"MSAP method" printed circuit board that realizes miniaturization of products.
Miniaturization of products through fine wire technology! Reducing environmental impact by adopting selective plating methods.
We would like to introduce 'MSAP', which is handled by Shinko Seisakusho Co., Ltd. The product is miniaturized through fine wiring, and environmental impact is reduced by adopting selective plating methods. The applications include module substrates and high-frequency compatible substrates. The PDF document below provides detailed information about 'MSAP', so please download it and take a look. 【Features】 ■ Miniaturization of products through fine wiring ■ Adoption of selective plating methods ■ Reduction of environmental impact ■ Applications include module substrates and high-frequency compatible substrates *For more details, please refer to the PDF document or feel free to contact us.
- Company:伸光製作所
- Price:Other