We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  4. 4 JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  5. 5 共栄電資 Tokyo//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. [Exhibition Report] We exhibited at NEPCON Japan 2026! 太洋テクノレックス 本社　和歌山
  2. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社　和歌山
  3. [Notice_26.2] Regarding the Publication of Our Articles - Related to Space Business - 太洋テクノレックス 本社　和歌山
  4. 4 High-strength alumina substrate for thin films JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1051～1080 item / All 1904 items

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The importance of thermal management through substrate patterning.

The importance of thermal management through substrate patterning.

Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"

An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*

  • Circuit board design and manufacturing
  • substrate

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High-frequency substrate

High-frequency substrate

Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.

"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Example: Artwork for high-voltage circuit board + circuit board manufacturing

Example: Artwork for high-voltage circuit board + circuit board manufacturing

A case where we made proposals primarily to satisfy functionality, performance, and safety!

We would like to introduce a case where we conducted the artwork and manufacturing of a high-voltage circuit board. We received an inquiry from a customer developing a high-voltage circuit board for the first time, and we proposed the circuit board design values primarily from our side. In this case, there were no clearly defined standards to comply with, so we made proposals to satisfy functionality, performance, and safety, and after adjustments with the customer, we finalized the specifications. 【Outline Specifications】 ■ Output: Maximum AC/DC 5kV ■ Insulation Design: Between other blocks = AC2kV Between Low Voltage block and High Voltage block = AC4kV (to the extent possible) *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!

Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.

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  • モータドライバ、センシング基板4.png
  • Circuit board design and manufacturing
  • substrate

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Build-up substrate

Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • substrate

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Rigid-flexible substrate

Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing
  • substrate

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Handbook for Circuit Board Noise Countermeasures

Handbook for Circuit Board Noise Countermeasures

We support product development without setbacks by implementing noise countermeasures from the early design stage.

This document is a "PCB Noise Mitigation Handbook" for circuit designers, FPGA developers, and electronic device developers. It introduces the importance of GND, voltage drop, and the significance of "power/GND reinforcement" in relation to DC analysis and load variations. Additionally, it includes information on "impedance disturbances and countermeasures," such as the disruption of impedance and its solutions. [Contents] ■ Crosstalk suppression and isolation ■ Power/GND reinforcement ■ Impedance matching and equal-length wiring *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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What exactly is substrate-less?

What exactly is substrate-less?

Solving the heat dissipation problem of LEDs! New technology achieves board-less design.

"Board-less" refers to a technology that overturns the conventional concept of heat dissipation by enabling three-dimensional mounting without the use of printed circuit boards, thanks to MARBS (three-dimensional wiring technology), which ideally transfers heat to heat sinks. "MARBS" is a next-generation printed circuit board wiring technology that combines two technologies: "nano-level bonding technology" and "three-dimensional wiring technology." This technology allows for a high level of heat dissipation that was previously impossible with conventional boards, enabling flexible LED light distribution design and the direct formation of wiring patterns on curved metal substrates. 【Differences between MARBS and conventional boards】 - Enables a high level of heat dissipation that was previously impossible - Allows for flexible LED light distribution design - Enables direct formation of wiring patterns on curved metal substrates - Solves LED heat dissipation issues *For more details, please refer to the related link page or feel free to contact us.

  • Circuit board processing machine
  • Other processing machines
  • Wiring materials
  • substrate

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Flat Grinding System Continuous Mirror Polishing Machine

Flat Grinding System Continuous Mirror Polishing Machine

We will propose a polishing machine tailored to your needs!

This is an announcement from Nappu Industrial Co., Ltd. regarding the flat grinding system continuous mirror polishing machine.

  • Repair Agent
  • substrate

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"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

Building a consistent high-quality line! Introducing electronic material substrates with high reliability!

The "Alumina Thick Film Circuit Board" is an electronic material substrate with high reliability, where electrode materials and resistive materials are baked onto an alumina substrate that excels in heat dissipation and heat resistance. It is suitable for applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. Our company, in collaboration with our affiliated company "Ina Ceramic Co., Ltd.," produces and sinters alumina substrates, establishing a consistent high-quality line from circuit printing, firing, resistance value adjustment, component mounting, molding, to electrical testing. 【Features】 ■ Electrode materials and resistive materials are baked onto an alumina substrate with excellent heat dissipation and heat resistance ■ High reliability ■ A consistent high-quality line is established from circuit printing to electrical testing *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • substrate

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Substrate production - Printed circuit board

Substrate production - Printed circuit board

Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece.

Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece. Standard shipping for 4-layer PCBs is possible within 3 days. For more details, please contact us.

  • Circuit board design and manufacturing
  • substrate

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PC Cable Checker "Wire Box 64"

PC Cable Checker "Wire Box 64"

The check program makes instant judgments! Compact computer and cable checker.

The "Wire Box 64" is a PC cable checker that allows for low-cost and high-speed verification of complex multi-core connectors and cable connections using a computer. The main unit is compact and lightweight, fitting in the palm of your hand, and can quickly transform into a high-performance inspection device simply by combining it with a computer. All pin disconnections, short circuits, and connection errors are displayed simultaneously on the screen, enabling rapid judgment of good or bad conditions. 【Features】 ■ Compact ■ Easy operation ■ Data displayed all at once ■ Capable of determining the quality of special connections ■ Supports up to 128P when connecting two units *For more details, please refer to the PDF documentation or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • substrate

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[IH Soldering Case] Large Heat Capacity Substrate

[IH Soldering Case] Large Heat Capacity Substrate

A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.

We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.

  • 【IHはんだ付け事例】大熱容量基板2.PNG
  • Soldering Equipment
  • substrate

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Base - Printed Circuit Board

Base - Printed Circuit Board

We can implement any type of BGA or CSP without a mask. Wiring from BGA is also possible. We are open to any inquiries regarding the circuit board!

Prototype and modification of printed circuit boards. Fine pitch 0.3 can be mounted with manual work! We also respond to customers' requests for short delivery times! (Nighttime support available) Assembly is possible from just one piece! BGA and CSP can be mounted without a mask! (Any type is fine) We can also continue jumper wiring to pitch 0.5 with 100 wires! Wiring from BGA is also possible! We can reball and install BGA as well!

  • Printed Circuit Board
  • substrate

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[Example] Conductor Resistance Automatic Monitoring System (Continuity Resistance Monitoring)

[Example] Conductor Resistance Automatic Monitoring System (Continuity Resistance Monitoring)

Real-time analysis possible simultaneously with data collection! Original data collection and editing functions that reflect customer feedback. Hardware/software that is not limited to specific test chamber manufacturers.

- A system that can automatically monitor conductor resistance in conjunction with the test chamber. - Real-time analysis is possible simultaneously with data collection. - Standard number of channels: 192ch, using high-lifetime relay contacts rated for 100 million cycles (10V/100mA). - Control linked with testing equipment (thermal shock testing machine) is possible. - Adoption of high-temperature resistant custom measurement cables.

  • Environmental Test Equipment
  • Testing Equipment and Devices
  • Other inspection equipment and devices
  • substrate

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IoT Professional Designer Training Project

IoT Professional Designer Training Project

Introduction of a project that can train professional engineers from the beginner level.

"We need to implement IoT, but we don't have any engineers in the company." "There is no one to train engineers." "We lack the technical know-how to differentiate our products." For customers facing such issues, our 'IoT Professional Engineer Training Project' is ideal. This project consists of two steps, allowing us to train professional engineers from the beginner level. [IoT Professional Designer Training Project] ■ Engineer education services through courses ■ IoT technology consulting *For more details, please refer to the PDF document or feel free to contact us.

  • Technical Seminar
  • Business Skills Seminar
  • substrate

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"Hot Issue" Simple Diagnosis Service

"Hot Issue" Simple Diagnosis Service

We will consider services based on your concerns! We will diagnose thermal issues in the early stages of product development.

Our "Thermal Issue Simplified Diagnosis Service" diagnoses thermal issues in the early stages of product development. We predict product temperatures from the conceptual stage and report on the presence of thermal issues along with one-point advice. We provide feedback on the validity of product size and heat dissipation strategies (such as the necessity of fans) in the early design phase. Additionally, we also offer a "Design Value Calculation Service." 【Features】 ■ Response within 3 days ■ Predict product temperatures from the conceptual stage ■ Report on the presence of thermal issues and provide one-point advice ■ Feedback on the validity of product size and heat dissipation strategies in the early design phase ■ Avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Other contract services
  • substrate

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[Information] President's Blog April 2017 - March 2018

[Information] President's Blog April 2017 - March 2018

This article discusses the applications of wireless power transfer and the formation of engineer careers in the era of ultra-long lifespans!

This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from April 13, 2017, to March 30, 2018. It introduces various topics, including the need for experience and know-how in the design of wireless power transmission on April 13, 2017, the relationship between the number of engineers in design/development companies and business execution on July 18, 2017, and a solid follow-up on the progress of in-house development on October 3, 2017. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. [Published Content (Excerpt)] ■ April 13, 2017 - April 30, 2017 ■ May 8, 2017 - May 31, 2017 ■ June 1, 2017 - June 29, 2017 ■ July 4, 2017 - July 28, 2017 ■ August 4, 2017 - August 31, 2017 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Information] President's Blog April 2020 - August 2020

[Information] President's Blog April 2020 - August 2020

Requirements for Online Meetings - Contributions through WTI Technology!

This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from April 1, 2020, to August 21, 2020. It introduces the current situation as of April 21, 2020, and the increasing importance of technology, as well as what is required for the online meeting on May 7, 2020 – contributing with WTI's technology – and the announcement on July 17, 2020, that WTI has finally started disseminating information in English. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ April 1, 2020; April 21, 2020 ■ May 7, 2020; May 29, 2020 ■ June 12, 2020 ■ July 2, 2020 – July 31, 2020 ■ August 21, 2020 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] WTI Blog April 2017 - March 2018

[Data] WTI Blog April 2017 - March 2018

Reasons why WTI is chosen, including "technological capabilities," as well as information about optical communication and optoelectronic conversion devices!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from April 4, 2017, to March 27, 2018. The reason WTI was chosen on April 4, 2017, is due to its "technical capabilities," and it introduces topics such as optical communication and optoelectronic conversion devices from May 9, 2017, and types of packages from June 13, 2017. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. 【Contents (excerpt)】 ■ April 4, 2017 - April 25, 2017 ■ May 9, 2017 - May 30, 2017 ■ June 6, 2017 - June 27, 2017 ■ July 4, 2017 - July 25, 2017 ■ August 8, 2017 - August 29, 2017 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] WTI Blog April 2020 - August 2020

[Data] WTI Blog April 2020 - August 2020

Points to consider when creating embedded software and the importance of screws in waterproof design are featured!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development and Design Promotion Business" aimed at solving the shortage of engineers, from April 7, 2020, to August 25, 2020. It introduces various topics, including the short-circuit test of power devices on May 12, 2020, key points for creating embedded software on June 23, 2020, and the importance of screws in waterproof design on August 4, 2020. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. 【Contents】 ■ April 7, 2020 - April 28, 2020 ■ May 12, 2020 - May 26, 2020 ■ June 2, 2020 - June 30, 2020 ■ July 7, 2020 - July 28, 2020 ■ August 4, 2020 - August 25, 2020 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Information] It's Never Too Late to Ask! EMI Countermeasures: Filter Edition

[Information] It's Never Too Late to Ask! EMI Countermeasures: Filter Edition

Inductors and capacitors! Publishing know-how shared by our engineers.

This document introduces questions and answers about filters for EMI countermeasures. It includes know-how shared by our engineers regarding inductors and capacitors. It is a book that explains the concepts in an easy-to-understand manner. [Contents] ■#047 EMI Countermeasures - Filter (Inductor Part 1) ■#048 EMI Countermeasures - Filter (Inductor Part 2) ■#052 EMI Countermeasures - Filter (Capacitor Part 1) ■#053 EMI Countermeasures - Filter (Capacitor Part 2) *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Other electronic parts
  • substrate

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Professional Designer Training Project "Techno-Sherpa"

Professional Designer Training Project "Techno-Sherpa"

In an era of engineer shortages, engineers are shifting from "enhancement" to "co-creation"! Introduction of the professional designer training project.

We would like to introduce our "Techno-Sherpa." In our "Engineer Training Services," we support the development of practical engineers, including new graduates and non-electrical engineers, with a comprehensive technical education menu. Additionally, in our "Technical Consulting Services," we provide solutions to the technical challenges faced by our customers, including location detection technology, EMC countermeasures, waterproof enclosure design, and thermal/stress simulation. 【Engineer Training Services (Excerpt)】 ■ Basic Course in Electronic Circuits PLUS (2-day course) ■ Basic Course in Electronic Circuits (5-day course) ■ Power Electronics Course ■ Basic EMC Course *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • Technical Seminar
  • Other services
  • substrate

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Test malfunction countermeasure support service

Test malfunction countermeasure support service

Are you having trouble with measures against defects in your developed products, such as "waterproofing measures" or "EMI measures"?

This document introduces the support provided by Wave Technology Co., Ltd. It includes "Waterproofing Support," which allows for estimating the limits of waterproof measures, as well as "Vibration Testing Support," which addresses issues caused by vibrations during transportation and operation (actual usage conditions). Please feel free to download and take a look. 【Contents (excerpt)】 ■ Waterproofing Support ■ Temperature Cycle Testing Support ■ Vibration Testing Support ■ Drop and Impact Support ■ EMI Countermeasure Support *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Other services
  • Technical Seminar
  • substrate

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自社が注力すべき仕事以外は、設計会社の代行サービスを活用する時代

自社が注力すべき仕事以外は、設計会社の代行サービスを活用する時代

電波法認証 技術基準適合証明の事前評価 申請の代行／品含有化学物質調査・環境負荷物質調査の代行をさせていただきます。

当社では、『電波法認証技術基準適合証明（技適）の事前評価申請の代行』 『製品含有化学物質調査・環境負荷物質調査の代行』をさせていただきます。 製品開発で必要となる全ての設計部隊（電気、機構、基板、ソフト）が 揃っており、これらを一括で受託し社内で綿密に連携して設計を進めるため、 デザイン、コスト、性能などを最適化した製品に仕上げることが可能です。 また、位置検出、ワイヤレス給電、信号処理、画像認識、AIなど近年の 製品開発でニーズの多い要素技術についても社内外のネットワークを活用し 製品に組み込むことが可能です。 【特長】 ■製品開発のトータルコーディネートが可能 ■製品開発で必要となる全ての設計部隊揃っている ■一括で受託し社内で綿密に連携して設計を進める ■デザイン、コスト、性能などを最適化した製品に仕上げることが可能 ■社内外のネットワークを活用し製品に組み込むことが可能 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Other contract services
  • substrate

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[Data] Shirutoku Report No. 13 # Characteristic Impedance

[Data] Shirutoku Report No. 13 # Characteristic Impedance

The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.

★★Useful Information Report: Knowledge is Power★★ This report introduces the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it essential to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Prototype Services
  • substrate

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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*

  • Contract Analysis
  • Contract Analysis
  • Other analyses
  • substrate

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[Information] Shirutoku Report No. 75 # Technical Standards Compliance Certification (Giteki) Application

[Information] Shirutoku Report No. 75 # Technical Standards Compliance Certification (Giteki) Application

What should I prepare for the application for technical standards conformity certification? Information on necessary documents for the application is provided.

★★Shirutoku Report: Useful Information You Should Know★★ In this document, we would like to provide detailed information about "Technical Compliance" (Giteki), which has seen an increase in inquiries. We will explain what is required for a Giteki application using the example of a Bluetooth (BLE) module application. We also include the benefits of requesting a Giteki application from a design company, so please take a moment to read through it. 【Contents】 ■ What is required for a Giteki application... ■ What are the benefits of requesting a Giteki application from a design company? *For more details, please refer to the PDF document or feel free to contact us.*

  • others
  • substrate

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