cover a wide range of communication from NFC to GNSS. Based on wireless communication technology that connects people and things, as well as things to things, we are also developing payment units that respond to the advancement of a cashless society, and products utilizing LPWA communication technology suitable for IoT, enabling high-frequency and low-power communication. 【Main Product Achievements】 ■ Wireless payment terminals for vending machines ■ POS terminals ■ Card timers / Card reader-writers / Image adapters ■ Energy storage system control circuit boards ■ NFC modules (compliant with EMV standards), etc. *For more details, please download the PDF or feel free to contact us. *Our company changed its name to LIMNO Corporation in January 2023.

  • 企業：LIMNO
  • 価格：Other
  • Communications
  • Circuit board design and manufacturing

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On-board equipment and circuit board

On-board equipment and circuit board

We handle control boards for vehicle batteries and vehicle LED units, among other products.

Our company provides high manufacturing quality globally based on design technology and manufacturing know-how aimed at achieving zero defects in automotive quality. We can offer high-quality products thanks to our capability to comply with the international standard for the automotive industry, "IATF16949," as well as our expertise in high-density mounting and mass production design technology. Please feel free to contact us if you have any requests. 【Main Product Achievements】 ■ Control boards for automotive batteries ■ Automotive LED units ■ Control units for construction machinery ■ Business operation management systems ■ CAN communication units for agricultural machinery *For more details, please download the PDF or feel free to contact us. *Our company changed its name to LIMNO Corporation in January 2023.

  • 企業：LIMNO
  • 価格：Other
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Other optical parts

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