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substrate Product List and Ranking from 579 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

substrate Product List

1051～1080 item / All 1955 items

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Introduction from circuit and software design to board design and board manufacturing.

Introduction from circuit and software design to board design and board manufacturing.

We will respond with a consistent system from upstream circuits and software design to circuit board manufacturing!

Nihon Circuit Co., Ltd. will assist you from the development of prototype products to mass production design and manufacturing. Depending on your requirements, we can develop system design, circuit design, PCB design, PCB manufacturing, mechanical, structural, and enclosure design and manufacturing, embedded software and applications, FPGA programming, as well as evaluation and inspection all in-house. Additionally, even in the absence of specifications, we can consider product specifications based on images (such as block diagrams or sketches). 【Features】 ■ Capable of mixed design of digital and analog circuits ■ A consistent system that covers everything from upstream circuit and software design to PCB manufacturing ■ Experience in designing high-frequency (tens of GHz) PCBs ■ Able to accommodate various PCB specifications and production quantities from a single prototype design and manufacturing to mass production design and manufacturing ■ We can also handle partial requests such as development (HW, SW), PCB design, and manufacturing only *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • substrate

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Taclum Plus board for MMIC implementation

Taclum Plus board for MMIC implementation

Laser processing capability, loss improvement through wire length reduction, and heat dissipation improvement by direct mounting of copper plates.

Taclum PLUS, provided by Taconic (USA), is a PTFE substrate for MMIC implementation.

  • Other semiconductors
  • substrate

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Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.

  • Printed Circuit Board
  • substrate

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Semiconductor substrate and its manufacturing method, as well as a vapor phase growth apparatus used for it.

Semiconductor substrate and its manufacturing method, as well as a vapor phase growth apparatus used for it.

Warping caused by differences in physical constants is canceled out between both surfaces! It is possible to manufacture semiconductor substrates with minimal warping!

The issue of warping in GaN substrates leads to high costs due to low yield, as well as low crystal quality and small areas of low quality, which in turn becomes the biggest factor hindering the widespread adoption of GaN substrates. The present invention aims to produce semiconductor substrates with minimal warping using a vapor phase growth method. By alternately growing semiconductor crystals on both sides of the base substrate using the vapor phase growth method, the warping caused by differences in physical constants such as the thermal expansion coefficients of the base substrate and the semiconductor is canceled out between the two sides, making it possible to manufacture semiconductor substrates with minimal warping. 【Key Solutions】 - Manufacturing semiconductor substrates by growing semiconductor crystals on the base substrate using the vapor phase growth method. - A process in which raw gas is brought into contact with one principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Another process in which raw gas is brought into contact with the other principal surface of the base substrate to grow semiconductor crystals on the base substrate. - Alternating between the first process and the other process. *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • substrate

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Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

Sagami P.C.I. Co., Ltd. manufactured printed circuit board.

High quality, short delivery time, low cost

Specialized in hole drilling with drills, contour processing with routers, and fine hole processing with lasers.

  • Processing Contract
  • substrate

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[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

[LED] Lens Diffusion Plate: Manufacturing Method of LSD and Types of Substrates

Lens diffusion plates can be manufactured using various methods! Introducing a variety of manufacturing techniques!

Lens diffusion plates can be manufactured using various methods, but the most common method is the "roll-to-roll" process. This method offers many advantages such as uniform film thickness, high-precision transfer, and high-speed processing, making it stable and cost-effective. We introduce various manufacturing methods, starting with the "roll-to-roll" process. Please take a moment to read through it. [Contents] ■ Lens diffusion plates: Manufacturing methods and types of substrates for LSD *For more details, please refer to the PDF document or feel free to contact us.

  • lens
  • substrate

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The importance of thermal management through substrate patterning.

The importance of thermal management through substrate patterning.

Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"

An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*

  • Circuit board design and manufacturing
  • substrate

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High-frequency substrate

High-frequency substrate

Many production achievements and a rich lineup! We also accommodate small quantities and short delivery times.

"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Example: Artwork for high-voltage circuit board + circuit board manufacturing

Example: Artwork for high-voltage circuit board + circuit board manufacturing

A case where we made proposals primarily to satisfy functionality, performance, and safety!

We would like to introduce a case where we conducted the artwork and manufacturing of a high-voltage circuit board. We received an inquiry from a customer developing a high-voltage circuit board for the first time, and we proposed the circuit board design values primarily from our side. In this case, there were no clearly defined standards to comply with, so we made proposals to satisfy functionality, performance, and safety, and after adjustments with the customer, we finalized the specifications. 【Outline Specifications】 ■ Output: Maximum AC/DC 5kV ■ Insulation Design: Between other blocks = AC2kV Between Low Voltage block and High Voltage block = AC4kV (to the extent possible) *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

[Artwork Design/Circuit Board Design Work] Motor Driver, Sensing Circuit Board

Supports IMX series CMOS image sensor evaluation IF boards and QSFP 40Gbps optical transceiver modules!

Our company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Build-up substrate

Build-up substrate

Fine pitch, fine pattern, slim type! Dramatically improved wiring flexibility.

We handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Rigid-flexible substrate

Rigid-flexible substrate

A "trump card" for miniaturization and low profile! Applicable to digital cameras, robots, and more.

We would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Transparent flexible substrate

Transparent flexible substrate

Ideal for wearable devices! Applicable to medical and smartphones, etc.

We provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Handbook for Circuit Board Noise Countermeasures

Handbook for Circuit Board Noise Countermeasures

We support product development without setbacks by implementing noise countermeasures from the early design stage.

This document is a "PCB Noise Mitigation Handbook" for circuit designers, FPGA developers, and electronic device developers. It introduces the importance of GND, voltage drop, and the significance of "power/GND reinforcement" in relation to DC analysis and load variations. Additionally, it includes information on "impedance disturbances and countermeasures," such as the disruption of impedance and its solutions. [Contents] ■ Crosstalk suppression and isolation ■ Power/GND reinforcement ■ Impedance matching and equal-length wiring *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Observation of ceramic substrates

Observation of ceramic substrates

By visualizing the crystal structure, it is possible to investigate the interrelationship between material properties and organization, as well as quality improvements aimed at enhancing material properties!

We conduct "observation of ceramic substrates and ceramic packages." Ceramic substrates and ceramic packages are utilized in fields that require high reliability, such as automotive, communication infrastructure, power semiconductors, and industrial equipment. We visualize the internal structures that support their performance and reliability through cross-sectional analysis, assisting in quality improvement, defect analysis, and competitive research. 【Overview】 ■ Cross-sectional observation ■ Elemental analysis (EDX) ■ Crystal analysis (EBSD) *For more details, please download the PDF or feel free to contact us.

  • ceramic package.png
  • SEM image of a ceramic package.png
  • Contract Analysis
  • Other analysis and evaluation services
  • substrate

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Flat Grinding System Continuous Mirror Polishing Machine

Flat Grinding System Continuous Mirror Polishing Machine

We will propose a polishing machine tailored to your needs!

This is an announcement from Nappu Industrial Co., Ltd. regarding the flat grinding system continuous mirror polishing machine.

  • Repair Agent
  • substrate

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"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

"Alumina thick film circuit board" with excellent heat dissipation and heat resistance properties.

Building a consistent high-quality line! Introducing electronic material substrates with high reliability!

The "Alumina Thick Film Circuit Board" is an electronic material substrate with high reliability, where electrode materials and resistive materials are baked onto an alumina substrate that excels in heat dissipation and heat resistance. It is suitable for applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. Our company, in collaboration with our affiliated company "Ina Ceramic Co., Ltd.," produces and sinters alumina substrates, establishing a consistent high-quality line from circuit printing, firing, resistance value adjustment, component mounting, molding, to electrical testing. 【Features】 ■ Electrode materials and resistive materials are baked onto an alumina substrate with excellent heat dissipation and heat resistance ■ High reliability ■ A consistent high-quality line is established from circuit printing to electrical testing *For more details, please refer to the PDF document or feel free to contact us.

  • IPROS17714518650767726301.png
  • Printed Circuit Board
  • substrate

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Substrate production - Printed circuit board

Substrate production - Printed circuit board

Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece.

Please consult us for short delivery times for double-sided and multilayer PCBs. We can accommodate orders starting from one piece. Standard shipping for 4-layer PCBs is possible within 3 days. For more details, please contact us.

  • Circuit board design and manufacturing
  • substrate

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PC Cable Checker "Wire Box 64"

PC Cable Checker "Wire Box 64"

The check program makes instant judgments! Compact computer and cable checker.

The "Wire Box 64" is a PC cable checker that allows for low-cost and high-speed verification of complex multi-core connectors and cable connections using a computer. The main unit is compact and lightweight, fitting in the palm of your hand, and can quickly transform into a high-performance inspection device simply by combining it with a computer. All pin disconnections, short circuits, and connection errors are displayed simultaneously on the screen, enabling rapid judgment of good or bad conditions. 【Features】 ■ Compact ■ Easy operation ■ Data displayed all at once ■ Capable of determining the quality of special connections ■ Supports up to 128P when connecting two units *For more details, please refer to the PDF documentation or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • substrate

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[IH Soldering Case] Large Heat Capacity Substrate

[IH Soldering Case] Large Heat Capacity Substrate

A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.

We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.

  • 【IHはんだ付け事例】大熱容量基板2.PNG
  • Soldering Equipment
  • substrate

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[Example] Conductor Resistance Automatic Monitoring System (Continuity Resistance Monitoring)

[Example] Conductor Resistance Automatic Monitoring System (Continuity Resistance Monitoring)

Real-time analysis possible simultaneously with data collection! Original data collection and editing functions that reflect customer feedback. Hardware/software that is not limited to specific test chamber manufacturers.

- A system that can automatically monitor conductor resistance in conjunction with the test chamber. - Real-time analysis is possible simultaneously with data collection. - Standard number of channels: 192ch, using high-lifetime relay contacts rated for 100 million cycles (10V/100mA). - Control linked with testing equipment (thermal shock testing machine) is possible. - Adoption of high-temperature resistant custom measurement cables.

  • Environmental Test Equipment
  • Testing Equipment and Devices
  • Other inspection equipment and devices
  • substrate

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IoT Professional Designer Training Project

IoT Professional Designer Training Project

Introduction of a project that can train professional engineers from the beginner level.

"We need to implement IoT, but we don't have any engineers in the company." "There is no one to train engineers." "We lack the technical know-how to differentiate our products." For customers facing such issues, our 'IoT Professional Engineer Training Project' is ideal. This project consists of two steps, allowing us to train professional engineers from the beginner level. [IoT Professional Designer Training Project] ■ Engineer education services through courses ■ IoT technology consulting *For more details, please refer to the PDF document or feel free to contact us.

  • Technical Seminar
  • Business Skills Seminar
  • substrate

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"Hot Issue" Simple Diagnosis Service

"Hot Issue" Simple Diagnosis Service

We will consider services based on your concerns! We will diagnose thermal issues in the early stages of product development.

Our "Thermal Issue Simplified Diagnosis Service" diagnoses thermal issues in the early stages of product development. We predict product temperatures from the conceptual stage and report on the presence of thermal issues along with one-point advice. We provide feedback on the validity of product size and heat dissipation strategies (such as the necessity of fans) in the early design phase. Additionally, we also offer a "Design Value Calculation Service." 【Features】 ■ Response within 3 days ■ Predict product temperatures from the conceptual stage ■ Report on the presence of thermal issues and provide one-point advice ■ Feedback on the validity of product size and heat dissipation strategies in the early design phase ■ Avoid costly heat dissipation measures and significant design revisions *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Other contract services
  • substrate

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[Information] President's Blog April 2017 - March 2018

[Information] President's Blog April 2017 - March 2018

This article discusses the applications of wireless power transfer and the formation of engineer careers in the era of ultra-long lifespans!

This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from April 13, 2017, to March 30, 2018. It introduces various topics, including the need for experience and know-how in the design of wireless power transmission on April 13, 2017, the relationship between the number of engineers in design/development companies and business execution on July 18, 2017, and a solid follow-up on the progress of in-house development on October 3, 2017. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. [Published Content (Excerpt)] ■ April 13, 2017 - April 30, 2017 ■ May 8, 2017 - May 31, 2017 ■ June 1, 2017 - June 29, 2017 ■ July 4, 2017 - July 28, 2017 ■ August 4, 2017 - August 31, 2017 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Information] President's Blog April 2020 - August 2020

[Information] President's Blog April 2020 - August 2020

Requirements for Online Meetings - Contributions through WTI Technology!

This document summarizes the president's blog of Wave Technology Co., Ltd., which is engaged in "development and design promotion business" to solve the shortage of engineers, from April 1, 2020, to August 21, 2020. It introduces the current situation as of April 21, 2020, and the increasing importance of technology, as well as what is required for the online meeting on May 7, 2020 – contributing with WTI's technology – and the announcement on July 17, 2020, that WTI has finally started disseminating information in English. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ April 1, 2020; April 21, 2020 ■ May 7, 2020; May 29, 2020 ■ June 12, 2020 ■ July 2, 2020 – July 31, 2020 ■ August 21, 2020 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] WTI Blog April 2017 - March 2018

[Data] WTI Blog April 2017 - March 2018

Reasons why WTI is chosen, including "technological capabilities," as well as information about optical communication and optoelectronic conversion devices!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from April 4, 2017, to March 27, 2018. The reason WTI was chosen on April 4, 2017, is due to its "technical capabilities," and it introduces topics such as optical communication and optoelectronic conversion devices from May 9, 2017, and types of packages from June 13, 2017. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. 【Contents (excerpt)】 ■ April 4, 2017 - April 25, 2017 ■ May 9, 2017 - May 30, 2017 ■ June 6, 2017 - June 27, 2017 ■ July 4, 2017 - July 25, 2017 ■ August 8, 2017 - August 29, 2017 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Data] WTI Blog April 2020 - August 2020

[Data] WTI Blog April 2020 - August 2020

Points to consider when creating embedded software and the importance of screws in waterproof design are featured!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development and Design Promotion Business" aimed at solving the shortage of engineers, from April 7, 2020, to August 25, 2020. It introduces various topics, including the short-circuit test of power devices on May 12, 2020, key points for creating embedded software on June 23, 2020, and the importance of screws in waterproof design on August 4, 2020. Additionally, it contains a wealth of useful information related to products and industries. We encourage you to read it. 【Contents】 ■ April 7, 2020 - April 28, 2020 ■ May 12, 2020 - May 26, 2020 ■ June 2, 2020 - June 30, 2020 ■ July 7, 2020 - July 28, 2020 ■ August 4, 2020 - August 25, 2020 *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing
  • substrate

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[Information] It's Never Too Late to Ask! EMI Countermeasures: Filter Edition

[Information] It's Never Too Late to Ask! EMI Countermeasures: Filter Edition

Inductors and capacitors! Publishing know-how shared by our engineers.

This document introduces questions and answers about filters for EMI countermeasures. It includes know-how shared by our engineers regarding inductors and capacitors. It is a book that explains the concepts in an easy-to-understand manner. [Contents] ■#047 EMI Countermeasures - Filter (Inductor Part 1) ■#048 EMI Countermeasures - Filter (Inductor Part 2) ■#052 EMI Countermeasures - Filter (Capacitor Part 1) ■#053 EMI Countermeasures - Filter (Capacitor Part 2) *For more details, please refer to the PDF document or feel free to contact us.

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