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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null

substrate Product ranking

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

571~585 item / All 1843 items

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"MSAP method" printed circuit board that realizes miniaturization of products.

Miniaturization of products through fine wire technology! Reducing environmental impact by adopting selective plating methods.

We would like to introduce 'MSAP', which is handled by Shinko Seisakusho Co., Ltd. The product is miniaturized through fine wiring, and environmental impact is reduced by adopting selective plating methods. The applications include module substrates and high-frequency compatible substrates. The PDF document below provides detailed information about 'MSAP', so please download it and take a look. 【Features】 ■ Miniaturization of products through fine wiring ■ Adoption of selective plating methods ■ Reduction of environmental impact ■ Applications include module substrates and high-frequency compatible substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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[Published in Nikkei Sangyo Shimbun] Supporting the digital society with fine wiring technology.

A technology for forming wiring with plating on ultra-thin copper foil! Introducing a method advantageous for fine wiring of circuits.

The Nikkei Sangyo Shimbun has featured our company's development of "MSAP." "MSAP" is a technology that forms wiring through plating on ultra-thin copper foil. It is a method advantageous for fine wiring of circuits, enabling the miniaturization of products. Shinko Seisakusho is developing high-density, high-reliability printed circuit boards that consider environmental impact using this technology. In addition to the developing "MSAP," we will provide thin, high-density printed circuit boards through processing technology for ultra-thin materials at the micron level and build-up technology. For more details, please download and view the PDF. 【MSAP Features】 ■ Copper is built up through plating to form wiring in necessary areas ■ A method advantageous for fine wiring of circuits ■ Enables product miniaturization ■ Efficient use of resources *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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[Information] Understand in just 5 minutes! Basic knowledge of printed circuit boards.

There are four main categories! We will explain printed circuit boards in an easy-to-understand manner!

"Printed circuit boards" are used in very familiar items in our daily lives. This document provides an easy-to-understand explanation of the basic knowledge of "printed circuit boards." Their main role is to attach electronic components such as resistors, ICs, and capacitors to non-conductive materials through soldering, connecting the electronic components with conductive paths. By transmitting electricity through the electronic circuits of these products, we can conveniently use the electrical devices around us. It includes information on their roles, types, and where they are utilized. We encourage you to read it. [Contents] ■ What is a printed circuit board? ■ The role of printed circuit boards ■ Types of printed circuit boards ■ Places where they are utilized ■ Introduction to Shinko Seisakusho *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Summit Corporation - Business Introduction

A convenience store for shape processing that achieves short delivery times with 24-hour full operation.

Summit Co., Ltd. is a company that specializes in the outer diameter processing of printed circuit boards. With a fully operational production line running 24 hours a day, we accommodate all orders from mass production to small batch production. Furthermore, under strict quality control from acceptance to shipment, we achieve short delivery times. As the demand for high precision in outer shape processing increases, our company consistently meets customer expectations with the best quality, technology, and delivery times. 【Business Description】 ■ Outer shape processing, NC drilling, and various electrical inspections for printed circuit boards *For more details, please refer to our catalog or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract

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Zero One Temperature and Humidity / Pressure Sensor Expansion Board 'ADRSZBM'

Simultaneously measure three environmental parameters: temperature, humidity, and atmospheric pressure! Expansion board Zero One series.

The "ADRSZBM" is a temperature, humidity, and pressure sensor expansion board specifically for the Raspberry Pi Zero. It features a sensor module equipped with Bosch's BME280, which can simultaneously measure three environmental parameters: temperature, humidity, and pressure. Additionally, it is possible to connect the BME280 away from the heat source, the Raspberry Pi itself, using the included jumper wires. 【Features】 ■ Compact "pHAT" size ■ Equipped with Bosch's BME280 ■ Connector compatible with the Grove system (I2C) *The Grove system is a registered trademark of Seeed Technology Limited. *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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Zero One Servo Motor Expansion Board 'ADRSZSB'

Two servo motors can be controlled independently! Equipped with external power terminals to accommodate various usage forms.

"ADRSZSB" is a servo motor expansion board dedicated to the Raspberry Pi Zero. By switching the jumper, you can choose to power it from the GPIO/external power terminal. It supports various usage forms. Additionally, it allows independent control of two servo motors from a single Zero. It is also possible to control a two-axis camera platform. 【Features】 ■ Compact "pHAT" size ■ Equipped with an external power terminal that can be used from 5V to a maximum of 12V ■ Independent control of two servo motors ■ Equipped with LEDs that indicate the motor's operating status ■ High-resolution 16-bit PWM *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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Zero One Solenoid Expansion Board 'ADRSZSN'

The LED makes it easy to check the operating status! It is useful during experiments and maintenance!

The "ADRSZSN" is a solenoid expansion board specifically designed for the Raspberry Pi Zero. In addition to supplying 5V power from the Raspberry Pi Zero itself, it also supports external power supply up to 12V 2A (switchable via pin headers). The LED makes it easy to check the operating status. This is useful during experiments and maintenance. 【Features】 ■ Compact "pHAT" size ■ Selectable solenoid power supply ■ Equipped with LEDs to indicate the operating status of the solenoid *For more details, please refer to the PDF materials or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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C&I Co., Ltd. Business Introduction

Leave your research and development outsourcing to us!

C&I Co., Ltd. is a company primarily engaged in outsourcing research and development. We handle staffing of bio-chemical specialized researchers, as well as tasks such as organic synthesis, polymer synthesis, surveys, and consultations, and we will respond to our customers' needs accordingly. Additionally, we have started developing research equipment utilizing our five years of research and development experience in regenerative medicine, along with some trial sales, so please feel free to contact us. [Business Activities] ■ Outsourcing of research and development ■ Development of research equipment *For more details, please refer to our catalog or feel free to contact us.

  • Research and technical staffing
  • Other cell research
  • Other analytical and testing equipment

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Structural ceramics and hard materials components

【Overwhelmingly Low Prices】Mold production to prototyping starts from "100,000 yen," with delivery possible in as little as 2 weeks! We provide various ceramics and hard metal parts to a wide range of industries!

We handle various structural ceramics and cemented carbide, and we can accommodate from mold production to prototyping starting at 100,000 yen. We provide various ceramics and cemented carbide parts to a wide range of industries, including automotive, medical, food, environment, machinery, and electrical. We are capable of supporting bubble sealing parts, ultra-precision machining, plunger parts, mechanism parts, three-dimensional shape injection molding, and LED parts. 【Features】 ■ Rubber molds and metal molds / starting from 100,000 yen ■ Response in as little as 2 weeks ■ Extensive delivery track record ■ Manufacturing consignment is also welcome *For more details, please refer to the catalog or feel free to contact us.

  • Ceramics
  • Other machine elements
  • others

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Flow Soldering Equipment "PLS series"

There are hardly any copper burrs, and the flow-up is excellent! The soldering device in the inner layer is also reliable.

The "PLS series" is a flow soldering device that performs flow dip soldering in a low oxygen concentration atmosphere. By controlling the posture of the workpiece in conjunction with the posture control of the chamber and conveyor, it is possible to create a stable atmosphere. Additionally, a chamber-type two-stage preheating and coordinated transport are employed for preheating. This allows for uniform heating of large multilayer workpieces while forming the desired preheating temperature profile. 【Features】 ■ The chamber moves to control the posture of the wiring board ■ Well-established low oxygen concentration ■ Excellent heat supply capability and uniform heating (flow dip) ■ CCR preheater ■ Coordinated transport *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment

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ILF/MXL/LG Specification List

This is a document that includes the specifications of soldering equipment and spray frackers handled by Sensbee.

The "ILF/MXL/LG Specifications List" is a document from Sensbee, which manufactures and sells soldering equipment and related products, heaters and their application products, automatic temperature controllers, etc. This document includes specifications for the flow soldering equipment "ILF-350Z II," as well as the flow soldering equipment "LG-350NPX" and the spray fluxer "MXL-350Pro." [Featured Products] ■ LG-350NPX ■ MXL-350Pro ■ ILF350Z II ■ ILF350CM For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Solder
  • others

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Flow Soldering Device / Spray Fracturer

Introducing soldering equipment and spray frackers that create "Japanese quality"!

The flow soldering equipment/spray fluxer "LG/ILF/MXL series" is a product of Sensby, which manufactures and sells soldering equipment and related products, heaters and their applications, automatic temperature controllers, and more. Our company offers a range of products including the long-selling flow soldering equipment "LG series," the high-performance N2 flow soldering equipment "ILF series," and the VOC-free spray fluxer "MXL series." 【Product Lineup】 ■ Flow Soldering Equipment LG-350NPX ・Primary/secondary flow and swing nozzle ■ N2 Flow Soldering Equipment ILF-350Z II ・20ppm oxygen concentration specification and its stability, preheating also at low oxygen concentration ■ Spray Fluxer MXL-350Pro ・Adopts quick convection method For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Solder
  • others

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Flow dip soldering equipment "S Series / FD Series"

Low land erosion and high-reliability implementation possible! Soldering device with built-in spray fraxer.

The "S Series / FD Series" is a flow dip soldering device that allows for high-reliability assembly with minimal land (copper) erosion. We offer models such as the "S-200BU," which supports point soldering with a mask pallet, and the "FDS-400," designed for soldering long lead components. All soldering processes, including a spray fluxer (swing type), are incorporated. 【Features】 <S-200BU>  ■ Enables point soldering using a masking structure pallet  ■ Compact design suitable for cell production <FDS-400>  ■ Capable of soldering printed circuit boards with long lead components  ■ Carrier circulation transport system *For more details, please refer to the catalog or feel free to contact us.

  • Soldering Equipment
  • Solder
  • others

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N2 flow soldering device 'ILF-350ZS'

For those using a soldering device for the first time. Achieves an oxygen concentration specification of below 100 ppm and high stability. Improves thermal conductivity and realizes energy savings.

The "ILF-350ZS" is a nitrogen-infusion soldering device. It features high stability with low oxygen concentration (below 100ppm) thanks to our unique TASC method, and the heater technology eliminates concerns about insufficient preheating. For those who are unsure about which soldering device to use, those using a nitrogen-infusion device for the first time, those struggling with unstable oxygen concentrations, or those experiencing inconsistency in jig soldering results! 【Features】 ■ High stability with low oxygen concentration (below 100ppm) using our unique TASC method ■ No worries about insufficient preheating thanks to heater technology ■ Low power consumption (energy-saving) ■ Retention conveyor (Pac-Man claws) ■ Process trace technology that enables traceability *For more details about the product, please download the PDF or contact us. *We are also distributing "Oxygen concentration distribution within the chamber" and "Trends in the time domain" for free.

  • Soldering Equipment
  • Solder
  • others

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IMC Corporation Business Introduction

IMC Co., Ltd. - Printed Circuit Board Design

IMC Corporation is a company primarily engaged in the design of printed circuit boards and related operations. In response to customer requests, we provide a comprehensive one-stop service from pattern design to board manufacturing and assembly, as well as services tailored to each process. We accommodate a variety of needs, including general printed circuit boards, high-frequency printed circuit boards, and flexible and rigid-flex boards. For anything related to printed circuit boards, please leave it to us. 【Main Services】 ■ Design of printed circuit boards and related operations *For more details, please refer to our catalog or feel free to contact us.*

  • Printed Circuit Board

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