Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
556～570 item / All 675 items
We aim to be a company where everyone can thrive and enjoy their work.
The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.
We aim to be a company where everyone can thrive and enjoy their work.
The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.
3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components
Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.
By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.
When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.
Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.
Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.
The copper board thickness is 200μm, and the through-hole plating thickness is 25μm! Introducing our printed circuit boards.
We would like to introduce our "Thick Copper Double-Sided Printed Circuit Board." The substrate is R-1766/1661, and the copper thickness is 200μm (using C1100-1/2H). It features high current capacity and excellent heat dissipation. Additionally, we also offer a "High-Temperature Double-Sided Printed Circuit Board" with high heat resistance and high elastic modulus. 【Features】 ■ High current capacity ■ Excellent heat dissipation *For more details, please refer to the PDF document or feel free to contact us.
Use R-5795(N)/R-5680(N)! Introducing our printed circuit boards.
We would like to introduce our multilayer printed circuit board "Beyond 5G." It uses "H-VLP3," which has a glass transition temperature of 220°C/DMA, a dielectric constant (14GHz) of 3.1, and low roughness copper foil. It features high-speed signal transmission, reduced transmission loss, and excellent through-hole reliability. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed signal transmission ■ Reduced transmission loss ■ Excellent through-hole reliability ■ Excellent heat resistance ■ Lead-free solder compatible *For more details, please refer to the PDF document or feel free to contact us.
Wiring for electrical products and precision instruments! Introducing our circuit boards.
At Sun Label, we respond to our customers' needs by designing and manufacturing printed circuit boards. We offer a lineup that includes "single-sided boards," which have conductor patterns formed on one side of an insulator, and "double-sided boards," which have conductor patterns on both sides and can consist of multiple layers. Additionally, we also handle double-sided adhesive sheets that can be reused and are usable even in high-temperature environments (with a momentary peak temperature of about 260°C). 【Products Offered】 ■ Single-sided boards ■ Double-sided boards ■ High heat-resistant double-sided adhesive sheets *For more details, please refer to the PDF materials or feel free to contact us.
Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!
We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.
High-frequency substrate
For high-frequency substrates (with proven results above 24GHz) and high-speed transmission substrates (with proven results above 40Gbps), we can accommodate proposals for layer composition and materials (MEG6) considering the components mounted on the substrate and their density.
