substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies

Printed circuit board "aluminum substrate"

Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.

Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum-based material, as well as double-sided substrates with a core of aluminum, where an insulating layer and copper foil are laminated to create through holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.

Company：富士プリント工業
Price：Other

Printed Circuit Board
substrate

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Analog/Digital Application Technology Products Control Sequencer Servo

The sequencer board of KAIKEN that leads the era.

A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring compared to conventional control devices and is equipped with highly versatile I/O options.

Company：開研本社
Price：Other

Other process controls
substrate

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Meito Electric Industry Aluminum Substrate (MX Series)

This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

Company：名東電産
Price：Other

LED Module
substrate

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Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

Company：名東電産
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Meito Electric Co., Ltd. Company Profile

High technology supporting the industrial society! Meito Electric Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

Company：名東電産
Price：Other

Printed Circuit Board
Circuit board design and manufacturing
Contract measurement
substrate

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Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

Company：名東電産
Price：Other

Circuit board design and manufacturing
LED Module
substrate

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If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

Do you have any requests such as wanting to allow more current to flow than a standard circuit board, wanting to suppress the resulting temperature rise, or not wanting to increase the size of the board?

Do you have any requests such as wanting to flow more current than a standard board while keeping temperature rise to a minimum, or not wanting to increase the size of the board too much? At Meito Electric, as a board manufacturer, we assist in the development of thick copper boards tailored to your needs by considering the line/space during pattern design, the current values flowing through through-holes, selecting copper thickness, and choosing high heat dissipation materials and layer counts. 【Do you have any of the following requests?】 ■ Want to reduce bus bars on the board ■ Want to form power circuits and control circuits on the same board ■ Want to dissipate heat from components to prevent failures 　and more *For detailed information on thick copper, please download the PDF or feel free to contact us.

Company：名東電産
Price：Other

Contract manufacturing
substrate

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Technical Support Case: "Operation Display Board"

Introducing a case study related to the control board. Achieved CAN signal analysis and board creation in a short period.

We would like to introduce a technical case related to our operational display board. We received a request from an authorized dealer of imported motorcycles to create a control board for a lamp that displays the condition of the transmission and vehicle speed of a training motorcycle. Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. Additionally, there was a concern about not being able to allocate much development budget for CAN analysis work. Our company analyzed the CAN signals and completed the control board in a very short period. As a result, we were able to keep the development costs within budget. It was discovered that interrupting the CAN was not easy but possible, and the customer was pleased to see the potential for developing other products. 【Case Study】 ■ Concerns - Since it is a CAN-equipped vehicle, even adding just one lamp would change the current, leading to a judgment of abnormality and causing the engine to stop. - The number of units to be produced is limited to just two for the time being, and the budget is also constrained. - There is a limitation on how much development budget can be allocated for CAN analysis work. ■ Response - Analyzed the CAN signals and completed the control board in a very short period. *For more details, please refer to the PDF document or feel free to contact us.

Company：日本ロック技術センター
Price：Other

Circuit board design and manufacturing
Contract manufacturing
substrate

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"Thin film metallization" and "thick film metallization" on ceramic substrates.

It is possible to form thick film patterns by screen printing on ceramic substrates and thin film patterns using photolithography.

As the main methods of metallization processing, we can accommodate thick film pattern formation through screen printing, and thin film pattern formation through vacuum deposition, plating, photolithography, and etching. In addition to pattern formation, we can also accommodate VIA filling, resistor formation, and through-hole formation. We will propose the optimal metallization processing to achieve the desired functions and performance. <Processing Specification Examples> - Thin Film Metallization Processing Accuracy: Line/Space = 30μm/30μm Processing Method: Vacuum deposition (sputtering or evaporation) + plating + photolithography (resist formation, exposure, development) + etching Other Processing: Through-hole formation (Φ0.1mm and above) / resistor formation - Thick Film Metallization Processing Accuracy: Line/Space = 100μm/100μm Processing Method: Screen printing Other Processing: VIA filling / resistor formation *For more details, please refer to the catalog or website, or feel free to contact us.

Company：清水商会
Price：Other

Sensors
High frequency/microwave parts
Resistors
substrate

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Business Description: Printed Circuit Board Manufacturing

We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.

The patterns manufactured by our company are formed in a way that closely resembles the originally designed patterns with excellent etching precision. This maintains the original functionality and eliminates issues such as thinning and disconnection.

Company：真成電子産業
Price：Other

Circuit board processing machine
substrate

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[Information] Reship Electronic Newsletter Vol. 9

We will contribute to your company's SDGs! Through parts procurement, we are striving to promote green procurement and the purchase of generic parts!

This document introduces our company's efforts toward the SDGs. It includes information on the use of Pb-free (lead-free) solder and N2 (nitrogen) in "component mounting," "component procurement," and "compliance with the RoHS directive." We contribute to your company's SDGs. Please take a moment to read it. 【Contents (partial)】 ■ Our company's efforts toward the SDGs ■ Component procurement ■ Component mounting ■ Packaging ■ Compliance with the RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

Company：レシップ電子
Price：Other

Circuit board design and manufacturing
Other packaging materials
substrate

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Hiraguri Co., Ltd. Business Introduction

Demonstrating strengths in the integrated manufacturing of semiconductor manufacturing and control devices, medical equipment, and electronic devices across multiple fields!

Hiraguri Co., Ltd. provides printed circuit boards, units, and cable assemblies for cutting-edge semiconductor manufacturing equipment and heavy electrical machinery. Various certified technicians carry out the production of high-quality and reliable products based on the "Reliability Improvement Movement." 【Business Activities】 ■ Manufacturing and providing printed circuit boards and power supply units ■ Manufacturing and providing cable assemblies ■ Manufacturing and providing control units, wires, and harnesses *For more details, please refer to the PDF document or feel free to contact us.

Company：有限会社平栗
Price：Other

cable
Circuit board design and manufacturing
controller
substrate

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Thick film technology, research, cooperation

We will perform pattern printing on ceramic substrates using thick film printing.

Hayashi Repic Co., Ltd. manufactures substrates using thick film technology. We cater to high heat-resistant and high heat-dissipating electronic circuit substrates such as ceramic substrates. Thick film printing technology has no limitations on the printed materials and challenges various materials and applications. We accept small-scale prototypes and custom items. 【Related Products】 ○ Thick film circuits ○ Heaters ○ Radiation detectors ○ Sensors For more details, please contact us or download the catalog.

Company：ハヤシレピック第３事業部
Price：10,000 yen-100,000 yen

Other electronic parts
substrate

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TAB flexible substrate

Support for a variety of flexible substrates from prototyping to mass production using the REEL to REEL method.

● Mass production of RtoR flexible substrates is possible. ● All processing equipment is installed in a Class 1,000 cleanroom. ● A coverlay method is adopted for surface protection of flexible substrates. ● We have electroplating equipment for Ni (nickel)/Au (gold) and can provide specifications tailored to customer needs. ● Inner lead structures can be formed for connection points. ● All products are quality assured through automatic visual inspection and electrical testing. ● We possess a variety of analytical equipment for quality verification and measurement/length measurement at each process. ● We provide flexible substrates compliant with RoHS directives and made from flame-retardant materials equivalent to 94VTM-0.

Company：キヤノン・コンポーネンツ電子回路事業部
Price：Other

Printed Circuit Board
Other electronic parts
Dedicated IC
substrate

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Kamei Electric - Completed Printed Circuit Board Group

Thorough quality assurance

It is created by well-equipped facilities and people capable of a consistent production system.

Company：加美電機
Price：Other

Printed Circuit Board
substrate

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Medical Development Support: Flexible Substrates, FPC, Flexible Boards

We manufacture, sell, and support medical devices for basic research. FPC

- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Printed Circuit Board
Contract manufacturing
substrate

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[PCB Design and Product Design] FPC and Flexible Circuit Boards

We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC

- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Flying lead flexible printed circuit board (FPC/flexible circuit board)

It is a flexible substrate that allows for a highly reliable connection.

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Long-length flexible printed circuit board (FPC)

This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.

Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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ABL's 'Manufacturing and Sales of Electronic Devices'

We respond to product development, manufacturing, inspection, and shipping in all fields with short lead times.

Our company conducts product development, manufacturing, inspection, and shipping across various fields with a short delivery time through collaboration in development, implementation, processing, and assembly. As the number of engineers decreases, we respond to a wide range of manufacturing needs, including circuit board wiring and modifications, with reliable technology. Additionally, we offer proposals tailored to customer needs for resin parts that support the casing, which pertains to the appearance of industrial products, as well as electronic components. We can also accommodate wireless measurement and wire bonding, so please feel free to consult with us. 【Service Offerings】 ■ Universal circuit board wiring and assembly ■ Case design, engineering, and manufacturing ■ Wireless measurement systems and wire bonding ■ Sales of various conversion boards *For more details, please refer to the PDF document or feel free to contact us.

Company：エービーエル
Price：Other

Embedded system design service
Contract manufacturing
Semiconductor inspection/test equipment
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

The maximum operating pressure is 1200 bar (17500 psi)! Introducing our evaluation kit.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLG-0150'. The maximum flow rate is 8 ml/min (water-based). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Our sensor solutions are used in a wide range of applications and markets. Please feel free to contact us when you need assistance. 【Included Items】 ■ SLG-0150 × 1 ■ SCC1-USB Sensor Cable × 1 ■ SCC1-Analog Sensor Cable × 1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Evaluation Board
substrate

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Particle Matter Sensor Evaluation Kit 'SEK-SPS30'

Compact, ultra-thin package! Includes SPS30 and UART-USB adapter cable.

We would like to introduce our particle matter sensor evaluation kit, 'SEK-SPS30'. It offers advanced particle size binning provided through calibrated digital output. In addition to its unique long-term stability due to contamination resistance, it comes in a compact, ultra-thin package. 【Included Items】 ■SPS30×1 ■UART-USB adapter cable (2m long)×1 *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Other Sensors
Evaluation Board
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

IP65 waterproof and dust resistant! Maximum flow rate is 1ml/min (aqueous) and 10ml/min (hydrocarbon).

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-1000'. It features IP65 waterproof and dust resistance, with a maximum flow rate of 1ml/min (aqueous) and 10ml/min (hydrocarbon). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-1000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

The interface (connector) is I2C! Maximum flow rate 1000ml/h (aqueous), bamboo joint.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-LD20-2600B'. It is a disposable biomedical product with a maximum flow rate of 1000 ml/h (aqueous) and a bamboo shoot connector. The interface (connector) is I2C, and an SCC1-USB sensor cable is required separately. 【Included Items】 ■ LD20-2600B ×3 ■ Base Station ×3 ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Fluid control and system reliability are achieved, leading to a dramatic improvement in performance and end-user satisfaction!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3C-1300F'. The "SLF3S-1300F" combines our long-standing excellent track record in low flow and minimum flow sensing with a thoroughly optimized mechanical design, elevating its already well-established functionality to a higher level in terms of price-to-performance ratio. This sensor provides the highest level of safety, stability, and long-term reliability across a wide range of fields, including diagnostics, analytical equipment, and life sciences. 【Features of SLF3S-1300F】 ■ Optimizes costs by simplifying design based on CMOSens Technology without sacrificing fluid, electrical, or mechanical connections. ■ Offers outstanding chemical resistance and excellent media compatibility. ■ Monitors the operation of the entire system and detects common failure modes. *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
substrate

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Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

Other electronic parts
substrate

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Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

Other semiconductors
Printed Circuit Board
Other electronic parts
substrate

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Printed Circuit Board Assembly

We accept orders regardless of quantity! Comprehensive support from design to implementation of printed circuit boards!

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
substrate

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AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
substrate

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Through Hole Filling

Superior electrical and thermal properties due to special copper plating! Introducing the filling of DPC substrates.

"Through hole filling" refers to the process of filling holes in ceramic substrates that excel in electrical (low resistance) and thermal (high thermal conductivity) properties due to special copper plating. We will introduce hole filling for diameters of Φ0.1 mm, as well as Φ0.15 mm and Φ0.2 mm, with photos. *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
substrate

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substrate Product List and Ranking from 562 Manufacturers, Suppliers and Companies | IPROS GMS

substrate Manufacturer, Suppliers and Company Rankings

substrate Product ranking