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substrate Product List and Ranking from 579 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors

substrate Product ranking

Last Updated: Aggregation Period:Sep 09, 2026~Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

substrate Product List

1081~1110 item / All 1955 items

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Professional Designer Training Project "Techno-Sherpa"

In an era of engineer shortages, engineers are shifting from "enhancement" to "co-creation"! Introduction of the professional designer training project.

We would like to introduce our "Techno-Sherpa." In our "Engineer Training Services," we support the development of practical engineers, including new graduates and non-electrical engineers, with a comprehensive technical education menu. Additionally, in our "Technical Consulting Services," we provide solutions to the technical challenges faced by our customers, including location detection technology, EMC countermeasures, waterproof enclosure design, and thermal/stress simulation. 【Engineer Training Services (Excerpt)】 ■ Basic Course in Electronic Circuits PLUS (2-day course) ■ Basic Course in Electronic Circuits (5-day course) ■ Power Electronics Course ■ Basic EMC Course *For more details, please refer to the PDF materials or feel free to contact us.

  • Other contract services
  • Technical Seminar
  • Other services
  • substrate

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Test malfunction countermeasure support service

Are you having trouble with measures against defects in your developed products, such as "waterproofing measures" or "EMI measures"?

This document introduces the support provided by Wave Technology Co., Ltd. It includes "Waterproofing Support," which allows for estimating the limits of waterproof measures, as well as "Vibration Testing Support," which addresses issues caused by vibrations during transportation and operation (actual usage conditions). Please feel free to download and take a look. 【Contents (excerpt)】 ■ Waterproofing Support ■ Temperature Cycle Testing Support ■ Vibration Testing Support ■ Drop and Impact Support ■ EMI Countermeasure Support *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Other services
  • Technical Seminar
  • substrate

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自社が注力すべき仕事以外は、設計会社の代行サービスを活用する時代

電波法認証 技術基準適合証明の事前評価 申請の代行/品含有化学物質調査・環境負荷物質調査の代行をさせていただきます。

当社では、『電波法認証技術基準適合証明(技適)の事前評価申請の代行』 『製品含有化学物質調査・環境負荷物質調査の代行』をさせていただきます。 製品開発で必要となる全ての設計部隊(電気、機構、基板、ソフト)が 揃っており、これらを一括で受託し社内で綿密に連携して設計を進めるため、 デザイン、コスト、性能などを最適化した製品に仕上げることが可能です。 また、位置検出、ワイヤレス給電、信号処理、画像認識、AIなど近年の 製品開発でニーズの多い要素技術についても社内外のネットワークを活用し 製品に組み込むことが可能です。 【特長】 ■製品開発のトータルコーディネートが可能 ■製品開発で必要となる全ての設計部隊揃っている ■一括で受託し社内で綿密に連携して設計を進める ■デザイン、コスト、性能などを最適化した製品に仕上げることが可能 ■社内外のネットワークを活用し製品に組み込むことが可能 ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Other contract services
  • substrate

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[Data] Shirutoku Report No. 13 # Characteristic Impedance

The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.

★★Useful Information Report: Knowledge is Power★★ This report introduces the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it essential to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Prototype Services
  • substrate

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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*

  • Contract Analysis
  • Contract Analysis
  • Other analyses
  • substrate

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[Information] Shirutoku Report No. 75 # Technical Standards Compliance Certification (Giteki) Application

What should I prepare for the application for technical standards conformity certification? Information on necessary documents for the application is provided.

★★Shirutoku Report: Useful Information You Should Know★★ In this document, we would like to provide detailed information about "Technical Compliance" (Giteki), which has seen an increase in inquiries. We will explain what is required for a Giteki application using the example of a Bluetooth (BLE) module application. We also include the benefits of requesting a Giteki application from a design company, so please take a moment to read through it. 【Contents】 ■ What is required for a Giteki application... ■ What are the benefits of requesting a Giteki application from a design company? *For more details, please refer to the PDF document or feel free to contact us.*

  • others
  • substrate

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Characteristics of substrate manufacturing methods

SVH/IVH and composite high multilayer substrate for build-up.

Leveraging the strengths of our integrated production from in-house design, we are able to accommodate the production of narrow-pitch composite substrates for high-layer-count boards, such as semiconductor tester products, through a clever combination of design rules that consider substrate manufacturing at the design stage and the unique substrate processes of our small-batch, diverse product lines.

  • Printed Circuit Board
  • Prototype Services
  • Other semiconductors
  • substrate

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【Contract Development Achievements】Confident in soldering! Leave custom requests to us.

Development tailored to your needs, from design, circuits, molding, to assembly! We specialize in custom solutions!

Optolink is a company that deals with a wide range of light-related products, including LEDs. We would like to introduce some of our achievements in contract development. We manufactured a "universal board" based on circuit diagrams and specified component placement. Additionally, for the purpose of reducing electricity costs and preventing the drying of product surfaces due to lighting heat, we have adopted "custom lighting for food" using LED lighting in approximately 200 chain stores. 【Development Achievements (Partial)】 ■ Universal board manufacturing ■ Security operation unit ■ Custom lighting for food ■ Touch switch module with backlight ■ Custom LCD backlight module *For more details, please refer to the related links page or feel free to contact us.

  • LED Module
  • LED lighting
  • LED fluorescent lamp
  • substrate

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PMC-PCI conversion board 'WPMC-PEX'

You can insert a PMC specification card into the PCI slot of a computer for use.

The PMC-PCI conversion board "WPMC-PEX" supports 32-bit or 64-bit transfers at 33MHz. (The 32-bit and 64-bit specifications depend on the PMC card.) It is possible to output PMC I/O signals externally using CN1. The CN1 connector outputs I/O signal lines from the J14 connector, which can be selected by the user as needed. PMC specification cards can be used by inserting them into a computer's PCI slot. 【Features】 ○ PMC specification cards can be used by inserting them into a computer's PCI slot ○ Supports 33MHz transfer and 32-bit or 64-bit ○ Capable of outputting PMC I/O signals externally ○ Compliant with PCI revision 2.2, supports PCI 64-bit For more details, please contact us or download the catalog.

  • Embedded Board Computers
  • substrate

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Power supply board "WFPG-20AC"

Each power module adopts a 1CH to 3CH switching regulator! It is compact in size.

The "WFPG-20AC" is a power supply board that incorporates all the power supply functions required by boards equipped with Cyclone family FPGAs into a compact 25x50mm sub-board, allowing for power supply to user boards when added on. Users do not need to consider power supply components in their design, which leads to a reduction in design time and more efficient design, as well as the possibility of reducing board size. Additionally, it features the ability to detect the rise of a 5V input voltage and output a Low-level Reset signal for 20ms. 【Features】 ■ Users do not need to consider power supply components in their design ■ Reduction in design time and efficient design can be achieved ■ Possibility of reducing board size ■ Improved high-speed transient response ■ High-speed load response characteristics of 3A/μs with a recovery time of 7μs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Media carrier ceramic ball

Achieve high cost performance!

We handle ceramic balls with various characteristics. You can view a wide range of sizes and achievements in our catalog.

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プリント基板 ハロゲンフリー・鉛フリー対応基板

ニーズにお応えする為に高品質・高精度・短納期を追求し、低価格化のニーズにも的確に対応できるように尽力致します。

ハロゲンフリー化及び鉛フリー化に各種、対応しております。

  • Printed Circuit Board
  • substrate

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Base aluminum substrate

It is a new feature that adds "heat dissipation" and "mechanical rigidity" to the functions of conventional printed circuit boards.

Aluminum substrates are designed to add new functions of "heat dissipation" and "mechanical rigidity" to the conventional printed circuit boards. Additionally, compared to resin-based printed circuit board materials, aluminum substrates have a temperature rise of about 1/10 or less at the same power consumption, making them very suitable for components that generate heat, such as resistors carrying large currents, power transistors, and high-power LEDs.

  • Printed Circuit Board
  • substrate

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Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

There are various variations depending on the board thickness and pitch.

There are various variations depending on the thickness of the board and the pitch.

  • Printed Circuit Board
  • substrate

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Substrate IVH specification substrate

Compatible with minimum hole diameter φ0.125.

The maximum interlayer thickness of IVH is 0.4mm, and it can accommodate a minimum hole diameter of φ0.125. In the future, it is also planned to support multi-layer laminated press specifications.

  • Printed Circuit Board
  • substrate

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Substrate "Impedance Control"

Impedance measurement creates test coupons outside the product! The design values for the impedance line can be simulated by our company.

In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. By providing us with impedance specifications and other details before or during the design phase, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS800s4 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Specifications for printed circuit boards with a small quantity and a variety of types.

Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.

We would like to introduce the "Printed Circuit Board Specifications" handled by Screen Process Co., Ltd. The maximum IVH interlayer thickness can accommodate up to 0.4t and the minimum hole diameter is φ0.1mm. We also support sequential IVH. For more details, please refer to the catalog. 【Minimum L/S】 ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pads and vias cannot be mixed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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<Super Short Delivery Time> Base Material Specification Sheet

Introducing our substrate specifications, including MCL-E-67 and R-1766!

We would like to introduce the specifications of the substrates handled by Screen Process Co., Ltd. The "NP-140TL" from Nanya has a UL/ANSI grade of FR-4.0, with its main application being general-purpose, and a thermal conductivity of 0.4W/mK. For more details, please refer to the catalog. 【MCL-E-67 Specifications (Partial)】 ■ Substrate Manufacturer: Hitachi Chemical ■ UL/ANSI Grade: FR-4.0 ■ Main Application: General-purpose ■ Glass Transition Temperature ・TMA Method: 120–130 ・DMA Method: 150–160 *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board processing machine
  • substrate

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<High-Speed Transmission Design> Screen Process Co., Ltd. Company Profile

We will meet our customers' needs through creativity and effort!

Our company was founded in 1984 with the aim of providing screen printing plate services, and we expanded into the printed circuit board business in 1992, continuing to the present day. To meet the various needs of our customers, we pursue high quality, high precision, and short delivery times, while also striving to respond accurately to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future trends and contribute to a prosperous future. 【Business Activities】 ■ Printed circuit boards (multilayer boards, BGA/CSP high-density substrates, pad-on-via, aluminum substrates, and prototypes of other special wiring boards for consumer and industrial use) ■ Laser drawing, CAM editing, precision industrial photography, and a full range of screen printing services *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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【HITPOINT】Piezo Buzzer Equivalent Products Available from Domestic Manufacturers

Equivalent products available for domestically manufactured items that have been discontinued. Cross-reference table is being distributed!

Hitpoint Inc. is a Taiwanese manufacturer established in 1983. For 42 years since its founding, it has built a strong reputation worldwide in buzzers, speakers, and microphones, offering a wide range of buzzers suitable for various applications, including industrial, automotive, railway transportation, and home security. ☆ We also offer equivalent piezo buzzers for discontinued domestic manufacturer products. ☆ * Cross-references can be checked from the "Catalog Download." * Please contact us if you would like samples.

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Substrate Auto Focus Substrate

Jointly developed product with Rapport System Co., Ltd.

This is a circuit board with autofocus functionality developed for device integration.

  • Printed Circuit Board
  • substrate

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Test Board Making Service

We can respond to the design and implementation of prototype (small quantity) boards for LSI testing at a low cost and with a short delivery time!

The "Test Board Making Service" provides affordable and quick responses for the design and implementation of prototype (small quantity) boards for LSI testing. The initial cost is 0 yen, and by using direct drawing for production, total costs can be reduced by 20-40%. Delivery can be handled in as little as 4 days at the shortest. We also accommodate measures against crosstalk and high current application. If you have any other requests, please feel free to contact us. 【Features】 ■ Affordable and quick responses for design and implementation ■ Initial cost is 0 yen; produced using direct drawing ■ Total costs reduced by 20-40% ■ Capable of addressing crosstalk measures and high current application *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • others
  • substrate

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Tamaru Manufacturing Co., General Circuit Board

We will implement it in a short delivery time!

Please send us the governing data you have on hand. Generally, we offer a wide range of surface treatments to meet customer needs, including flux, solder levelers, lead-free solder levelers, flash gold plating (electrolytic and electroless), and terminal gold plating. For mass-produced items, we will discuss separately, so please contact us.

  • Circuit board design and manufacturing
  • substrate

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BS3G30S Serial Control Board

This is a board for serial control of the BS3G30 digital step attenuator via PC.

● It can be combined with BS3G30 to adjust the attenuation in 0.5dB steps up to a maximum of 31.5dB. ● The power is supplied via USB, so no external power supply is required. ● One board can control two BS3G30 step attenuators. ● The PC application for this serial control board operates on the following OS: - Windows XP, 7, 8.1 *Windows is a registered trademark of Microsoft Corporation.

  • High frequency/microwave parts
  • substrate

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Are you facing any issues with the production of transparent substrates or films?

Solve your problems with transparent flexible substrates, transparent antennas, transparent heaters, and insert molded substrates!

We offer a transparent substrate called "SPET." We address concerns such as, "I want to request production, but I'm worried about the price and would like to know the market rate before placing an order," and "There are different types of transparent substrates, and I don't quite understand the differences, so I want to know the advantages and disadvantages of each method." As experts in transparent substrates, we solve issues related to the production of transparent flexible substrates, transparent antennas, transparent heaters, and insert-molded substrates. 【We solve the following concerns】 ■ I don't know the market rate for substrates ■ How should I choose? ■ I'm busy and it's a hassle *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Printed Circuit Board Assembly Moisture-Proof Coating Treatment Board

We handle everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creation, Evolution, and Development Enterprises."

  • Mechanical Design
  • substrate

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Electronic circuit board

From substrate production to component mounting! We manufacture wireless LAN routers and image processing boards!

At Nichisei Electric Manufacturing Co., Ltd., we develop, design, and manufacture electronic circuit boards, including software compatible with various microprocessors. We offer a comprehensive service from circuit design to board manufacturing and component assembly. We have extensive experience in the development of wireless LAN routers, router boards, image processing boards, terminal adapters, modems, and more. 【Features】 ■ Development of control mechanisms for various machinery ■ Comprehensive service from circuit design to manufacturing and assembly *Please feel free to contact us for more details.

  • Other contract services
  • Other services
  • substrate

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Optical Parts "Parallel Type Cut Flat Parallel Plane Board"

Bending light, splitting light! Morita Optical Industries, a manufacturer specializing in optical parts processing.

【Cut-Edge Parallel Plane Substrate Information】 ■Dimensions (Effective Diameter Long Diameter) [mm]: MIN 10 MAX 150 ■Main Angle Tolerance (90°): ±5" ±5" ■Surface Accuracy (Within Effective Diameter) [λ/633nm]: 1/4 (4) ■General Dimensional Tolerance: ±0.2 ±0.2  *Various AR Coatings and Filters Morita Optical Industry aims for infinite possibilities as a specialized manufacturer of optical parts, providing a consistent order production process from material procurement to outer shape processing, polishing, vapor deposition, bonding, and painting (black coating). We produce according to customer requests. Additionally, through thorough quality control, we offer high-precision products in a short period and at low prices. For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • prism
  • substrate

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JL Irregular Insert Series S Insert

It is possible to ensure sufficient adhesion strength to concrete.

The JL irregular shape insert series S insert is processed with internal threads on irregular rebar, ensuring sufficient adhesion strength to concrete. The material is SD345, making it ideal for applications such as scaffolding suspension, product joints, lifting, construction, demolding, and concrete jointing. For more details, please contact us or refer to the catalog.

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