substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies

[Information] Reship Electronic Newsletter Vol. 9

We will contribute to your company's SDGs! Through parts procurement, we are striving to promote green procurement and the purchase of generic parts!

This document introduces our company's efforts toward the SDGs. It includes information on the use of Pb-free (lead-free) solder and N2 (nitrogen) in "component mounting," "component procurement," and "compliance with the RoHS directive." We contribute to your company's SDGs. Please take a moment to read it. 【Contents (partial)】 ■ Our company's efforts toward the SDGs ■ Component procurement ■ Component mounting ■ Packaging ■ Compliance with the RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

Company：レシップ電子
Price：Other

Circuit board design and manufacturing
Other packaging materials
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Hiraguri Co., Ltd. Business Introduction

Demonstrating strengths in the integrated manufacturing of semiconductor manufacturing and control devices, medical equipment, and electronic devices across multiple fields!

Hiraguri Co., Ltd. provides printed circuit boards, units, and cable assemblies for cutting-edge semiconductor manufacturing equipment and heavy electrical machinery. Various certified technicians carry out the production of high-quality and reliable products based on the "Reliability Improvement Movement." 【Business Activities】 ■ Manufacturing and providing printed circuit boards and power supply units ■ Manufacturing and providing cable assemblies ■ Manufacturing and providing control units, wires, and harnesses *For more details, please refer to the PDF document or feel free to contact us.

Company：有限会社平栗
Price：Other

cable
Circuit board design and manufacturing
controller
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Thick film technology, research, cooperation

We will perform pattern printing on ceramic substrates using thick film printing.

Hayashi Repic Co., Ltd. manufactures substrates using thick film technology. We cater to high heat-resistant and high heat-dissipating electronic circuit substrates such as ceramic substrates. Thick film printing technology has no limitations on the printed materials and challenges various materials and applications. We accept small-scale prototypes and custom items. 【Related Products】 ○ Thick film circuits ○ Heaters ○ Radiation detectors ○ Sensors For more details, please contact us or download the catalog.

Company：ハヤシレピック第３事業部
Price：10,000 yen-100,000 yen

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TAB flexible substrate

Support for a variety of flexible substrates from prototyping to mass production using the REEL to REEL method.

● Mass production of RtoR flexible substrates is possible. ● All processing equipment is installed in a Class 1,000 cleanroom. ● A coverlay method is adopted for surface protection of flexible substrates. ● We have electroplating equipment for Ni (nickel)/Au (gold) and can provide specifications tailored to customer needs. ● Inner lead structures can be formed for connection points. ● All products are quality assured through automatic visual inspection and electrical testing. ● We possess a variety of analytical equipment for quality verification and measurement/length measurement at each process. ● We provide flexible substrates compliant with RoHS directives and made from flame-retardant materials equivalent to 94VTM-0.

Company：キヤノン・コンポーネンツ電子回路事業部
Price：Other

Printed Circuit Board
Other electronic parts
Dedicated IC
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Kamei Electric - Completed Printed Circuit Board Group

Thorough quality assurance

It is created by well-equipped facilities and people capable of a consistent production system.

Company：加美電機
Price：Other

Printed Circuit Board
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Medical Development Support: Flexible Substrates, FPC, Flexible Boards

We manufacture, sell, and support medical devices for basic research. FPC

- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Printed Circuit Board
Contract manufacturing
substrate

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[PCB Design and Product Design] FPC and Flexible Circuit Boards

We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC

- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Flying lead flexible printed circuit board (FPC/flexible circuit board)

It is a flexible substrate that allows for a highly reliable connection.

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Long-length flexible printed circuit board (FPC)

This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.

Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.

Company：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
Price：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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ABL's 'Manufacturing and Sales of Electronic Devices'

We respond to product development, manufacturing, inspection, and shipping in all fields with short lead times.

Our company conducts product development, manufacturing, inspection, and shipping across various fields with a short delivery time through collaboration in development, implementation, processing, and assembly. As the number of engineers decreases, we respond to a wide range of manufacturing needs, including circuit board wiring and modifications, with reliable technology. Additionally, we offer proposals tailored to customer needs for resin parts that support the casing, which pertains to the appearance of industrial products, as well as electronic components. We can also accommodate wireless measurement and wire bonding, so please feel free to consult with us. 【Service Offerings】 ■ Universal circuit board wiring and assembly ■ Case design, engineering, and manufacturing ■ Wireless measurement systems and wire bonding ■ Sales of various conversion boards *For more details, please refer to the PDF document or feel free to contact us.

Company：エービーエル
Price：Other

Embedded system design service
Contract manufacturing
Semiconductor inspection/test equipment
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLG-0150'

The maximum operating pressure is 1200 bar (17500 psi)! Introducing our evaluation kit.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLG-0150'. The maximum flow rate is 8 ml/min (water-based). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Our sensor solutions are used in a wide range of applications and markets. Please feel free to contact us when you need assistance. 【Included Items】 ■ SLG-0150 × 1 ■ SCC1-USB Sensor Cable × 1 ■ SCC1-Analog Sensor Cable × 1 ■ Basic Fitting Set ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Evaluation Board
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Particle Matter Sensor Evaluation Kit 'SEK-SPS30'

Compact, ultra-thin package! Includes SPS30 and UART-USB adapter cable.

We would like to introduce our particle matter sensor evaluation kit, 'SEK-SPS30'. It offers advanced particle size binning provided through calibrated digital output. In addition to its unique long-term stability due to contamination resistance, it comes in a compact, ultra-thin package. 【Included Items】 ■SPS30×1 ■UART-USB adapter cable (2m long)×1 *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Other Sensors
Evaluation Board
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Liquid Flow Sensor Evaluation Kit 'EK-SLI-1000'

IP65 waterproof and dust resistant! Maximum flow rate is 1ml/min (aqueous) and 10ml/min (hydrocarbon).

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLI-1000'. It features IP65 waterproof and dust resistance, with a maximum flow rate of 1ml/min (aqueous) and 10ml/min (hydrocarbon). The interfaces (connectors) available are RS485, I2C, USB, or analog (4-pin M8). Please feel free to contact us if you have any inquiries. 【Included Items】 ■ SLI-1000 ×1 ■ SCC1-USB sensor cable ×1 ■ SCC1-Analog sensor cable ×1 ■ Basic fitting set ■ Quick start guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
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Liquid Flow Sensor Evaluation Kit 'EK-LD20-2600B'

The interface (connector) is I2C! Maximum flow rate 1000ml/h (aqueous), bamboo joint.

We would like to introduce our liquid flow sensor evaluation kit, 'EK-LD20-2600B'. It is a disposable biomedical product with a maximum flow rate of 1000 ml/h (aqueous) and a bamboo shoot connector. The interface (connector) is I2C, and an SCC1-USB sensor cable is required separately. 【Included Items】 ■ LD20-2600B ×3 ■ Base Station ×3 ■ Quick Start Guide *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
substrate

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Liquid Flow Sensor Evaluation Kit 'EK-SLF3C-1300F'

Fluid control and system reliability are achieved, leading to a dramatic improvement in performance and end-user satisfaction!

We would like to introduce our liquid flow sensor evaluation kit, 'EK-SLF3C-1300F'. The "SLF3S-1300F" combines our long-standing excellent track record in low flow and minimum flow sensing with a thoroughly optimized mechanical design, elevating its already well-established functionality to a higher level in terms of price-to-performance ratio. This sensor provides the highest level of safety, stability, and long-term reliability across a wide range of fields, including diagnostics, analytical equipment, and life sciences. 【Features of SLF3S-1300F】 ■ Optimizes costs by simplifying design based on CMOSens Technology without sacrificing fluid, electrical, or mechanical connections. ■ Offers outstanding chemical resistance and excellent media compatibility. ■ Monitors the operation of the entire system and detects common failure modes. *For more details, please download the PDF or feel free to contact us.

Company：センシリオン
Price：Other

Flow Sensor
Evaluation Board
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Ain Corporation "Business Introduction"

Leave it to us for heat management substrates and high-frequency wiring boards!

Ain Corporation is a company primarily engaged in the sale of printed circuit boards, ceramic inks, and chemical industrial products. We provide a consistent product development process from design to production. We handle a wide range of high-performance substrates, such as "ceramics" and "VCM," which achieve excellent through-hole performance and bonding strength with low resistance values. 【Business Activities】 ■ Design, manufacturing, and sales of printed circuit boards ■ Manufacturing and sales of information control devices ■ Manufacturing, sales, and rental of printed circuit board manufacturing machinery and equipment ■ Sales of chemical industrial products *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

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Metal base wiring board

High thermal conductivity and low thermal expansion base wiring board! Custom specifications can also be discussed.

The "metal base wiring board" is a high thermal conductivity wiring board that accommodates everything from standard aluminum base boards to copper base boards and custom specifications. We have various stock of aluminum and copper bases in a laminated structure, allowing for short delivery times. Additionally, we can accommodate special specifications (structure and materials) as per your requests. 【Features】 ■ High thermal conductivity ■ Short delivery times available ■ Special specifications can also be discussed *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

Other semiconductors
Printed Circuit Board
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Printed Circuit Board Assembly

We accept orders regardless of quantity! Comprehensive support from design to implementation of printed circuit boards!

We can accept component mounting on printed circuit boards regardless of quantity. We offer a consistent response from design and manufacturing of printed circuit boards to component procurement and component mounting. (Some processes are outsourced.) We can also respond to requests for assembly, adjustment, and inspection, so please feel free to consult with us. 【Features】 ■ Integrated system from design and manufacturing to component procurement and component mounting *For more details, please download the PDF or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
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AMB substrate

High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.

The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) 　　　　Aluminum nitride (AlN) 　　　　Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
substrate

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Thick copper wiring board

A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.

The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
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UV LED, power LED, thermal management substrate for LD *Implementation example materials will be provided.

Heat countermeasures, from proposal and design of metal-based special substrates to implementation, all in one go. Introducing our track record of adoption!

When designing modules that use high-power optical semiconductors, such as UV LEDs, a suitable wiring board for implementation is necessary. Our company proposes appropriate wiring boards considering various materials and structures for each requirement. We can also handle the design and manufacturing of wiring boards, as well as the modularization (implementation). ★ You can view detailed materials summarizing photos, structural diagrams, cross-sections, and achievements of "Thermal Countermeasures and Wiring Boards" from the "PDF Download." 【Contents】 ■ DPC Boards (Boards using plating methods) Comparison with thick film and thin film methods is also explained. ■ Copper Base Wiring Boards with Posts (High Thermal Conductivity Wiring Boards) Directly conducts heat from heat-generating components to the base material. ■ Metal Base Wiring Boards (High Thermal Conductivity Wiring Boards) Supports everything from standard aluminum base boards to copper base and custom specifications. ■ Ultraviolet High Reflective Film A film that can be applied to the surfaces of ceramics and metals, excellent in insulation, heat resistance, and ultraviolet resistance, reflecting even in the ultraviolet range. ■ Overview of EMS Services ■ List of Equipment from Partner Companies for Implementation

Company：アイン本社工場
Price：Other

Circuit board design and manufacturing
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Design, manufacturing, and sales of high-frequency substrates *Flexible response to special processing as well.

Compatible with various materials including fluororesin circuit boards, alumina, and high dielectric ceramics.

Our company designs, manufactures, and sells "high-frequency substrates" using various high-frequency substrate materials, tailored to performance, cost, and delivery time. The materials include fluoropolymer materials and ceramics such as alumina and aluminum nitride. We can also provide laminated substrates combining fluoropolymer substrates with standard FR-4 substrates, as well as copper-based fluoropolymer substrates with higher thermal conductivity. Additionally, we are flexible in accommodating special processing (treatments) such as "cavity structure formation," "counterbore and irregular router processing," "through-hole filling processing," and "electroplating, electroless plating." 【Examples of Achievements】 ■ Substrates for VSAT BUC and LNB (microwave) ■ Substrates for millimeter-wave radar and antennas ■ Substrates for Doppler sensors ■ Substrates for high-frequency power amplifiers ■ Optical transmission/reception units (TOSA/ROSA) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：アイン本社工場
Price：Other

Circuit board design and manufacturing
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Metal core printed circuit board

We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!

The "Metal Core Wiring Board" is a double-sided high thermal conductivity wiring board that uses metal as the core material. It supports high thermal conductive materials up to 10 W/m·K and low elastic materials (to reduce solder cracking), as well as "special insulation layers," "multilayer," "special processing," and "special materials." 【Specifications】 ■ Aluminum Core Wiring Board Insulation Layer - Thermal Conductivity: 5.0 W/m·K - Thickness: 120 μm - Young's Modulus: 33 GPa - Copper Plate Thickness: (0.2～) 0.5/1.0/1.5/2.0(～3.0) mm - Foil Thickness: 35/70(～200) μm *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Printed Circuit Board
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Design and manufacturing of high-frequency substrates capable of heat management.

For applications requiring heat dissipation measures and heat resistance. Compatible with various materials such as copper and ceramics.

Our company specializes in the design and manufacturing of high-frequency substrates that meet various needs such as "high thermal conductivity," "high strength," and "miniaturization." In applications where heat dissipation measures are particularly required, such as high-speed wireless communication, we can design to conduct heat from heat-generating components to copper-based substrates via through-holes rather than through insulation layers. [Proposal Examples] ■ High thermal conductivity 　→ Copper-based fluoropolymer substrates ■ Low loss & high thermal conductivity 　→ DPC substrates (ceramic wiring substrates using plating methods) ■ Miniaturization (RF section, control section separation) 　→ Bonding of fluoropolymer substrates and FR-4 substrates *For more details, please refer to the materials. Feel free to contact us with any inquiries.

Company：アイン本社工場
Price：Other

Circuit board design and manufacturing
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Technical materials are being presented! Gain knowledge! 'AMB PCB Design Rules'

Essential for acquiring knowledge in substrate design! Clearly presented with diagrams and tables, including ceramic types and thickness, product flatness (warpage), and pattern dimension accuracy!

This document introduces the AMB substrate design rules. It clearly presents information on ceramic types and thicknesses, layer composition, work sizes, product sizes, and prohibited areas for patterns on the product's outer perimeter, along with diagrams and tables. We encourage you to read it. 【Contents (excerpt)】 ■ Ceramic types and thicknesses ■ Copper thickness ■ Layer composition ■ Work sizes and product sizes ■ Product outer dimension tolerances ■ Prohibited areas for patterns on the product's outer perimeter *For more details, please refer to the PDF document or feel free to contact us.

Company：アイン本社工場
Price：Other

Circuit board design and manufacturing
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Quartz glass optical substrate

Ultra-thin, high transmittance, very transparent quartz glass optical substrate.

Quartz glass optical substrate Wafer: Maximum 6 Inch diameter 300mm, thickness: 0.5mm and above Square: Within 300*300mm, thickness: 0.5mm and above Flatness: 0.01mm We will challenge at a low cost.

Company：ルータ
Price：Less than 10,000 yen

Glass
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InP Based Epi Wafer

We provide custom structure MBE/MOCVD epitaxial growth on compound semiconductor epitaxial InP substrates.

We provide custom structure MOCVD epitaxial growth on InP substrates ranging from 2 inches to 4 inches. We offer comprehensive services for InP epitaxial substrates to companies, universities, and scientific research institutions, including epitaxial structure design, epitaxial materials, and testing analysis.

Company：GLORY 東京営業所
Price：Other

Wafer
substrate

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[Example] Module production using a small CMOS image sensor

Soldering a separate board to a CMOS-equipped board! A successful example of achieving special product specifications.

We would like to introduce a case study on module production using a small CMOS image sensor. The customer had the challenge of wanting to fit a very small image sensor into a space of □1.5mm and a length of 5mm or less, aiming for device miniaturization. Since bending the module can easily cause cracks, the CMOS mounting section and the ceramic capacitor mounting section were placed on separate substrates and later soldered together. This approach allowed for a reduction in size compared to previous models while also achieving strength at the joint, significantly reducing the occurrence of cracks at the joints. 【Case Overview】 ■ Mounting Method: Soldering ■ Substrate Size ・Φ1.35mm×0.2mm ・2mm×1mm×0.2mm ■ Substrate Material: Glass epoxy substrate ■ Lot Size: 5 to 10 units *For more details, please refer to the PDF document or feel free to contact us.

Company：イデアシステム
Price：Other

Other electronic parts
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[Case Study] Improvement of Heat Dissipation and Bonding Strength of Substrates by Reducing Voids

Mounting the chip while scrubbing during solder melting! Examples of increased bonding strength and thermal conductivity.

We would like to introduce a case study on improving the heat dissipation and bonding strength of substrates through void reduction. To efficiently transfer the temperature during chip operation, we received an inquiry about using a high thermal conductivity material for the bonding between the plate and the base plate. By using a high thermal conductivity adhesive sheet, we improved the thermal conductivity. Additionally, by scrubbing the chip during solder melting, we successfully reduced the voids that were present inside the solder during the initial melting. 【Case Overview】 ■ Mounting Method: Flip Chip Mounting ■ Substrate Size: Plate 25mm x 25mm x 3mm, Base Plate 40mm x 40mm x 3mm ■ Substrate Material: Both the plate and base plate are aluminum (with Ni plating treatment on the entire surface) ■ Lot Quantity: A few pieces (for sampling) ■ Delivery Time: 1.5 months including preliminary evaluation *For more details, please refer to the PDF document or feel free to contact us.

Company：イデアシステム
Price：Other

Circuit board design and manufacturing
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Board material Miramat

Free samples available! This product is made from polyethylene as the raw material.

F Package flexibly responds to changes in the environment, aims for harmony with society, and works on creating rich communities. Please feel free to consult us regarding the design, processing, and sales of packaging materials, package production, cutting, etc. Additionally, we can also cut materials such as urethane foam and expanded polystyrene. Miramat is a product made from polyethylene as the raw material.

Company：エフ・パッケージ
Price：Other

Cushioning material
substrate

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substrate Product List and Ranking from 577 Manufacturers, Suppliers and Companies | IPROS GMS

substrate Manufacturer, Suppliers and Company Rankings

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