We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 モリマーエスエスピー Osaka//Resin/Plastic 本社

substrate Product ranking

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

571~585 item / All 675 items

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High-density substrate

High-density substrate

We will propose and accommodate ultra-high-density designs, such as setting the space between components like CR to 0.3mm, using through-hole substrates, build-up/IVH, and through resin filling specifications.

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Power supply board

Power supply board

We have experience in supporting various power supply boards. We can offer suggestions such as high thermal conductivity copper inlays, thermal analysis, and thick copper boards.

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Flexible circuit board

Flexible circuit board

We can accommodate everything from single-sided flexible printed circuit boards to multi-layer flexible printed circuit boards, including assembly.

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Through-hole resin-filled substrate

Through-hole resin-filled substrate

This is a method of placing through vias on the pads of electronic components and filling the vias with paste to eliminate issues during the mounting of electronic components. It is effective in high-density designs and may be less expensive than IVH or build methods. It is used for narrow-pitch BGAs and similar components.

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Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

Narrow pitch BGA substrate (0.25mm/0.3mm/0.4mm, etc.)

We have a wealth of experience in designing narrow pitch BGA mounted boards. Regarding board manufacturing, we will select and propose manufacturers that are capable of production.

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