Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
541～555 item / All 675 items
Proposal for eco-friendly circuit boards using solderless technology.
- The press-fit structure allows for a reduction in labor during the assembly process, and by eliminating soldering, it enables a decrease in energy consumption and manufacturing costs. - It has excellent corrosion resistance and connection stability, making it suitable for products that experience significant changes such as temperature fluctuations and vibrations.
From high-resolution pattern inspection at L/S = 5/5 µm to laser via inspection, we provide the optimal solution for all your visual inspection needs.
We offer a comprehensive lineup of AOI systems covering a wide range of substrates—from high-end models supporting minimum line/space widths of 5/5 µm to mid-range models. Our systems deliver ultra-high-precision inspection for everything from circuit patterns to laser vias. In addition to standard circuit and laser via inspection, our solutions are also capable of measuring and outputting line/space widths as well as top/bottom diameters of vias. 【Rich Options】 - Verify inspection results directly on a PC using defect images saved by the inspection system—no dedicated verification machine required. - Significantly reduce verification workload with AI-based automatic defect classification. - Analyze defect trends by type and location using panel-level data mapping, enabling effective feedback to upstream processes. - Offline teaching system allows recipe creation without occupying the inspection equipment. - Optional server system available for storing inspection results.
Manufacture a printed circuit board with terminals attached in advance.
This is a product that allows for the reduction of the post-assembly process for terminals. It is a service made possible by a company that handles everything from terminal manufacturing to terminal insertion as a system.
This is the original LED backlight power supply board from Kenic System.
The "KSLBC-3(D2)" is an LED backlight power supply board for QVGA LCDs manufactured by Densitron. 【Features】 - It can be easily configured with a general-purpose microcontroller for ON/OFF and brightness adjustment. - It uses a device with built-in overvoltage protection, so even if the LED is disconnected, the device is protected. - It is compact and lightweight, measuring 67×20mm.
Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.
"SPET" is a highly heat-resistant and low-resistance transparent substrate that, despite being PET, enhances LED driving, increases the sensitivity of electrostatic switches, and improves antenna characteristics. The total light transmittance of the substrate is 90.0%, with a haze of 0.8, and it features fine wiring that is difficult to see. Additionally, the sheet resistance of the conductor is 0.95 mΩ/□, and the conductor thickness is 18 μm, making it suitable for use as a substrate. [Features] ■ High transparency substrate ■ Low resistance conductor ■ High heat-resistant substrate *For more details, please refer to the related links or feel free to contact us.
We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.
We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.
![Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]](https://image.mono.ipros.com/public/product/image/16a/2000112015/IPROS8569125068229939146.jpg?w=280&h=280)
Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!
We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.
We have a variety of products available to meet the diverse needs of our customers.
It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.
