We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 579 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Sep 09, 2026～Oct 06, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  5. 5 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン

substrate Product List

1141～1170 item / All 1955 items

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Water-cooled flow circuit board

Water-cooled flow circuit board

Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.

The "Water-Cooled Flow Path Circuit Board" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It directly bonds a water-cooled unit to a metal base substrate, effectively addressing heat issues for low energy conversion efficiency devices such as UV LEDs. 【Features】 ■ Directly bonds a water-cooled unit to a metal base substrate ■ Effectively addresses heat issues for low energy conversion efficiency devices such as UV LEDs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • substrate

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Multilayer metal base substrate

Multilayer metal base substrate

Introducing a multilayer metal base substrate that supports high-density wiring!

The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • substrate

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Metal (copper, aluminum) bump substrate

Metal (copper, aluminum) bump substrate

Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.

The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • substrate

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Metal base single-sided board

Metal base single-sided board

Introducing a printed circuit board with an insulating layer on a metal surface, copper foil arranged, and circuits formed on top!

The "metal base single-sided substrate" is a printed circuit board that has an insulating layer and copper foil on a metal surface, with circuits formed on top of it. The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications. It is proposed for thermal management of high-brightness LEDs and high-power semiconductors. 【Features】 ■ Insulating layer and copper foil are arranged on the metal surface, with circuits formed on top ■ The insulating layer includes a glass epoxy prepreg type and a high thermal conductivity insulating sheet tailored to specific applications ■ Proposed for thermal management of high-brightness LEDs and high-power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Other machine elements
  • substrate

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Daishō Electronics System Development

Daishō Electronics System Development

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools
  • substrate

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Fuji Print Industry Electronic Equipment Development

Fuji Print Industry Electronic Equipment Development

We have accumulated many achievements.

From the development, design, and manufacturing of electronic devices to product commercialization support and even product evaluation and analysis, Fuji Print Industry plays a role in supporting cutting-edge manufacturing.

  • Other machine elements
  • substrate

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Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Component-integrated board SIMPACT [Reducing dead space for miniaturization!]

Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!

Recently, in response to the miniaturization and high density of electronic devices, there is a demand for the miniaturization and integration of printed circuit boards. The technology of embedded substrate, which reduces the surface area for component mounting by embedding components within the circuit board and minimizing dead space, is being sought after. SIMPACT is accepting orders for prototypes of embedded substrates. Please feel free to inquire from just one piece. 【Features】 ■ Components can be mounted at low temperatures and in a short time ■ Reduced load on components due to a dry process that eliminates the need for drilling and copper plating after mounting ■ Technology that connects wiring between different layers at arbitrary positions, enabling the shortest possible wiring formation ■ Vertical embedding allows for the embedding of many chips *For details, please request materials or view the PDF data from the download.

  • Printed Circuit Board
  • substrate

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Printed circuit board "aluminum substrate"

Printed circuit board "aluminum substrate"

Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.

Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • substrate

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Analog/Digital Application Technology Products Control Sequencer Servo

Analog/Digital Application Technology Products Control Sequencer Servo

The sequencer board of KAIKEN that leads the era.

A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring compared to conventional control devices and is equipped with highly versatile I/O options.

  • Other process controls
  • substrate

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Meito Electric Industry Aluminum Substrate (MX Series)

Meito Electric Industry Aluminum Substrate (MX Series)

This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

  • LED Module
  • substrate

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Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Meito Electric Co., Ltd. Company Profile

Meito Electric Co., Ltd. Company Profile

High technology supporting the industrial society! Meito Electric Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract measurement
  • substrate

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Heat dissipation (special) substrate for LED

Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • LED Module
  • substrate

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If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

Do you have any requests such as wanting to allow more current to flow than a standard circuit board, wanting to suppress the resulting temperature rise, or not wanting to increase the size of the board?

Do you have any requests such as wanting to flow more current than a standard board while keeping temperature rise to a minimum, or not wanting to increase the size of the board too much? At Meito Electric, as a board manufacturer, we assist in the development of thick copper boards tailored to your needs by considering the line/space during pattern design, the current values flowing through through-holes, selecting copper thickness, and choosing high heat dissipation materials and layer counts. 【Do you have any of the following requests?】 ■ Want to reduce bus bars on the board ■ Want to form power circuits and control circuits on the same board ■ Want to dissipate heat from components to prevent failures 　and more *For detailed information on thick copper, please download the PDF or feel free to contact us.

  • Contract manufacturing
  • substrate

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Technical Support Case: "Operation Display Board"

Technical Support Case: "Operation Display Board"

Introducing a case study related to the control board. Achieved CAN signal analysis and board creation in a short period.

We would like to introduce a technical case related to our operational display board. We received a request from an authorized dealer of imported motorcycles to create a control board for a lamp that displays the condition of the transmission and vehicle speed of a training motorcycle. Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. Additionally, there was a concern about not being able to allocate much development budget for CAN analysis work. Our company analyzed the CAN signals and completed the control board in a very short period. As a result, we were able to keep the development costs within budget. It was discovered that interrupting the CAN was not easy but possible, and the customer was pleased to see the potential for developing other products. 【Case Study】 ■ Concerns - Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. - The number of units to be produced is limited to just two for the time being, and the budget is also constrained. - There is a limitation on how much development budget can be allocated for CAN analysis work. ■ Response - Analyzed the CAN signals and completed the control board in a very short period. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • substrate

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"Thin film metallization" and "thick film metallization" on ceramic substrates.

"Thin film metallization" and "thick film metallization" on ceramic substrates.

It is possible to form thick film patterns by screen printing on ceramic substrates and thin film patterns using photolithography.

As the main methods of metallization processing, we can accommodate thick film pattern formation through screen printing, and thin film pattern formation through vacuum deposition, plating, photolithography, and etching. In addition to pattern formation, we can also accommodate VIA filling, resistor formation, and through-hole formation. We will propose the optimal metallization processing to achieve the desired functions and performance. <Processing Specification Examples> - Thin Film Metallization Processing Accuracy: Line/Space = 30μm/30μm Processing Method: Vacuum deposition (sputtering or evaporation) + plating + photolithography (resist formation, exposure, development) + etching Other Processing: Through-hole formation (Φ0.1mm and above) / resistor formation - Thick Film Metallization Processing Accuracy: Line/Space = 100μm/100μm Processing Method: Screen printing Other Processing: VIA filling / resistor formation *For more details, please refer to the catalog or website, or feel free to contact us.

  • Sensors
  • High frequency/microwave parts
  • Resistors
  • substrate

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Business Description: Printed Circuit Board Manufacturing

Business Description: Printed Circuit Board Manufacturing

We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.

The patterns manufactured by our company are formed in a way that closely resembles the originally designed patterns with excellent etching precision. This maintains the original functionality and eliminates issues such as thinning and disconnection.

  • Circuit board processing machine
  • substrate

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Thick copper substrate / copper inlay substrate

Thick copper substrate / copper inlay substrate

Outer layer maximum 762μm, inner layer 381μm. Compatible with copper inlay and copper core. For EV chargers and power semiconductors.

We provide thick copper substrates for applications requiring high current and high heat dissipation, such as EV (electric vehicle) chargers, power semiconductors, and power supply equipment. We support outer layer copper foil thicknesses up to 762μm and inner layers up to 381μm. We also accommodate copper inlays (embedded metal from 1.0 to 3.0mm) and copper core substrates, achieving high current and high voltage resistance. We have a track record of manufacturing substrates for electric vehicle chargers, including 12-layer t=5.0mm boards with 3.0mm copper inlays. It is also possible to combine T-type copper coin embedding with high-frequency compatible materials and create composite structures with rigid FPCs.

  • Circuit board design and manufacturing
  • substrate

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Rigid-flexible substrate

Rigid-flexible substrate

Supports up to 10 layers for the rigid part and 6 layers for the flexible part. For wearable camera modules.

We provide rigid-flexible substrates with a rigid part and a flexible part in an integrated structure. The rigid part can support up to 10 layers, and the flexible part can support up to 6 layers. In addition to the standard configuration, we can also accommodate special structures such as a configuration with two FPCs, a reinforced plate for the FPC part, two types of materials for the rigid part, and different thicknesses for the rigid part. We also have a track record of manufacturing high-multilayer rigid-flex (5-16-5 structure, flexible part 2 layers × 8, Isola 370HR + Dupont AP8525R materials). We have experience in applications for camera modules, wearable devices, and sensor components.

  • Circuit board design and manufacturing
  • substrate

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[Information] Reship Electronic Newsletter Vol. 9

[Information] Reship Electronic Newsletter Vol. 9

We will contribute to your company's SDGs! Through parts procurement, we are striving to promote green procurement and the purchase of generic parts!

This document introduces our company's efforts toward the SDGs. It includes information on the use of Pb-free (lead-free) solder and N2 (nitrogen) in "component mounting," "component procurement," and "compliance with the RoHS directive." We contribute to your company's SDGs. Please take a moment to read it. 【Contents (partial)】 ■ Our company's efforts toward the SDGs ■ Component procurement ■ Component mounting ■ Packaging ■ Compliance with the RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Other packaging materials
  • substrate

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Hiraguri Co., Ltd. Business Introduction

Hiraguri Co., Ltd. Business Introduction

Demonstrating strengths in the integrated manufacturing of semiconductor manufacturing and control devices, medical equipment, and electronic devices across multiple fields!

Hiraguri Co., Ltd. provides printed circuit boards, units, and cable assemblies for cutting-edge semiconductor manufacturing equipment and heavy electrical machinery. Various certified technicians carry out the production of high-quality and reliable products based on the "Reliability Improvement Movement." 【Business Activities】 ■ Manufacturing and providing printed circuit boards and power supply units ■ Manufacturing and providing cable assemblies ■ Manufacturing and providing control units, wires, and harnesses *For more details, please refer to the PDF document or feel free to contact us.

  • cable
  • Circuit board design and manufacturing
  • controller
  • substrate

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Thick film technology, research, cooperation

Thick film technology, research, cooperation

We will perform pattern printing on ceramic substrates using thick film printing.

Hayashi Repic Co., Ltd. manufactures substrates using thick film technology. We cater to high heat-resistant and high heat-dissipating electronic circuit substrates such as ceramic substrates. Thick film printing technology has no limitations on the printed materials and challenges various materials and applications. We accept small-scale prototypes and custom items. 【Related Products】 ○ Thick film circuits ○ Heaters ○ Radiation detectors ○ Sensors For more details, please contact us or download the catalog.

  • Other electronic parts
  • substrate

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TAB flexible substrate

TAB flexible substrate

Support for a variety of flexible substrates from prototyping to mass production using the REEL to REEL method.

● Mass production of RtoR flexible substrates is possible. ● All processing equipment is installed in a Class 1,000 cleanroom. ● A coverlay method is adopted for surface protection of flexible substrates. ● We have electroplating equipment for Ni (nickel)/Au (gold) and can provide specifications tailored to customer needs. ● Inner lead structures can be formed for connection points. ● All products are quality assured through automatic visual inspection and electrical testing. ● We possess a variety of analytical equipment for quality verification and measurement/length measurement at each process. ● We provide flexible substrates compliant with RoHS directives and made from flame-retardant materials equivalent to 94VTM-0.

  • Printed Circuit Board
  • Other electronic parts
  • Dedicated IC
  • substrate

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Kamei Electric - Completed Printed Circuit Board Group

Kamei Electric - Completed Printed Circuit Board Group

Thorough quality assurance

It is created by well-equipped facilities and people capable of a consistent production system.

  • Printed Circuit Board
  • substrate

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Medical Development Support: Flexible Substrates, FPC, Flexible Boards

Medical Development Support: Flexible Substrates, FPC, Flexible Boards

We manufacture, sell, and support medical devices for basic research. FPC

- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • substrate

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[PCB Design and Product Design] FPC and Flexible Circuit Boards

[PCB Design and Product Design] FPC and Flexible Circuit Boards

We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC

- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • substrate

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Flying lead flexible printed circuit board (FPC/flexible circuit board)

Flying lead flexible printed circuit board (FPC/flexible circuit board)

It is a flexible substrate that allows for a highly reliable connection.

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • substrate

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Long-length flexible printed circuit board (FPC)

Long-length flexible printed circuit board (FPC)

This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.

Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • substrate

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ABL's 'Manufacturing and Sales of Electronic Devices'

ABL's 'Manufacturing and Sales of Electronic Devices'

We respond to product development, manufacturing, inspection, and shipping in all fields with short lead times.

Our company conducts product development, manufacturing, inspection, and shipping across various fields with a short delivery time through collaboration in development, implementation, processing, and assembly. As the number of engineers decreases, we respond to a wide range of manufacturing needs, including circuit board wiring and modifications, with reliable technology. Additionally, we offer proposals tailored to customer needs for resin parts that support the casing, which pertains to the appearance of industrial products, as well as electronic components. We can also accommodate wireless measurement and wire bonding, so please feel free to consult with us. 【Service Offerings】 ■ Universal circuit board wiring and assembly ■ Case design, engineering, and manufacturing ■ Wireless measurement systems and wire bonding ■ Sales of various conversion boards *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded system design service
  • Contract manufacturing
  • Semiconductor inspection/test equipment
  • substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

The maximum operating pressure is 1200 bar (17500 psi)! Introducing our evaluation kit.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLG-0150'. The maximum flow rate is 8 ml/min (water-based). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Our sensor solutions are used in a wide range of applications and markets. Please feel free to contact us when you need assistance. 【Included Items】 ■ SLG-0150 × 1 ■ SCC1-USB Sensor Cable × 1 ■ SCC1-Analog Sensor Cable × 1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

  • Evaluation Board
  • substrate

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